Abstract: Jumper constructions for an integrated lead flexure for a disk drive head suspension include a conductive base layer, an insulating layer over the base layer, a plurality of traces arranged on the insulating layer, and an isolated conductor layer arranged under the insulating layer. The plurality of traces include a first trace and a second trace and the isolated conductor layer is electrically isolated from the conductive base layer and electrically connects the first and second traces.

Abstract: An integrated lead head suspension flexure including a plurality of integrated leads each including at least one lead portion unbacked by the flexure spring metal layer and configured to be substantially inline with the general plane of the spring metal layer. The leads are disposed on a dielectric layer including an unbacked dielectric layer portion having a surface positioned between the major surfaces of the spring metal layer.

Abstract: Jumper constructions for an integrated lead flexure for a disk drive head suspension include a conductive base layer, an insulating layer over the base layer, a plurality of traces arranged on the insulating layer, and an isolated conductor layer arranged under the insulating layer. The plurality of traces include a first trace and a second trace and the isolated conductor layer is electrically isolated from the conductive base layer and electrically connects the first and second traces.

Abstract: An integrated lead head suspension flexure includes a mounting region, a gimbal extending distally from the mounting region and having bond pads, and a tail extending proximally from the mounting region and having terminal pads. First trace sections having a first structural configuration, such as interleaved traces, are electrically connected to the terminal pads and extend across the tail and mounting region. Second trace sections having a second structural configuration different than the first structural configuration, such as ground plane traces, are electrically connected to the bond pads and extend across the gimbal. Transition structures electrically connect the first trace sections to the second trace sections. The first and second trace sections impedance match the different impedances at the bond pads and terminal pads.