Abstract: A drop detector includes a printed circuit board (PCB) including a number of optical channels each formed by a light emitter and a light detector and a number of holes defined in the PCB over which the optical channels pass over and through which a number of ejected drops from a number of printheads pass through wherein each of the number of holes defined in PCB are sized to contour the shape of the number of the printheads.

Abstract: A method of detecting droplets of printing fluid output from a nozzle array includes, in an example, grouping a number of nozzles into a number of individual groups of nozzles and sequentially detecting, with a printing fluid detector, printing fluid ejected from each group of nozzles using a linear position encoder to synchronize the position of the printing fluid detector wherein the printing fluid detector stops moving while detecting each group of nozzles.

Abstract: A printhead assembly for an inkjet-printing device includes a printhead die and a flexible circuit connected to the printhead die. The printhead die includes a substrate, a first ground network electrically connected to the substrate, a device layer, and a second ground network electrically connected to the device layer. The first ground network and the second ground network are electrically isolated from one another within the printhead die. The first ground network and the second ground network are electrically connected to one another at the flexible circuit.

Abstract: A drop detector includes a printed circuit board (PCB) including a number of optical channels each formed by a light emitter and a light detector and a number of holes defined in the PCB over which the optical channels pass over and through which a number of ejected drops from a number of printheads pass through wherein each of the number of holes defined in PCB are sized to contour the shape of the number of the printheads.

Abstract: A method of detecting droplets of printing fluid output from a nozzle array includes, in an example, grouping a number of nozzles into a number of individual groups of nozzles and sequentially detecting, with a printing fluid detector, printing fluid ejected from each group of nozzles using a linear position encoder to synchronize the position of the printing fluid detector wherein the printing fluid detector stops moving while detecting each group of nozzles.

Abstract: A printhead assembly for an inkjet-printing device includes a printhead die and a flexible circuit connected to the printhead die. The printhead die includes a substrate, a first ground network electrically connected to the substrate, a device layer, and a second ground network electrically connected to the device layer. The first ground network and the second ground network are electrically isolated from one another within the printhead die. The first ground network and the second ground network are electrically connected to one another at the flexible circuit.

Abstract: A printhead assembly for an inkjet-printing device includes a printhead die and a flexible circuit connected to the printhead die. The printhead die includes a substrate, a first ground network electrically connected to the substrate, a device layer, and a second ground network electrically connected to the device layer. The first ground network and the second ground network are electrically isolated from one another within the printhead die. The first ground network and the second ground network are electrically connected to one another at the flexible circuit.

Abstract: A system for drop detection of fluid drops ejected by a printing device includes a drop detector comprising a radiation source and radiation sensor for illuminating a region in which drops are ejected by a print bar and detecting radiation from the radiation source that is reflected by backscattering from the drops to the radiation sensor; and a controller for controlling the drop detector and the print bar, wherein the controller uses a signal output by the drop detector to determine whether nozzles of the print bar are operating properly.

Abstract: A system for drop detection of fluid drops ejected by a printing device includes a drop detector comprising a radiation source and radiation sensor for illuminating a region in which drops are ejected by a print bar and detecting radiation from the radiation source that is reflected by backscattering from the drops to the radiation sensor; and a controller for controlling the drop detector and the print bar, wherein the controller uses a signal output by the drop detector to determine whether nozzles of the print bar are operating properly.

Abstract: Embodiments of a printhead are disclosed.

Abstract: Edges of a first conductive layer (104) and a silicate glass layer (106) extend adjacent one another along a via (164) extending to a semiconductor substrate (41). An electrical conductor (112/114) extends through the via (164) into contact with the semiconductor substrate (41).

Abstract: Edges of a first conductive layer (104) and a silicate glass layer (106) extend adjacent one another along a via (164) extending to a semiconductor substrate (41). An electrical conductor (112/114) extends through the via (164) into contact with the semiconductor substrate (41).

Abstract: A printhead assembly for an inkjet-printing device includes a printhead die and a flexible circuit connected to the printhead die. The printhead die includes a substrate, a first ground network electrically connected to the substrate, a device layer, and a second ground network electrically connected to the device layer. The first ground network and the second ground network are electrically isolated from one another within the printhead die. The first ground network and the second ground network are electrically connected to one another at the flexible circuit.

Abstract: Embodiments of a printhead are disclosed.

Abstract: The present invention provides a buried layer fabrication sequence suitable for bipolar and BiCMOS applications. The buried layer fabrication sequence for forming a buried layer having a first conductivity type includes the steps of: forming a first dielectric layer on a semiconductor substrate, the semiconductor substrate having a second conductivity type; forming a first mask layer having openings on top of the first dielectric layer, wherein the openings in the first mask layer are positioned over the regions where the first buried layer is formed; exposing the semiconductor substrate in the regions where openings in the first mask layer are formed; forming a second dielectric layer; removing the second dielectric layer; and forming a semiconductor layer.

Abstract: There is disclosed a process for making high performance bipolar and high performance MOS devices on the same integrated circuit die. The process comprises forming isolation islands of epitaxial silicon surrounded by field oxide and forming MOS transistors having polysilicon gates in some islands and forming bipolar transistors having polysilicon emitters in other islands. Insulating spacers are then formed around the edges of the polysilicon electrodes by anisotropically etching a layer of insulation material, usually thermally grown silicon dioxide covered with additional oxide deposited by CVD. A layer of refractory metal, preferably titanium covered with tungsten, is then deposited and heat treated at a temperature high enough to form only titanium disilicide to form silicide over the tops of the polysilicon electrodes and on top of the bases, sources and drains.

Abstract: There is disclosed a process for making high performance bipolar and high performance MOS devices on the same integrated circuit die. The process comprises forming isoaltion islands of epitaxial silicon surrounded by field oxide and forming MOS transistors having polysilicon gates in some islands and forming bipolar transistors having polysilicon emitters in other islands. Insulating spacers are then formed around the edges of the polysilicon electrodes by anisotropically etching a layer of insulation material, usually thermally grown silicon dioxide covered with additional oxide deposited by CVD. A layer of refractory metal, preferably titanium covered with tungsten, is then deposited and heat treated at a temperature high enough to form only titanium disilicide to form silicide over the tops of the polysilicon electrodes and on top of the bases, sources and drains.

Abstract: To completely isolate an island of silicon, a trench is cut into an epitaxial layer to provide access to a differently doped buried layer. While suspending the portion of the epitaxial layer surrounded by the trench by means of an oxide bridge, the underlying region of the buried layer is etched away to form a cavity under the active area. This cavity, as well as the surrounding trench, is then filled with a suitable insulating material to isolate the active island from the substrate.

Abstract: In the fabrication of bipolar transistors by the single poly process, polysilicon sidewalls are formed along portions of a polysilicon layer that functions as a device contact. The sidewalls serve both as dopant sources which determine the width of underlying base and emitter regions, and as contacts to those devices. Since the thickness of the polysilicon sidewalls, and hence the width of the underlying device regions, are precisely controllable through conventional polysilicon deposition techniques, relatively relaxed design rules can be employed while making possible the formation of emitters having widths less than one-half of a micron.