Patents by Inventor Gregory N. Nielson

Gregory N. Nielson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190334472
    Abstract: Embodiments of the present disclosure are related to solar module mounting systems. A system may include an adhesion sheet configured to be secured to a roof of a structure via an adhesive. The system may further include at least one clamp configured for securing at least one solar module to the adhesion sheet. Other embodiments are related to methods of attaching one or more solar modules to a structure.
    Type: Application
    Filed: June 11, 2019
    Publication date: October 31, 2019
    Inventors: Willard S. MacDonald, Gregory N. Nielson, Roger L. Jungerman
  • Patent number: 10361652
    Abstract: Embodiments of the present disclosure are related to solar module mounting systems. A system may include an adhesion sheet configured to be secured to a roof of a structure via an adhesive. The system may further include at least one clamp configured for securing at least one solar module to the adhesion sheet. Other embodiments are related to methods of attaching one or more solar modules to a structure.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: July 23, 2019
    Assignee: Vivint Solar, Inc.
    Inventors: Willard S. MacDonald, Gregory N. Nielson, Roger L. Jungerman
  • Patent number: 10304977
    Abstract: A method, system and apparatus including a device cell having a top side, a bottom side and opposing side walls. A passivation layer is formed along the top side, the bottom side and opposing side walls of the device cell. The passivation layer serves to passivate the device cell and facilitate carrier collection around the device cell. An anti-reflective layer is formed over the passivation layer and an optical layer is formed on the top side of the device cell. The optical layer reflects light within the device cell. The apparatus may further include a reflective layer formed along the bottom side of the device cell, the reflective layer to reflect light internally within the device cell.
    Type: Grant
    Filed: May 11, 2015
    Date of Patent: May 28, 2019
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Murat Okandan, Gregory N. Nielson, Jose Luis Cruz-Campa, Paul J. Resnick, Carlos Anthony Sanchez
  • Patent number: 10243095
    Abstract: A method is provided for making a molded photovoltaic module. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: March 26, 2019
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Jeffrey S. Nelson, Michael Hibbs, Gregory N. Nielson, Murat Okandan, Jose Luis Cruz-Campa, Paul J. Resnick, Carlos Anthony Sanchez, Vipin P. Gupta, Peggy J. Clews
  • Publication number: 20180323324
    Abstract: A moldable photovoltaic module is provided. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.
    Type: Application
    Filed: July 19, 2018
    Publication date: November 8, 2018
    Inventors: Jeffrey S. Nelson, Michael Hibbs, Gregory N. Nielson, Murat Okandan, Jose Luis Cruz-Campa, Paul J. Resnick, Carlos Anthony Sanchez, Vipin P. Gupta, Peggy J. Clews
  • Publication number: 20180323325
    Abstract: A method is provided for making a molded photovoltaic module. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.
    Type: Application
    Filed: July 19, 2018
    Publication date: November 8, 2018
    Inventors: Jeffrey S. Nelson, Michael Hibbs, Gregory N. Nielson, Murat Okandan, Jose Luis Cruz-Campa, Paul J. Resnick, Carlos Anthony Sanchez, Vipin P. Gupta, Peggy J. Clews
  • Patent number: 10038113
    Abstract: A moldable photovoltaic module is provided. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: July 31, 2018
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Jeffrey S. Nelson, Michael Hibbs, Gregory N. Nielson, Murat Okandan, Jose Luis Cruz-Campa, Paul J. Resnick, Carlos Anthony Sanchez, Vipin P. Gupta, Peggy J. Clews
  • Patent number: 9978895
    Abstract: An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: May 22, 2018
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Benjamin John Anderson, Gregory N. Nielson, Jose Luis Cruz-Campa, Murat Okandan, Anthony L. Lentine, Paul J. Resnick
  • Patent number: 9972736
    Abstract: An apparatus, method, and system, the apparatus including a receiving member dimensioned to receive an array of microelectronic devices; and a linkage member coupled to the receiving member, the linkage member configured to move the receiving member in at least two dimensions so as to modify a spacing between the electronic devices within the array of microelectronic devices received by the receiving member. The method including coupling an array of microelectronic devices to an expansion assembly; and expanding the expansion assembly so as to expand the array of microelectronic devices in at least two directions within a single plane. The system including a support member; an expansion assembly coupled to the support member, the expansion assembly having a plurality of receiving members configured to move in at least two dimensions within a single plane; and a plurality of microelectronic devices coupled to each of the plurality of receiving members.
