Abstract: Power modules with reduced parasitic inductances are provided. A power module includes a first substrate including a first electrically-conductive layer and a second substrate including a second electrically-conductive layer. These substrates may be stacked on each other. A scalable network of power switches may be arranged on the substrates. Power bars may be connectable to the electrically-conductive layers through electromechanical interfaces at selectable interface locations. The locations and/or type of interface may be selectable based on the arrangement of the switches. The first and second electrically-conductive layers may be disposed on mutually opposed surfaces of a dielectric layer having a thickness chosen to effect a level of coupling between respective source and return current paths provided by the electrically-conductive layers.

Abstract: A multiport AC link converter includes a resonant AC link, an input port, an output port, and a plurality of switches. A first subset of the switches is between the input port the resonant link and a second subset of the switches is between the resonant link and the output port. The switch sequencing for the input port is selected and executed independently of the switch sequencing for the output port the switch sequencings for the output port is selected and executed independently of that for the input port.

Abstract: Power modules with reduced parasitic inductances are provided. A power module includes a first substrate including a first electrically-conductive layer and a second substrate including a second electrically-conductive layer. These substrates may be stacked on each other. A scalable network of power switches may be arranged on the substrates. Power bars may be connectable to the electrically-conductive layers through electromechanical interfaces at selectable interface locations. The locations and/or type of interface may be selectable based on the arrangement of the switches. The first and second electrically-conductive layers may be disposed on mutually opposed surfaces of a dielectric layer having a thickness chosen to effect a level of coupling between respective source and return current paths provided by the electrically-conductive layers.

Abstract: Electrostatic discharge (ESD) protection circuits for self-protecting cascode stages are disclosed. In one example, an ESD protection circuit is described. A cascode stage is configured to selectively couple an output pad to a reference terminal. An ESD sensor may detect a change in voltage indicative of an ESD event occurring at the output pad, causing a gate drive to turn on the cascode stage to conduct ESD current in response to detection of the ESD event at the output pad. A leakage blocker is also included to prevent leakage current from the cascode stage to the gate drive while there is not an ESD event.

Abstract: Electrostatic discharge (ESD) protection circuits for self-protecting cascode stages are disclosed. In one example, an ESD protection circuit is described. A cascode stage is configured to selectively couple an output pad to a reference terminal. An ESD sensor may detect a change in voltage indicative of an ESD event occurring at the output pad, causing a gate drive to turn on the cascode stage to conduct ESD current in response to detection of the ESD event at the output pad. A leakage blocker is also included to prevent leakage current from the cascode stage to the gate drive while there is not an ESD event.