Abstract: An analytical substrate for amplifying Raman signals by a factor greater than 10,000, or by a factor less than 1,000,000. The analytical substrate is fabricated by depositing a film on the substrate and heating the substrate to a temperature less than 100 degrees Celsius for a period of time less than 30 seconds. The film can comprise a metallic nanoparticle dispersion that can further comprise a population of metallic nanoparticles. In some instances, the metallic nanoparticles have an average cross-sectional dimension in a range of about 1 nm to about 100 nm. In other instances each nanoparticle comprises at least one ligand bound to a surface of the nanoparticle, where the ligand comprises a heteroatom head group bound to the nanoparticle surface and a tail bound to the heteroatom head group.

Abstract: An analytical substrate for amplifying Raman signals by a factor greater than 10,000, or by a factor less than 1,000,000. The analytical substrate is fabricated by depositing a film on the substrate and heating the substrate to a temperature less than 100 degrees Celsius for a period of time less than 30 seconds. The film can comprise a metallic nanoparticle dispersion that can further comprise a population of metallic nanoparticles. In some instances, the metallic nanoparticles have an average cross-sectional dimension in a range of about 1 nm to about 100 nm. In other instances each nanoparticle comprises at least one ligand bound to a surface of the nanoparticle, where the ligand comprises a heteroatom head group bound to the nanoparticle surface and a tail bound to the heteroatom head group.

Abstract: A metallic nanoparticle shielding structure derived from a substrate having metallic nanoparticles deposited thereon in either a pattern or a coating. The pattern can comprise one or more marks that have a width of 20 to 40 micrometers and that can overlap one another. The metallic nanoparticles can be heated at a temperature less than 110 degrees Celsius for a period of time less than 90 seconds. In some embodiments, the metallic nanoparticle shielding structure can be applied to liquid crystal displays, polyester substrates, polycarbonate substrates, or any other suitable substrate.

Abstract: Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include adhesion promoting additives for providing improved adhesion of the compositions to various substrates.

Abstract: Disclosed are compositions comprising metallic nanoparticles suitable for use in cohesive, highly conductive structures on substrates. Also disclosed are methods for synthesizing the compositions and methods for forming cohesive, highly conductive structures from the compositions.

Abstract: A method for managing IO requests from a virtual machine to access IO resources on a physical machine includes determining a request priority associated with an IO request. The IO request is placed in an appropriate queue in response to determining the request priority.