Abstract: In accordance with at least selected embodiments, the present disclosure or invention is directed to novel or improved testing apparatus for testing lead acid batteries and/or their components, and/or the efficacy of their components, testing tables, testing systems, and/or related methods. In accordance with at least certain embodiments, the present disclosure or invention is directed to novel or improved methods for testing lead acid batteries and/or their components, and/or the efficacy of their components. In accordance with at least certain selected embodiments, the present disclosure or invention is directed to novel or improved systems for testing lead acid batteries and/or their components, and/or the efficacy of their components.

Abstract: Micronutrient supplements individualized for one or more of sex, age, height and weight, pregnancy/lactation status, race/ethnicity, living environment, family income, family size, educational status and achievement, personal health history, family health history, eating status, and dietary inventory are detailed. Specific micronutrient supplements for populations of a particular race and ethnicity are disclosed. Methods of formulating and use the micronutrient supplements are further disclosed.

Abstract: In accordance with at least selected embodiments, the present disclosure or invention is directed to novel or improved testing apparatus for testing lead acid batteries and/or their components, and/or the efficacy of their components, testing tables, testing systems, and/or related methods. In accordance with at least certain embodiments, the present disclosure or invention is directed to novel or improved methods for testing lead acid batteries and/or their components, and/or the efficacy of their components. In accordance with at least certain selected embodiments, the present disclosure or invention is directed to novel or improved systems for testing lead acid batteries and/or their components, and/or the efficacy of their components.

Abstract: A patient comfort pillow has an outer surface that carries an image that is meaningful to a patient, and has an interior space carrying an acoustic driver that acoustically outputs an audio recording associated with the image and to which the patient can listen in response to physical handling directed at the image by the patient. The patient comfort pillow may include a pouch made of transparent material on the outer surface to hold a photograph bearing the image for viewing through the transparent material. Alternatively, the image may be printed on or sewn into the outer surface. The patient comfort pillow may include a microphone carried within the interior space to record the audio recording. Other enhancements are disclosed, such as an antenna to wirelessly receive the audio recording from another device.

Abstract: A method is provided for wire bonding an aluminum wire to a surface of a lead of an electronics package. The method entails a nickel plating process and an ultrasonic bonding process which together cooperate to form a reliable and highly repeatable joint between the wire and the lead member. The ultrasonic bonding process is specifically tailored to the nickel plating produced by the plating process, so as to significantly enhance the bond strength of the resulting ultrasonic bond joint. The plating process is devised to produce a nickel plating which is thicker than that generally practiced, and whose surface is characterized as having a relatively smooth microfinish which unexpectedly serves to enhance the bond strength of the ultrasonic bond joint.

Abstract: Disclosed is a high temperature, high pressure process of encapsulating electronic devices. The high pressure process is particularly suitable for encapsulating flip-chip devices wherein the collapse of flip-chip solder bumps is prevented. A special mold may be used to prevent the ceramic substrate of the flip-chip device from breaking under the high injection pressure conditions. The encapsulant is a rigid liquid crystal polymer.

Abstract: Disclosed is a wirebond pin having a star-shaped anchor, collar and paddle. The collar prevents passivation material, used to make a sealed semiconductor device, from leaking out of the package. The collar also helps to eliminate the resonant vibration of the pin during ultrasonic wirebonding at the paddle.