    Type: Grant
    Filed: March 12, 2014
    Date of Patent: May 15, 2018
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Jeffrey P. Koplow, Vipin P. Gupta, Gregory N. Nielson, Murat Okandan, Jose Luis Cruz-Campa, Jeffrey S. Nelson
  • Patent number: 9907496
    Abstract: The present invention relates to a biological probe structure, as well as apparatuses, systems, and methods employing this structure. In particular embodiments, the structure includes a hermetically sealed unit configured to receive and transmit one or more optical signals. Furthermore, the structure can be implanted subcutaneously and interrogated externally. In this manner, a minimally invasive method can be employed to detect, treat, and/or assess the biological target. Additional methods and systems are also provided.
    Type: Grant
    Filed: June 25, 2014
    Date of Patent: March 6, 2018
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Murat Okandan, Gregory N. Nielson
  • Patent number: 9911871
    Abstract: A photovoltaic module includes colorized reflective photovoltaic cells that act as pixels. The colorized reflective photovoltaic cells are arranged so that reflections from the photovoltaic cells or pixels visually combine into an image on the photovoltaic module. The colorized photovoltaic cell or pixel is composed of a set of 100 to 256 base color sub-pixel reflective segments or sub-pixels. The color of each pixel is determined by the combination of base color sub-pixels forming the pixel. As a result, each pixel can have a wide variety of colors using a set of base colors, which are created, from sub-pixel reflective segments having standard film thicknesses.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: March 6, 2018
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Anthony L. Lentine, Gregory N. Nielson, Jose Luis Cruz-Campa, Murat Okandan, Ronald S. Goeke
  • Patent number: 9831369
    Abstract: A photovoltaic power generation system that includes a solar panel is described herein. The solar panel includes a photovoltaic sub-module, which includes a group of microsystem enabled photovoltaic cells. The group includes a first string of photovoltaic cells, a second string of photovoltaic cells, and a differing photovoltaic cell. Photovoltaic cells in the first string are electrically connected in series, and photovoltaic cells in the second string are electrically connected in series. Further, the first string of photovoltaic cells, the second string of photovoltaic cells, and the differing photovoltaic cell are electrically connected in parallel. Moreover, the differing photovoltaic cell is used as a bypass diode for the first string of photovoltaic cells and the second string of photovoltaic cells.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: November 28, 2017
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Anthony L. Lentine, Gregory N. Nielson, Anna Tauke-Pedretti, Jose Luis Cruz-Campa, Murat Okandan
  • Patent number: 9763370
    Abstract: An apparatus including a carrier substrate configured to move a microelectronic device. The apparatus further includes a rotatable body configured to receive the microelectronic device. Additionally, the apparatus includes a second substrate configured to receive the microelectronic device from the rotatable body.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: September 12, 2017
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Murat Okandan, Gregory N. Nielson, Jose Luis Cruz-Campa, Judith Maria Lavin, Paul J. Resnick
  • Patent number: 9761748
    Abstract: A photovoltaic (PV) module includes an absorber layer coupled to an optic layer. The absorber layer includes an array of PV elements. The optic layer includes a close-packed array of Keplerian telescope elements, each corresponding to one of an array of pupil elements. The Keplerian telescope substantially couple radiation that is incident on their objective surfaces into the corresponding pupil elements. Each pupil element relays radiation that is coupled into it from the corresponding Keplerian telescope element into the corresponding PV element.
