Abstract: The various embodiment provide fastening devices, systems and methods that utilize two or more maxels in respective correlated magnetic structures provided in a first structure and at least one second structure to fasten or repulse the first structure to or from, as the case may be, the at least one second structure. In at least one embodiment, each maxel is programmable and may vary either or both the polarity and magnetic strength of the given maxel. The variance of the polarity and/or magnetic strength of the given maxel may be programmable and may be varied to attract or repulse a second magnetic structure which desirably also contains one or maxels forming a correlated magnetic structure.

Abstract: A plug or connector including a coded magnet and an electrical contact. As the plug approaches a corresponding port, the coded magnet interacts with a magnet within the port. The interaction between the plug coded magnet and the port coded magnet provides a force to connect and/or align the plug with the port. Once the plug is received within the port, if a process is completed, the coded magnets polarities are altered to eject the plug from the port.

Abstract: A display system with a distributed LED backlight includes: providing a plurality of tile LED light sources, each tile LED light source having a tile and a plurality of similar LED light sources on each tile connected for emitting light therefrom; orienting the plurality of tile LED light sources for illuminating a display from the back of the display; and integrating the plurality of tile LED light sources into a thermally and mechanically structurally integrated distributed LED tile matrix backlight light source.

Abstract: Security devices and methods of securely coupling electronic devices and peripherals are provided. In one embodiment, a peripheral has a first coded magnet on a first surface of a first device. The first coded magnet has at least two different polarity regions on the first surface. A second coded magnet on a second surface of a second device is also provided. The first coded magnet is configured to securely provide data to a device associated with the second coded magnet, if the first and second coded magnets' patterns are keyed to one another.

Abstract: Connectors and methods of coupling electronic devices and cables are provided. In one embodiment, a connector has a first coded magnet on a first surface of a first device. The first coded magnet has at least two different polarity regions on the first surface. A second coded magnet on a second surface of a second device is also provided. The second coded magnet is configured to provide identifying information regarding the device on which it is located.

Abstract: The disclosed embodiments relate to the design of a portable and cost-effective fuel cell system for a portable computing device. This fuel cell system includes a fuel cell stack which converts fuel into electrical power. It also includes a fuel source for the fuel cell stack and a controller which controls operation of the fuel cell system. The fuel system also includes an interface to the portable computing device, wherein the interface comprises a power link that provides power to the portable computing device, and a bidirectional communication link that provides bidirectional communication between the portable computing device and the controller for the fuel cell system.

Abstract: Methods and aparatuses disclosed herein relate to backlit visual display elements. A visual display element may include a base layer defining one or more microperforations and a light guide coupled to a light source. The light guide may be positioned adjacent the base layer and include one or more microlenses in alignment with the one or more microperforations along at least one vertical axis.

Abstract: The disclosed embodiments provide a fuel cell plate. The fuel cell plate includes a substrate of electrically conductive material and a first outer layer of corrosion-resistant material bonded to a first portion of the substrate. To reduce the weight of the fuel cell plate, the electrically conductive material and the corrosion-resistant material are selected to be as light as practicable.

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract: Embodiments of a method for applying a thermal-interface material are described. During this method, a first surface of a heat-removal device and a second surface of a semiconductor die are prepared. Next, a region on a given surface, which is at least one of the first surface and the second surface, is defined. Then, the thermal-interface material is applied to at least the region, where the thermal-interface material includes a material that is a liquid metal over a range of operating temperatures of the semiconductor die.

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract: Embodiments of an apparatus are described. This apparatus includes a semiconductor-die layer mechanically coupled to a semiconductor die, and a heat-removal-device layer mechanically coupled to a heat-removal device. Moreover, a thermal-interface material is included between the semiconductor die and the heat-removal device, where the thermal-interface material is mechanically coupled to a region of the semiconductor-die layer and to a region of the heat-removal-device layer. Additionally, a boundary material is mechanically coupled to the semiconductor-die layer and the heat-removal-device layer, where the thermal-interface material is contained in a cavity defined, at least in part, by the semiconductor-die layer, the boundary material, and the heat-removal-device layer.

Abstract: Embodiments of a method for applying a thermal-interface material are described. During this method, a first surface of a heat-removal device and a second surface of a semiconductor die are prepared. Next, a region on a given surface, which is at least one of the first surface and the second surface, is defined. Then, the thermal-interface material is applied to at least the region, where the thermal-interface material includes a material that is a liquid metal over a range of operating temperatures of the semiconductor die.

Abstract: Embodiments of an apparatus that functions as a storage system for components are described. This apparatus includes a containment vessel enclosing a desiccant and a device. This device includes a layer mechanically coupled to a component, where the component can be one of a semiconductor die and a heat-removal device. Moreover, a thermal-interface material is coupled to a region of the layer, and a boundary material is mechanically coupled to the layer, where a perimeter defined by the boundary-material surrounds the region.

Abstract: A display system with a distributed LED backlight includes: providing a plurality of tile LED light sources, each tile LED light source having a tile and a plurality of similar LED light sources on each tile connected for emitting light therefrom; orienting the plurality of tile LED light sources for illuminating a display from the back of the display; and integrating the plurality of tile LED light sources into a thermally and mechanically structurally integrated distributed LED tile matrix backlight light source.

Abstract: An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.

Abstract: The invention includes a cable assembly housing. The cable assembly housing may include a main shell that defines a first cavity. The main shell may have a collar. The cable assembly may also include a cable shell that defines a second cavity. The cable shell may have a neck disposed between a mating surface and a flange. The flange of the cable shell may be disposed through the collar and inside the first cavity.

Abstract: Cable assembly housing. The invention includes a cable assembly housing. The cable assembly housing may include a main shell that defines a first cavity. The main shell may have a collar. The cable assembly may also include a cable shell that defines a second cavity. The cable shell may have three necks, two of which are disposed inside the first cavity, and the third neck is extended outside the collar. The cable shell may rotate about an axis of the main shell such that the cable shell is set at a predetermined angle and position with respect to the main shell.

Abstract: The invention includes a cable assembly housing. The cable assembly housing may include a main shell that defines a first cavity. The main shell may have a collar. The cable assembly may also include a cable shell that defines a second cavity. The cable shell may have a neck disposed between a mating surface and a flange. The flange of the cable shell may be disposed through the collar and inside the first cavity. The cable shell may be located in different positions relative to the main shell and locked against relative motion by detents and slots.