Abstract: A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating. The resulting product is thus able to provide extremely narrow conductive circuitry for subsequent connections, e.g., to a semiconductor chip. Electroless plating is the preferred plating method with the dielectric immersed in a solution of conductive monomers, e.g., pyrrole monomer, the solution also possibly containing a seed material such as palladium-tin.

Abstract: A structure. The structure includes a stack of two or more sheets. Successive sheets in each pair of successive sheets of the stack are adhesively coupled to each other by an adhesive layer consisting of a removable adhesive that is removable if heated to an elevated temperature at which the removable adhesive melts. The removable adhesive is also disposed on top and bottom surfaces of the stack. The removable adhesive consists of a liquid while adhesively coupling the successive sheets to each other. A first surface of a first layer coupled with the removable adhesive to a first surface of the stack. A first surface of a second layer is coupled with the removable adhesive to a second surface of the stack. The first and second layers are adapted to prevent burr formation in a hole subsequently drilled through the stack.

Abstract: A laminate circuit structure assembly is provided that comprises at least two modularized circuitized voltage plane subassemblies; optionally an interposer located between each of the subassemblies, and wherein the subassemblies and interposer, if present, are bonded together with a cured dielectric coating. The interposer comprises dielectric layers disposed about an internal electrically conductive layer.

Abstract: A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating. The resulting product is thus able to provide extremely narrow conductive circuitry for subsequent connections, e.g., to a semiconductor chip. Electroless plating is the preferred plating method with the dielectric immersed in a solution of conductive monomers, e.g., pyrrole monomer, the solution also possibly containing a seed material such as palladium-tin.

Abstract: A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating. The resulting product is thus able to provide extremely narrow conductive circuitry for subsequent connections, e.g., to a semiconductor chip. Electroless plating is the preferred plating method with the dielectric immersed in a solution of conductive monomers, e.g., pyrrole monomer, the solution also possibly containing a seed material such as palladium-tin.

Abstract: A laminate circuit structure assembly is provided that comprises at least two modularized circuitized voltage plane subassemblies; optionally an interposer located between each of the subassemblies, and wherein the subassemblies and interposer, if present, are bonded together with a cured dielectric coating. The interposer comprises dielectric layers disposed about an internal electrically conductive layer.

Abstract: A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating. The resulting product is thus able to provide extremely narrow conductive circuitry for subsequent connections, e.g., to a semiconductor chip. Electroless plating is the preferred plating method with the dielectric immersed in a solution of conductive monomers, e.g., pyrrole monomer, the solution also possibly containing a seed material such as palladium-tin.