Abstract: A process for forming inkjet nozzle devices on a frontside surface of a wafer substrate. The process includes the steps of: (i) providing the wafer substrate having a plurality of etched holes defined in the frontside surface, each etched hole being filled with first and second polymers such that the second polymer is coplanar with the frontside surface; (ii) forming the inkjet nozzle devices on the frontside surface using MEMS fabrication steps; and (iii) removing the first and second polymers via oxidative ashing, wherein first and second polymers are different.

Abstract: A process for forming inkjet nozzle devices on a frontside surface of a wafer substrate. The process includes the steps of: (i) providing the wafer substrate having a plurality of etched holes defined in the frontside surface, each etched hole being filled with first and second polymers such that the second polymer is coplanar with the frontside surface; (ii) forming the inkjet nozzle devices on the frontside surface using MEMS fabrication steps; and (iii) removing the first and second polymers via oxidative ashing, wherein first and second polymers are different.

Abstract: A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: depositing a layer of a thermoplastic first polymer onto the frontside surface and into each hole until the holes are overfilled with the first polymer; depositing a layer of a photoimageable second polymer different than the first polymer; selectively removing the second polymer from regions outside a periphery of the holes; exposing the wafer substrate to a controlled oxidative plasma so as to reveal the frontside surface of the wafer substrate; and planarizing the frontside surface to provide holes filled with a plug of the first polymer only, each plug having a respective upper surface coplanar with the frontside surface.

Abstract: A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: depositing a layer of a thermoplastic first polymer onto the frontside surface and into each hole until the holes are overfilled with the first polymer; depositing a layer of a photoimageable second polymer different than the first polymer; selectively removing the second polymer from regions outside a periphery of the holes; exposing the wafer substrate to a controlled oxidative plasma so as to reveal the frontside surface of the wafer substrate; and planarizing the frontside surface to provide holes filled with a plug of the first polymer only, each plug having a respective upper surface coplanar with the frontside surface.

Abstract: A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: (i) depositing a layer of a photoimageable thermoplastic polymer onto the frontside surface and into each hole; (ii) reflowing the polymer; (iii) selectively removing the polymer from regions outside a periphery of each hole, the selective removing comprising exposure and development of the polymer; (iv) optionally repeating steps (i) to (iii) until each hole is overfilled with the polymer; and (v) planarizing the frontside surface to provide one or more holes filled with a plug of the polymer. Each plug has a respective upper surface coplanar with the frontside surface.

Abstract: A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: (i) depositing a layer of a photoimageable thermoplastic polymer onto the frontside surface and into each hole; (ii) reflowing the polymer; (iii) selectively removing the polymer from regions outside a periphery of each hole, the selective removing comprising exposure and development of the polymer; (iv) optionally repeating steps (i) to (iii) until each hole is overfilled with the polymer; and (v) planarizing the frontside surface to provide one or more holes filled with a plug of the polymer. Each plug has a respective upper surface coplanar with the frontside surface.

Abstract: A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: (i) depositing a layer of a thermoplastic first polymer onto the frontside surface and into each hole; (ii) reflowing the first polymer; (iii) exposing the wafer substrate to a controlled oxidative plasma; (iv) optionally repeating steps (i) to (iii); (v) depositing a layer of a photoimageable second polymer; (vi) selectively removing the second polymer from regions outside a periphery of the holes using exposure and development; and (vii) planarizing the frontside surface to provide holes filled with a plug comprising the first and second polymers, which are different than each other. Each plug has a respective upper surface coplanar with the frontside surface.

Abstract: A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: (i) depositing a layer of a thermoplastic first polymer onto the frontside surface and into each hole; (ii) reflowing the first polymer; (iii) exposing the wafer substrate to a controlled oxidative plasma; (iv) optionally repeating steps (i) to (iii); (v) depositing a layer of a photoimageable second polymer; (vi) selectively removing the second polymer from regions outside a periphery of the holes using exposure and development; and (vii) planarizing the frontside surface to provide holes filled with a plug comprising the first and second polymers, which are different than each other. Each plug has a respective upper surface coplanar with the frontside surface.

Abstract: An inkjet nozzle assembly includes a nozzle chamber having a floor and a roof, wherein moving portion of the roof is moveable towards the floor for ejection of ink. A thermal bend actuator defines part of the moving portion of the roof, and an active beam of the actuator defines an upper layer of the moving portion.

Abstract: This invention provides for a nozzle arrangement for a printhead. The nozzle arrangement includes a substrate that defines an ink inlet passage. A nozzle plate is arranged on the substrate and defines an ink chamber in fluid communication with the ink inlet passage and a nozzle aperture in fluid communication with the ink chamber. A nozzle enclosure is arranged on the nozzle plate about the aperture and is configured to isolate the aperture from at least one adjacent aperture. The arrangement also includes a heater element suspended within the chamber and configured to produce ink cavitation when heated to eject a drop of ink via the nozzle aperture. The heater element is configured as a looped element so that no solid surface thereof is in the vicinity of a point of collapse of the produced cavitation.

