Abstract: Embodiments of the present technique are directed to a backplane infrastructure. The backplane infrastructure may include a passive power backplane configured to distribute power and comprising a first set of alignment holes, a signal backplane configured to route interface signals and comprising a second set of alignment holes and a set of common alignment pins, each alignment pin having an axis, wherein the set of common alignment pins are inserted into the first set of alignment holes and the second set of alignment holes to align the passive power backplane and the signal backplane about the axis.

Abstract: When a module is inserted into a bay of an electronic system, an electrical signal connector on the electronic system engages a mating signal connector on the module and an electrical power connector on the electronic system engages one of two mating power connectors on the module. The electrical power connector on the electronic system is on either a first side or a second side of the electrical signal connector. The mating power connectors are on the first and second sides of the mating signal connector on the module.

Abstract: An apparatus for distributing power to computing modules in a multi module enclosure. The apparatus includes at least one power input module, a plurality of power input cables, a plurality of power conversion modules, and a plurality of computing modules. The at least one power input module is modularly arranged within the multi module enclosure. The plurality of power input cables are electrically connected to and provide power input to the at least one power input module. The plurality of power conversion modules are electrically connected to power outputs of the at least one power input module and are modularly arranged within the multi module enclosure. The plurality of computing modules are electrically connected to power outputs of the power conversion modules and are arranged within the multi module enclosure.

Abstract: Embodiments of the present technique are directed to a backplane infrastructure. The backplane infrastructure may include a passive power backplane configured to distribute power and comprising a first set of alignment holes, a signal backplane configured to route interface signals and comprising a second set of alignment holes and a set of common alignment pins, each alignment pin having an axis, wherein the set of common alignment pins are inserted into the first set of alignment holes and the second set of alignment holes to align the passive power backplane and the signal backplane about the axis.

Abstract: When a module is inserted into a bay of an electronic system, an electrical signal connector on the electronic system engages a mating signal connector on the module and an electrical power connector on the electronic system engages one of two mating power connectors on the module. The electrical power connector on the electronic system is on either a first side or a second side of the electrical signal connector. The mating power connectors are on the first and second sides of the mating signal connector on the module.

Abstract: A densely packaged processor-based device, such as a server. The server includes a server chassis divided into two different cooling zones, a first pressure zone and a second pressure zone. A high output fan directs air across tightly packaged, heat producing components disposed in the higher pressure zone. The higher pressure permits sufficient airflow to adequately cool the components. This zone is separated from the second zone by a baffle to prevent the high pressure air from interfering with the cooling of components in the lower pressure zone.