Patents by Inventor Gregory George

Gregory George has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11692581
    Abstract: A first example box nut retainer includes a support, a fastener sleeve, and a wing. The fastener sleeve defines an opening and extends downwardly from the support. The wing extends from the support and has a top corner between the support and the fastener sleeve.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: July 4, 2023
    Assignee: ILLINOIS TOOL WORKS INC.
    Inventor: Gregory George Buczynski
  • Publication number: 20230200043
    Abstract: Embodiments herein describe techniques for a semiconductor device including a substrate, a first inter-level dielectric (ILD) layer above the substrate, and a second ILD layer above the first ILD layer. A first capacitor and a second capacitor are formed within the first ILD layer and the second ILD layer. A first top plate of the first capacitor and a second top plate of the second capacitor are formed at a boundary between the first ILD layer and the second ILD layer. The first capacitor and the second capacitor are separated by a dielectric area in the first ILD layer. The dielectric area includes a first dielectric area that is coplanar with the first top plate or the second top plate, and a second dielectric area above the first dielectric area and to separate the first top plate and the second top plate. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: February 14, 2023
    Publication date: June 22, 2023
    Inventors: Travis W. LAJOIE, Abhishek A. SHARMA, Van H. LE, Chieh-Jen KU, Pei-Hua WANG, Jack T. KAVALIEROS, Bernhard SELL, Tahir GHANI, Gregory GEORGE, Akash GARG, Julie ROLLINS, Allen B. GARDINER, Shem OGADHOH, Juan G. ALZATE VINASCO, Umut ARSLAN, Fatih HAMZAOGLU, Nikhil MEHTA, Yu-Wen HUANG, Shu ZHOU
  • Patent number: 11652047
    Abstract: Embodiments herein describe techniques for a semiconductor device having an interconnect structure including an inter-level dielectric (ILD) layer between a first layer and a second layer of the interconnect structure. The interconnect structure further includes a separation layer within the ILD layer. The ILD layer includes a first area with a first height to extend from a first surface of the ILD layer to a second surface of the ILD layer. The ILD layer further includes a second area with a second height to extend from the first surface of the ILD layer to a surface of the separation layer, where the first height is larger than the second height. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: May 16, 2023
    Assignee: Intel Corporation
    Inventors: Travis W. Lajoie, Abhishek A. Sharma, Van H. Le, Chieh-Jen Ku, Pei-Hua Wang, Jack T. Kavalieros, Bernhard Sell, Tahir Ghani, Gregory George, Akash Garg, Julie Rollins, Allen B. Gardiner, Shem Ogadhoh, Juan G. Alzate Vinasco, Umut Arslan, Fatih Hamzaoglu, Nikhil Mehta, Ting Chen, Vinaykumar V. Hadagali
  • Patent number: 11651983
    Abstract: An industrial-scale apparatus, system, and method for handling precisely aligned and centered semiconductor wafer pairs for wafer-to-wafer aligning and bonding applications includes an end effector having a frame member and a floating carrier connected to the frame member with a gap formed therebetween, wherein the floating carrier has a semi-circular interior perimeter. The centered semiconductor wafer pairs are positionable within a processing system using the end effector under robotic control. The centered semiconductor wafer pairs are bonded together without the presence of the end effector in the bonding device.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: May 16, 2023
    Assignee: SUSS MICROTEC LITHOGRAPHY GMBH
    Inventors: Hale Johnson, Gregory George
  • Publication number: 20230113707
    Abstract: Disclosed are devices, systems, methods, and computer program products for managing the development and treatment supply chain in delivering personalized medicine therapies. In some aspects, a unified configuration system (UCS) for an enterprise software platform is described that enables and facilitates individual stakeholders of the personalized medicine development and treatment supply chain to create and manage independent configurations of their supply chain management software for an enterprise software platform.
    Type: Application
    Filed: March 29, 2022
    Publication date: April 13, 2023
    Inventors: Jeremy Alan Dunn, Cathy Han, Gregory George Jagiello, Andrew Redoble, Ryan Jeffrey Southwick, Dan Zhang, Elizabeth Miriam Jones, Armaan Rai
  • Patent number: 11615874
    Abstract: Disclosed are devices, systems, methods, and computer program products for managing the development and treatment supply chain in delivering personalized medicine therapies. In some aspects, a unified configuration system (UCS) for an enterprise software platform is described that enables and facilitates individual stakeholders of the personalized medicine development and treatment supply chain to create and manage independent configurations of their supply chain management software for an enterprise software platform.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: March 28, 2023
    Assignee: VINETI INC.