Abstract: A printhead comprising a plurality of unit cells, at least one of the plurality of unit cells comprising a substrate including an ink inlet passage. A chamber is defined by chamber sidewalls and at least part of a nozzle plate defining an aperture for ejection of ink from the chamber, the chamber being in fluid communication with the inlet passage. A nozzle enclosure comprising enclosure sidewalls and a roof defining an opening for ejection of ink, the nozzle enclosure surrounding the aperture. Ink ejected from the aperture is directed to the opening of the nozzle enclosure, thereby isolating the aperture from an adjacent aperture of an adjacent unit cell.

Abstract: A printhead assembly includes an elongate extrusion defining a plurality of longitudinally extending ink channels. The extrusion also defines a plurality of first groups of holes with the holes in each group extending from respective ink channels. An elongate support defines a longitudinally extending extrusion channel in which the extrusion is received. The elongate support also defines a plurality of second groups of holes aligned with the first groups. Printhead modules are engaged along the support in fluid communication with respective second groups and are configured to eject ink supplied from the channels via respective first and second groups.

Abstract: Provided is a printhead integrated circuit defining an external surface having a number of ink ejection ports operatively directed at a printing medium. The surface includes a plurality of petal formations radially positioned about each ink ejection port, and a plurality of actuators, each located behind a petal formation distal from said port. The surface also includes a plurality of heater structures each connected to an actuator, so that heating of the structures via an electrical current produces expansion in said actuators which urges the formations into a chamber below the surface.

Abstract: A thermal inkjet actuator for use in an inkjet printer assembly includes heat conduction means arranged to realize a predetermined negative pressure profile to facilitate droplet formation. In a preferred embodiment the heat conduction means comprises a thin layer (54) of very high thermally conductive material such as Aluminium located in the middle of a non-heat conductive passive bend layer (56). The overall cool-down speed of the actuator, and hence the speed with which the passive bend layer returns to its quiescent position can be controlled by controlling the proximity of the heat conductive layer to the actuator's heater during fabrication.

Abstract: A printhead is provided for an inkjet printer. The printhead includes a two-dimensional array of ink nozzle arrangements. Each nozzle arrangement includes a wafer portion defining both a nozzle chamber for storing ink and an ink supply channel in fluid communication with the nozzle chamber. A cover covers the nozzle chamber and defines a nozzle rim from which a plurality of supports extends outwardly. The cover includes a plurality of actuators extending inwardly toward the nozzle rim between respective pairs of adjacent supports and terminates in free ends. The actuators include internal heating elements which can be actuated so that the free ends reciprocate into and out of the nozzle chamber to eject ink out through the nozzle rim.

Abstract: The present invention relates to a printhead for an inkjet printer. The printhead includes a chassis assembly defining a plurality of spaced apart first groups of apertures and a channel. An ink distribution unit defines a plurality of ink distribution passages and a plurality of spaced apart second groups of apertures. The apertures of each second group are in fluid communication with respective ink distribution passages. The ink distribution unit is received in the channel so that the first and second groups coincide. A plurality of printhead modules is serially engaged along the chassis assembly and in fluid communication with respective first groups. The printhead modules are configured to eject ink provided from the ink distribution passages via the first and second groups.

Abstract: A thermoelastic device comprising an expansive element is disclosed. The expansive element is formed from a material, which is preselected on the basis that it has one or more of the following properties: a resistivity between 0.1 ??m and 10.0 ??m; chemically inert in air; chemically inert in the chosen ink; and depositable by CVD, sputtering or other thin film deposition technique.

Abstract: An inkjet printhead with a plurality of nozzles, a heater element adjacent each of the nozzles respectively for heating an ejectable liquid to form a gas bubble that causes the ejection of a drop of the ejectable liquid from the nozzle, and, a print engine controller for controlling the operation of the heater elements. During use, the print engine controller ensures that the time interval between successive actuations of each of the heater elements is less than a predetermined time in which the viscosity of the ejectable liquid in the increases to a threshold, known as the decap time.

Abstract: A nozzle arrangement for an inkjet printer includes a wafer assembly defining a nozzle chamber into which ink can be fed. A nozzle chamber roof assembly is fast with the wafer assembly and covers the nozzle chamber. The nozzle chamber roof assembly defines an ink ejection port supported by a plurality of outwardly extending bridging members, and a plurality of cantilevered actuators interleaved between the bridging members and extending inwardly to terminate in free ends proximal to the ink ejection port. An elongate heater element extends through each actuator so that, in use, the heater element causes differential thermal expansion in the actuators and thus the free ends of the actuators subsequently to move into the nozzle chamber and force ink therein out through the ink ejection port.

Abstract: A nozzle arrangement for an inkjet printer includes a wafer that defines an ink supply channel and a nozzle chamber in fluid communication with the ink supply channel. A drive circuitry layer is positioned on the wafer. A plurality of actuator devices is positioned on the wafer and the drive circuitry layer to cover the nozzle chamber. An ink ejection port defining means defines an ink ejection port in fluid communication with the nozzle chamber. The plurality of thermal actuator devices is radially positioned around the ink ejection port and is electrically coupled to the drive circuitry layer so that, upon actuation, the actuator devices bend into the nozzle chamber to cause ink therein to pass through the ink ejection port.