Abstract: A blood treatment system with pressure sensors may be configured to control blood flow to and from the patient and use readings of the pressure sensors to determine a change in a pressure drop across a flow restriction in the blood circuit to estimate a condition of the machine or the patient, or outputting data responsive to the estimation. Further embodiments employ measurement of pressure drop to detect abnormal viscosity or viscosity variations in order to detect possible infection.

Abstract: An exemplary radio-frequency (RF)-based navigation reference system uses one or more non-collocated and time-synchronized direction-finding transmitters to enable a client receiver to estimate its own 3-D position, velocity and time (PVT) using direction-finding (DF) waveforms obtained from said reference transmitters. At least one reference transmitter is sufficient for obtaining a 3-D PVT solution provided the client receiver is equipped with an accurate (low-drift) local clock such as a chip-scale atomic clock (CSAC). All other client receivers require at least two reference transmitters to estimate their 3-D PVT.

Abstract: Via chain and serpentine/comb test structures are in kerf areas of a wafer. The via chain test structures comprise a first via chain and a second via chain in a first kerf area. The via chain test structures are formed such that geometrically shaped portions of the first via chain and geometrically shaped portions of the second via chain alternate along the length of the first kerf area.

Abstract: Disclosed herein is a fluid coupling system and method. The system may include a supply bladder, a discharge bladder, and a ball valve. The supply bladder having a supply inflation portion, the supply housing having a supply inflation passage that provides fluid communication between a central fluid passage and the supply inflation portion, the discharge bladder having a discharge inflation portion, and the ball valve secured in the supply housing or the discharge housing, wherein the discharge inflation portion may be placed in fluid communication with the central fluid passage by twisting the supply housing while the discharge housing remains stationary, and wherein the ball valve may block the central fluid passage while in a first position and may open a fluid passage through the supply housing and the discharge housing while in a second position.

Abstract: Via chain and serpentine/comb test structures are in kerf areas of a wafer. The via chain test structures comprise a first via chain and a second via chain in a first kerf area. The via chain test structures are formed such that geometrically shaped portions of the first via chain and geometrically shaped portions of the second via chain alternate along the length of the first kerf area.

Abstract: Method form via chain and serpentine/comb test structures in kerf areas of a wafer. The via chain test structures comprise a first via chain and a second via chain in a first kerf area. The via chain test structures are formed such that geometrically shaped portions of the first via chain and geometrically shaped portions of the second via chain alternate along the length of the first kerf area. The methods perform relatively low (first) magnification testing to identify a defective geometrically shaped portion that contains a defective via structure. The methods then perform relatively high (second) magnification testing only within the defective geometrically shaped portion. The first magnification testing is performed at a lower magnification relative to the second magnification testing.

Abstract: Method form via chain and serpentine/comb test structures in kerf areas of a wafer. The via chain test structures comprise a first via chain and a second via chain in a first kerf area. The via chain test structures are formed such that geometrically shaped portions of the first via chain and geometrically shaped portions of the second via chain alternate along the length of the first kerf area. The methods perform relatively low (first) magnification testing to identify a defective geometrically shaped portion that contains a defective via structure. The methods then perform relatively high (second) magnification testing only within the defective geometrically shaped portion. The first magnification testing is performed at a lower magnification relative to the second magnification testing.

Abstract: A temporary chip attach (TCA) structure is made with two layers of thin films. The first layer contains capture pads to capture the positional error of the underlying chip carrier vias. The second layer contains smaller TCA pads of exposed metal which are accurately aligned to the grid of the chip BLM, as well as appropriate alignment features for use by a chip automatic placement tool.

Abstract: Preferred embodiments for methods of removing an integrated circuit (“IC”) from a substrate, where the IC is attached to the substrate by multiple solder connections are disclosed. One preferred embodiment of the inventive methods provides the steps of heating the IC and substrate to the reflow temperature for the solder connections and pulling the IC from the substrate by means of a vacuum force. Another preferred embodiment of the inventive method provides the step of shearing the IC from the substrate after the substrate and IC are heated, but before solder reflow temperature has been reached, and where the shearing force may be programmed through a computer controlled servomotor. Preferred embodiments of certain apparatus applying the inventive methods for removing an integrated circuit from a substrate are also disclosed.