    Inventors: Jeremy Alan Dunn, Cathy Han, Gregory George Jagiello, Andrew Redoble, Ryan Jeffrey Southwick, Dan Zhang, Elizabeth Miriam Jones, Armaan Rai
  • Patent number: 11610894
    Abstract: Embodiments herein describe techniques for a semiconductor device including a substrate, a first inter-level dielectric (ILD) layer above the substrate, and a second ILD layer above the first ILD layer. A first capacitor and a second capacitor are formed within the first ILD layer and the second ILD layer. A first top plate of the first capacitor and a second top plate of the second capacitor are formed at a boundary between the first ILD layer and the second ILD layer. The first capacitor and the second capacitor are separated by a dielectric area in the first ILD layer. The dielectric area includes a first dielectric area that is coplanar with the first top plate or the second top plate, and a second dielectric area above the first dielectric area and to separate the first top plate and the second top plate. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: March 21, 2023
    Assignee: Intel Corporation
    Inventors: Travis W. Lajoie, Abhishek A. Sharma, Van H. Le, Chieh-Jen Ku, Pei-Hua Wang, Jack T. Kavalieros, Bernhard Sell, Tahir Ghani, Gregory George, Akash Garg, Julie Rollins, Allen B. Gardiner, Shem Ogadhoh, Juan G. Alzate Vinasco, Umut Arslan, Fatih Hamzaoglu, Nikhil Mehta, Yu-Wen Huang, Shu Zhou
  • Patent number: 11593892
    Abstract: Improved technological solutions are introduced for providing a secure and effective and enhanced clustering/grouping solution that is useful, for example, in an online dating forum as well as any number of other industries. The ability to attend live events in person or remotely is coupled with presence location and automatic verification of user devices and identities. This allows secured communication between participants without having to disclose actual contact information of the participants or their device addresses. An improved algorithm that groups members/items effectively based on a variety of matching criteria, with lowered possibilities of errors and more efficient use of processing power, is now introduced.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: February 28, 2023
    Inventors: Kenneth Page-Romer, Gregory George Page-Romer
  • Publication number: 20220411454
    Abstract: Described herein are devices and methods for the efficient and economic generation of lignin monomers from biomass. The provided devices and methods utilize reductive catalytic fractionation with an organic solvent to extract high-quality lignin from biomass and cleave specific lignin bonds to generate valuable lignin monomers with a relatively narrow product slate. Advantageously, the devices and methods described herein utilize solvent recycling, multiple solvolysis chambers with multiple biomass beds and/or physical agitation (e.g., use of a screw extruder) to reduce the amount of solvent required and increase economic efficiency and monomer yield.
    Type: Application
    Filed: June 16, 2022
    Publication date: December 29, 2022
    Inventors: Jacob S. KRUGER, Gregg Tyler BECKHAM, David Gregory BRANDNER, Andrew Wolf BARTLING, Yuriy ROMÁN, Jun Hee JANG, Nicholas Earl Thornburg, Gregory George Facas
  • Patent number: 11537278
    Abstract: The technology herein involves accessing content of an electronic document and a shared layout for the electronic document, wherein the shared layout provides a layout for user devices having different dimensions of display areas; rendering the content of the electronic document onto a primary rendering surface and a secondary rendering surface, wherein the primary rendering surface is associated with a native platform of a user device and the secondary rendering surface is associated with the shared layout of a server; applying operation commands to modify the primary rendering surface, the operation commands resulting from a user interaction with the electronic document; merging the operation commands into a merged operation call; and invoking the merged operation call to modify the secondary rendering surface, wherein the merged operation call reduces a number of operation calls that modify the secondary rendering surface and is shared with the server to modify the shared layout.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: December 27, 2022
    Assignee: Google LLC
    Inventors: Haluk Burcin Tunali, Luiz do Amaral de Franca Pereira Filho, Etan Bukiet, Behnoosh Hariri, Norbert Zsolt Kenderesi, Igor Kopylov, Matthew Jay Isison, Kevin Winter, Olga Sergeyevna Saviano, Gregory George Galante, Mathieu Turcotte, Jacob Robert Voytko, Leeran Raphaely
  • Patent number: 11400871
    Abstract: A retention clip is configured to securely connect a first component to a second component. The retention clip includes a first frame connected to an opposed second frame by a central beam. An interior of the clip is defined between the first and second frames. Each of the first and second frames includes lateral legs that fold inwardly at upper bends, thereby forming flanges that are disposed within the interior. The flanges on respective sides of the clip are integrally connected by a bridging member, and the flanges further include distal ends that extend below a bottom edge of the bridging member. The clip further includes a flexible wing for securing the clip within the interior of a panel opening. Some embodiments of a retention clip include protrusions that extend inwardly from the bridging members.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: August 2, 2022
    Assignee: Illinois Tool Works Inc.