    Type: Grant
    Filed: April 14, 2015
    Date of Patent: September 12, 2017
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Gregory N. Nielson, William C. Sweatt, Murat Okandan
  • Patent number: 9748415
    Abstract: A method including providing a substrate comprising a device layer on which a plurality of device cells are defined; depositing a first dielectric layer on the device layer and metal interconnect such that the deposited interconnect is electrically connected to at least two of the device cells; depositing a second dielectric layer over the interconnect; and exposing at least one contact point on the interconnect through the second dielectric layer. An apparatus including a substrate having defined thereon a device layer including a plurality of device cells; a first dielectric layer disposed directly on the device layer; a plurality of metal interconnects, each of which is electrically connected to at least two of the device cells; and a second dielectric layer disposed over the first dielectric layer and over the interconnects, wherein the second dielectric layer is patterned in a positive or negative planar spring pattern.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: August 29, 2017
    Assignee: Sandia Corporation
    Inventors: Murat Okandan, Gregory N. Nielson, Jose Luis Cruz-Campa, Carlos Anthony Sanchez
  • Publication number: 20170162724
    Abstract: A method including providing a substrate comprising a device layer on which a plurality of device cells are defined; depositing a first dielectric layer on the device layer and metal interconnect such that the deposited interconnect is electrically connected to at least two of the device cells; depositing a second dielectric layer over the interconnect; and exposing at least one contact point on the interconnect through the second dielectric layer. An apparatus including a substrate having defined thereon a device layer including a plurality of device cells; a first dielectric layer disposed directly on the device layer; a plurality of metal interconnects, each of which is electrically connected to at least two of the device cells; and a second dielectric layer disposed over the first dielectric layer and over the interconnects, wherein the second dielectric layer is patterned in a positive or negative planar spring pattern.
    Type: Application
    Filed: November 23, 2016
    Publication date: June 8, 2017
    Inventors: Murat Okandan, Gregory N. Nielson, Jose Luis Cruz-Campa, Carlos Anthony Sanchez
  • Publication number: 20170077866
    Abstract: Embodiments of the present disclosure are related to solar module mounting systems. A system may include an adhesion sheet configured to be secured to a roof of a structure via an adhesive. The system may further include at least one clamp configured for securing at least one solar module to the adhesion sheet. Other embodiments are related to methods of attaching one or more solar modules to a structure.
    Type: Application
    Filed: September 14, 2016
    Publication date: March 16, 2017
    Inventors: Willard S. MacDonald, Gregory N. Nielson, Roger L. Jungerman
  • Patent number: 9559219
    Abstract: A method including providing a substrate comprising a device layer on which a plurality of device cells are defined; depositing a first dielectric layer on the device layer and metal interconnect such that the deposited interconnect is electrically connected to at least two of the device cells; depositing a second dielectric layer over the interconnect; and exposing at least one contact point on the interconnect through the second dielectric layer. An apparatus including a substrate having defined thereon a device layer including a plurality of device cells; a first dielectric layer disposed directly on the device layer; a plurality of metal interconnects, each of which is electrically connected to at least two of the device cells; and a second dielectric layer disposed over the first dielectric layer and over the interconnects, wherein the second dielectric layer is patterned in a positive or negative planar spring pattern.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: January 31, 2017
    Assignee: Sandia Corporation
    Inventors: Murat Okandan, Gregory N. Nielson, Jose Luis Cruz-Campa, Carlos Anthony Sanchez
  • Patent number: 9548411
    Abstract: Various technologies described herein pertain to assembling electronic devices into a microsystem. The electronic devices are disposed in a solution. Light can be applied to the electronic devices in the solution. The electronic devices can generate currents responsive to the light applied to the electronic devices in the solution, and the currents can cause electrochemical reactions that functionalize regions on surfaces of the electronic devices. Additionally or alternatively, the light applied to the electronic devices in the solution can cause the electronic devices to generate electric fields, which can orient the electronic devices and/or induce movement of the electronic devices with respect to a receiving substrate. Further, electrodes on a receiving substrate can be biased to attract and form connections with the electronic devices having the functionalized regions on the surfaces. The microsystem can include the receiving substrate and the electronic devices connected to the receiving substrate.
    Type: Grant
    Filed: October 23, 2013
    Date of Patent: January 17, 2017
    Assignee: Sandia Corporation
    Inventors: Gregory N. Nielson, Murat Okandan
  • Patent number: 9531322
    Abstract: A PV system composed of sub-arrays, each having a group of PV cells that are electrically connected to each other. A power management circuit for each sub-array has a communications interface and serves to connect or disconnect the sub-array to a programmable power grid. The power grid has bus rows and bus columns. A bus management circuit is positioned at a respective junction of a bus column and a bus row and is programmable through its communication interface to connect or disconnect a power path in the grid. As a result, selected sub-arrays are connected by selected power paths to be in parallel so as to produce a low system voltage, and, alternately in series so as to produce a high system voltage that is greater than the low voltage by at least a factor of ten.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: December 27, 2016
    Assignee: Sandia Corporation
    Inventors: Murat Okandan, Gregory N. Nielson