Patents by Inventor Gregory Meredith

Gregory Meredith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10665515
    Abstract: Embodiments herein describe binning and placement techniques for assembling a multi-die device to improve yield when a customer requests a high performance feature from the device. For example, the multi-die device may include multiple dies that are interconnected to form a single device or package. In one embodiment, the multiple dies are the same semiconductor die (e.g., have the same circuit layout) which are disposed on a common interposer or stacked on each other. The multi-die device can then be attached to a printed circuit board (PCB). Although the dies in the multi-die device may each include the same feature (e.g., a PCIe interface, SerDes interface, transmitter, memory interface, etc.), the multi-die device is assembled so that not all of the dies have a feature that satisfies the high performance requested by the customer. That is, at least one of the die includes a lower performance feature.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: May 26, 2020
    Assignee: XILINX, INC.
    Inventors: Matthew H. Klein, Gregory Meredith, Joshua Tan
  • Patent number: 9337138
    Abstract: An embodiment of an apparatus to reduce supply voltage noise with capacitors of an interposer of a stacked die is disclosed. In this embodiment, an interposer is coupled to a first integrated circuit die using a first plurality of interconnects. A substrate is coupled to the interposer using a second plurality of interconnects. The substrate includes a supply voltage plane and a ground plane, each of which is coupled to the first integrated circuit die using the second plurality of interconnects, the interposer, and the first plurality of interconnects. The interposer includes capacitors coupled in parallel using the supply voltage plane, the ground plane, and the second plurality of interconnects, where capacitance from capacitors of the interposer is provided to the first integrated circuit die using the supply voltage plane and the ground plane of the substrate.
    Type: Grant
    Filed: March 9, 2012
    Date of Patent: May 10, 2016
    Assignee: XILINX, INC.
    Inventors: Khaldoon S. Abugharbieh, Gregory Meredith, Christopher P. Wyland, Paul Y. Wu, Henley Liu, Sanjiv Stokes, Yong Wang
  • Patent number: 8556036
    Abstract: An adjustable tree stand assembly of the present invention is used by hunters and naturalists. The assembly presents a support frame of a generally rectangular configuration having a first support member to be connected to a tree and an arm extending in cantilevered fashion to a housing adaptable to receive a seat and seat frame assembly. The seat and seat frame assembly includes a seat portion, a back support portion and a leg or pin extending from the seat portion to be engaged in the housing. An adjustable shooting rail is connected to and extends from the seat and seat frame assembly. The housing is further connected to a platform for supporting the hunter.
    Type: Grant
    Filed: November 12, 2012
    Date of Patent: October 15, 2013
    Inventors: Gregory Meredith, Robert Borgstrom