    Inventor: Gregory George Buczynski
  • Publication number: 20220015381
    Abstract: The present disclosure relates to methods and systems for concentrating a solids stream recovered from one or more process streams derived from a beer in a biorefinery by exposing the recovered solids stream to an evaporator system to remove moisture therefrom and form a concentrated, recovered solids stream.
    Type: Application
    Filed: July 9, 2021
    Publication date: January 20, 2022
    Inventors: Matthew J. Rindsig, Neil D. Anderson, Rodney Duane Pierson, David D. Bushong, Jacob A. Milbrandt, Gregory George Fix
  • Patent number: 11199216
    Abstract: A box nut retainer system includes a panel configured to receive a fastener. The box nut retainer system includes a plurality of retainer legs extending from the panel. The box nut retainer system includes planar bends positioned at distal ends of the plurality of retainer legs. Straight beams extend from the planar bends. The straight beams have engagement angles relative to the plurality of retainer legs.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: December 14, 2021
    Assignee: Illinois Tool Works Inc.
    Inventor: Gregory George Buczynski
  • Patent number: 11183401
    Abstract: An industrial-scale system and method for handling precisely aligned and centered semiconductor substrate (e.g., wafer) pairs for substrate-to-substrate (e.g., wafer-to-wafer) aligning and bonding applications is provided. Some embodiments include an aligned substrate transport device having a frame member and a spacer assembly. The centered semiconductor substrate pairs may be positioned within a processing system using the aligned substrate transport device, optionally under robotic control. The centered semiconductor substrate pairs may be bonded together without the presence of the aligned substrate transport device in the bonding device. The bonding device may include a second spacer assembly which operates in concert with that of the aligned substrate transport device to perform a spacer hand-off between the substrates. A pin apparatus may be used to stake the substrates during the hand-off.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: November 23, 2021
    Assignee: SUSS MICROTEC LITHOGRAPHY GMBH
    Inventors: Hale Johnson, Gregory George, Aaron Loomis
  • Patent number: 11113043
    Abstract: A system for code development and execution includes a client interface and a client processor. The client interface is configured to receive user code for execution and receive an indication of a server that will perform the execution. The client processor is configured to parse the user code to identify one or more data items referred to during the execution. The client processor is also configured to provide the server with an inquiry for metadata regarding the one or more data items, receive the metadata regarding the one or more data items, determine a logical plan based at least in part on the metadata regarding the one or more data items; and provide the logical plan to the server for execution.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: September 7, 2021
    Assignee: Databricks Inc.
    Inventors: Srinath Shankar, Eric Keng-Hao Liang, Gregory George Owen
  • Patent number: 11097645
    Abstract: A tie down assembly includes a clasp, a ring that is rotatably coupled to the clasp, and a support coupler that is coupled to the ring. The support coupler frictionally controls rotation of the ring with respect to the clasp.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: August 24, 2021
    Assignee: Illinois Tool Works Inc.
    Inventors: Gregory George Buczynski, Zhilin Li
  • Publication number: 20210247891
    Abstract: The technology herein involves accessing content of an electronic document and a shared layout for the electronic document, wherein the shared layout provides a layout for user devices having different dimensions of display areas; rendering the content of the electronic document onto a primary rendering surface and a secondary rendering surface, wherein the primary rendering surface is associated with a native platform of a user device and the secondary rendering surface is associated with the shared layout of a server; applying operation commands to modify the primary rendering surface, the operation commands resulting from a user interaction with the electronic document; merging the operation commands into a merged operation call; and invoking the merged operation call to modify the secondary rendering surface, wherein the merged operation call reduces a number of operation calls that modify the secondary rendering surface and is shared with the server to modify the shared layout.
    Type: Application
    Filed: April 26, 2021
    Publication date: August 12, 2021
    Inventors: Haluk Tunali, Luiz do Amaral de Franca Pereira Filho, Etan Bukiet, Behnoosh Hariri, Norbert Zsolt Kenderesi, Igor Kopylov, Matthew Jay Isison, Kevin Winter, Olga Sergeyevna Saviano, Gregory George Galante, Mathieu Turcotte, Jacob Robert Voytko, Leeran Raphaely
  • Patent number: D934063
    Type: Grant
    Filed: January 20, 2020
    Date of Patent: October 26, 2021
    Assignee: Illinois Tool Works Inc.
    Inventor: Gregory George Buczynski
  • Patent number: D953522
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: May 31, 2022
    Assignee: CILAG GMBH INTERNATIONAL
    Inventor: Gregory George Scott
  • Patent number: D995278
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: August 15, 2023
    Assignee: Illinois Tool Works Inc.
    Inventor: Gregory George Buczynski