Patents by Inventor Gregory Kim

Gregory Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12447419
    Abstract: Example implementations relate to techniques for thermal fluid conditioning and delivery. A technique may involve coupling a container of heat transfer fluid to an input and removing moisture from the heat transfer fluid via a molecular sieve. A pressure source is configured to push the heat transfer fluid out of the container and through the molecular sieve. Subsequent to removing the moisture from the heat transfer fluid, the technique involves separating, via an orifice coupled to a tank, the heat transfer fluid into liquid and gas particles within the tank and removing, via a vacuum coupled to the tank, the gas particles from the tank. The liquid can then be supplied into a fluid system via additional pressure by the pressure source. The technique may be performed by a portable device that houses the various components used to condition and delivery the thermal fluid.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: October 21, 2025
    Assignee: The Boeing Company
    Inventors: Kevin A. Nemeth, Gregory Kim, Jimmy P. Huynh
  • Patent number: 12253439
    Abstract: The present application relates to systems, methods, and apparatus for facilitating the testing of a payload. An exemplary apparatus may include a fluid inlet port configured to receive fluid from a thermal subsystem of the payload. The apparatus may also include an actuating device configure to supply the fluid to a heat exchanger. A valve may be configured to receive the fluid from the heat exchanger and separate the fluid into a first fluid line and a second fluid line. A first fluid outlet port may be configured to supply the fluid to the thermal subsystem of the payload and a second fluid outlet port may be configured to supply the fluid to the thermal subsystem of payload.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: March 18, 2025
    Assignee: The Boeing Company
    Inventors: Creed Reilly, Gregory Kim, Jimmy Huynh, Kevin Nemeth
  • Publication number: 20240192094
    Abstract: The present application relates to systems, methods, and apparatus for facilitating the testing of a payload. An exemplary apparatus may include a fluid inlet port configured to receive fluid from a thermal subsystem of the payload. The apparatus may also include an actuating device configure to supply the fluid to a heat exchanger. A valve may be configured to receive the fluid from the heat exchanger and separate the fluid into a first fluid line and a second fluid line. A first fluid outlet port may be configured to supply the fluid to the thermal subsystem of the payload and a second fluid outlet port may be configured to supply the fluid to the thermal subsystem of payload.
    Type: Application
    Filed: December 7, 2022
    Publication date: June 13, 2024
    Inventors: Creed Reilly, Gregory Kim, Jimmy Huynh, Kevin Nemeth
  • Publication number: 20230372839
    Abstract: Example implementations relate to techniques for thermal fluid conditioning and delivery. A technique may involve coupling a container of heat transfer fluid to an input and removing moisture from the heat transfer fluid via a molecular sieve. A pressure source is configured to push the heat transfer fluid out of the container and through the molecular sieve. Subsequent to removing the moisture from the heat transfer fluid, the technique involves separating, via an orifice coupled to a tank, the heat transfer fluid into liquid and gas particles within the tank and removing, via a vacuum coupled to the tank, the gas particles from the tank. The liquid can then be supplied into a fluid system via additional pressure by the pressure source. The technique may be performed by a portable device that houses the various components used to condition and delivery the thermal fluid.
    Type: Application
    Filed: May 18, 2022
    Publication date: November 23, 2023
    Inventors: Kevin A. Nemeth, Gregory Kim, Jimmy P. Huynh
  • Publication number: 20210276738
    Abstract: A space vehicle is described. The space vehicle comprises one or more heat-producing components, and a closed loop cooling system configured to remove heat generated by the one or more heat-producing components. The closed loop cooling system comprises a coolant passageway defining a closed loop, a coolant located within the coolant passageway, the coolant comprising a static pressure of 100 pounds per square inch or lower and the coolant being in a single liquid phase through the coolant passageway, and one or more pumps configured to move the coolant through the coolant passageway. The closed loop cooling system further comprises a first heat exchange component disposed along the coolant passageway, the first heat exchange component configured to transfer heat from the heat-producing components to the coolant, and a second heat exchange component disposed along the coolant passageway, the second heat exchange component configured to remove heat from the coolant.
    Type: Application
    Filed: March 3, 2020
    Publication date: September 9, 2021
    Inventors: Gregory Kim, Thomas Rust, III
  • Patent number: 9590573
    Abstract: In one aspect a satellite comprises a body, a solid state power amplifier, a heat acquisition and transfer device positioned proximate at least one heat generating element on the solid state power amplifier, and a heat rejection device in thermal communication with the heat acquisition and transfer device to reject heat acquired from the solid state power amplifier. Other aspects may be described.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: March 7, 2017
    Assignee: THE BOEING COMPANY
    Inventors: Thomas Rust, III, Gregory Kim, Jonathan M. Allison, Michael A. Whelan
  • Publication number: 20150207465
    Abstract: In one aspect a satellite comprises a body, a solid state power amplifier, a heat acquisition and transfer device positioned proximate at least one heat generating element on the solid state power amplifier, and a heat rejection device in thermal communication with the heat acquisition and transfer device to reject heat acquired from the solid state power amplifier. Other aspects may be described.
    Type: Application
    Filed: January 17, 2014
    Publication date: July 23, 2015
    Applicant: The Boeing Company
    Inventors: Thomas Rust, III, Gregory Kim, Johnathan M. Allison, Michael A. Whelan