Abstract: A vibratory sensor with a resonator for measuring angular rotation, such as for example a hemispherical resonator gyroscope (HRG) operating in force rebalance mode, includes circuitry to generate a virtual node and antinode in the resonator standing wave. Shifting a pair of pickoff electrodes from a position directly over an actual node in the HRG standing wave to an offset position where the primary and secondary harmonic contributions at the first pickoff electrode are equal to the primary and secondary harmonic contributions at the second pickoff electrode permits the elimination of secondary harmonics contribution. A virtual node is created by offsetting a pair of pickoff electrodes 22.5 degrees from the actual antinode such that each pickoff electrode includes an equal contribution of the secondary harmonic signal present in the standing wave.

Abstract: Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.

Abstract: Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.

Abstract: Thermoelectric devices having enhanced thermal characteristics are fabricated using multilayer ceramic (MLC) technology methods. Aluminum nitride faceplates with embedded electrical connections provide the electrical series configuration for alternating dissimilar semiconducting materials. Embedded electrical connections are formed by vias and lines in the faceplate. A portion of the dissimilar materials are then melted within the tunnels to form a bond. Thermal conductivity of the faceplate is enhanced by adding electrically isolated vias to one surface, filled with high thermal conductivity metal paste. A low thermal conductivity material is also introduced between the two high thermal conductivity material faceplates.

Abstract: Thermoelectric devices having enhanced thermal characteristics are fabricated using multilayer ceramic (MLC) technology methods. Aluminum nitride faceplates with embedded electrical connections provide the electrical series configuration for alternating dissimilar semiconducting materials. Embedded electrical connections are formed by vias and lines in the faceplate. Methods for forming tunnels through lamination and etching are employed. A portion of the dissimilar materials are then melted within the tunnels to form a bond. Thermal conductivity of the faceplate is enhanced by adding electrically isolated vias to one surface, filled with high thermal conductivity metal paste. A low thermal conductivity material is also introduced between the two high thermal conductivity material faceplates. Alternating semiconducting materials are introduced within the varying thermal conductivity layers by punching vias within greensheets of predetermined thermal conductivity and filling with n-type and p-type paste.

Abstract: Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.

Abstract: A time based digital to analog converter is presented in which known reference voltages are used to create variable period waveforms which, when combined according to a desired computation, can convert digital words into a sinusoidal signal of a precision variable. To illustrate the application of the present invention, a hemispherical resonator gyroscope (HRG) operating in force rebalance is presented wherein a time based digital to analog converter with a variable period output controls the HRG electronics in nulling the standing wave. A rate of the standing wave is calculated, and a software component calculates the fraction of the maximum rate needed to oppose and null the initial rate of the standing wave. The fraction of the maximum rate is converted to digital words corresponding to the number of periods of a clock connected to the circuit.

Abstract: A vibratory sensor, such as for example a hemispherical resonator gyroscope (HRG) operating in the whole angle mode, is disclosed with a self-calibrating function and an improved precision. Precision is improved using two multiplying low noise DACs to estimate the position of the standing wave relative to a fixed position on the HRG. During a first half cycle the DACs multiply a measured standing wave position by an estimated standing wave position, such that the product of the two signals approach zero. The small voltage output can then be amplified using high gain to minimize the noise in the standing wave angle prediction. Using an ADC, the amplified signal is converted and transmitted to a microprocessor for evaluation. In the second half cycle, the low noise multipliers are evaluated using a known reference signal, where the product of the known reference signal and the multipliers are evaluated against a predicted signal to determine multiplier drift.

Abstract: Thermoelectric devices having enhanced thermal characteristics are fabricated using multilayer ceramic (MLC) technology methods. Aluminum nitride faceplates with embedded electrical connections provide the electrical series configuration for alternating dissimilar semiconducting materials. Embedded electrical connections are formed by vias and lines in the faceplate. Methods are employed for forming tunnels through lamination and etching. A portion of the dissimilar materials are then melted within the tunnels to form a bond. Thermal conductivity of the faceplate is enhanced by adding electrically isolated vias to one surface, filled with high thermal conductivity metal paste. A low thermal conductivity material is also introduced between the two high thermal conductivity material faceplates. Alternating semiconducting materials are introduced within the varying thermal conductivity layers by punching vias within greensheets of predetermined thermal conductivity and filling with n-type and p-type paste.

Abstract: Metal pastes used in the fabrication of multilayer ceramic (MLC) substrates used in semiconductor devices. The pastes reduce substrate defects, such as via bulge and camber. The pastes are comprised of a metal having high conductivity, frit which includes glass, an organic binder, and a solvent, optionally with a surfactant.

Abstract: Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.