Abstract: A method of manufacturing a photo-radiation source comprising the steps of providing a first planar conductor; disposing a formation of light emitting chips on the first planar conductor, each chip having a cathode and an anode, one of the cathode and anode of each chip being in contact with the first planar conductor. The method of manufacturing a photo-radiation source also includes the steps of disposing a second planar conductor on top of a formation of light emitting chips so that the second planar conductor is in contact with the other of the cathode and anode of each chip; and binding the first planar conductor to the second planar conductor to permanently maintain the formation of light emitting chips without the use of solder or wiring bonding for making an electrical and mechanical contact between the chips and either of the first planar conductor and the second planar conductor.

Abstract: Device structures for sheets of light active material. A first substrate has a transparent first conductive layer. A pattern of light active semiconductor elements are fixed to the first substrate. The light active semiconductor elements have an n-side and a p-side. Each light active semiconductor element has either of the n-side or the p-side in electrical communication with the transparent conductive layer. A second substrate has a second conductive layer. An adhesive secures the second substrate to the first substrate so that the other of said n-side or said p-side of each said light active semiconductor element is in electrical communication with the second conductive layer. Thus forming a solid-state light active device.

Abstract: A method of making a light active sheet. A bottom substrate having an electrically conductive surface is provided. A hotmelt adhesive sheet is provided. Light active semiconductor elements, such as LED die, are embedded in the hotmelt adhesive sheet. The LED die each have a top electrode and a bottom electrode. A top substrate is provided having a conductive layer. The hotmelt adhesive sheet with the embedded LED die is inserted between the electrically conductive surface and the conductive layer to form a lamination. The lamination is run through a heated pressure roller system to melt the hotmelt adhesive sheet and electrically insulate and bind the top substrate to the bottom substrate. As the hotmelt sheet is softened, the LED die breakthrough so that the top electrode comes into electrical contact with the conductive layer of the top substrate and the bottom electrode comes into electrical contact with the electrically conductive surface of the bottom substrate.

Abstract: An electronically active sheet includes a bottom substrate having a bottom electrically conductive surface. A top substrate having a top electrically conductive surface is disposed facing the bottom electrically conductive surface. An electrical insulator separates the bottom electrically conductive surface from the top electrically conductive surface. At least one bare die electronic element is provided having a top conductive side and a bottom conductive side. Each bare die electronic element is disposed so that the top conductive side is in electrical communication with the top electrically conductive surface and so that the bottom conductive side is in electrical communication with the bottom electrically conductive surface.

Abstract: An electronically active sheet, comprising a first substrate having an electrically conductive surface; a second substrate having an electrically conductive pattern disposed thereon; at least one semiconductor element having a first conductor and a second conductor. The electronically active sheet includes an adhesive having at least one semiconductor element fixed thereto and disposed between the electrically conductive surface and the electrically conductive pattern to form a lamination. The adhesive is activatable to bind the second substrate to the first substrate so that one of the first conductor and the second conductor of the at least one semiconductor element is automatically brought into electrical communication with the electrically conductive pattern and so that the other of the first conductor and the second conductor of the at least one semiconductor element is automatically brought into and maintained in electrical communication with the electrically conductive surface of the first substrate.

Abstract: The present invention relates to the use of vacuum packaging and vacuum packaging techniques. Embodiments of the present invention include bales and packages comprising a sealed chamber having an internal volume at a pressure less than ambient atmospheric pressure. In alternate embodiments of the present invention, the internal volume of the package comprises a bulk material, a bulk fiber material, fibers or fibrous materials. Also disclosed are methods for packaging, packaging systems and apparatus for packaging.

Abstract: An encapsulated semiconductor device, comprising a first substrate having an electrically conductive surface; a second substrate having an electrically conductive pattern disposed thereon; and a pattern of semiconductor elements, each of the semiconductor elements having a first conductor and a second conductor.

Abstract: An energy-saving assembly of an elongate low-pressure mercury vapor discharge lamp (1) and at least one elongate extension means (2). The low-pressure mercury vapor discharge lamp comprises a light-transmitting discharge vessel (10) enclosing, in a gastight manner, a discharge space (15) provided with a filling of mercury and a rare gas mixture. The rare gas mixture comprises at least 50% by volume of krypton. The discharge vessel is provided with a luminescent layer (13). Electrodes (4a; 4b) are arranged in the discharge space for maintaining a discharge in the discharge space. The extension means are provided for connection to the low-pressure mercury vapor discharge lamp. The extension means comprises an inductance (3). The length of the low-pressure mercury vapor discharge lamp together with the length of the extension means is adapted to fit a pre-determined mounting distance of low-pressure mercury vapor discharge lamps.

Abstract: The present invention relates to the use of vacuum packaging and vacuum packaging techniques. Embodiments of the present invention include bales and packages comprising a sealed chamber having an internal volume at a pressure less than ambient atmospheric pressure. In alternate embodiments of the present invention, the internal volume of the package comprises a bulk material, a bulk fiber material, fibers or fibrous materials. Also disclosed are methods for packaging, packaging systems and apparatus for packaging.

Abstract: A V-quad engine has two juxtaposed V-twin cylinder banks connected to a common crankshaft and fuel and ignition systems that cause the front cylinders in the two banks to fire simultaneously and the rear cylinders in the two banks to fire simultaneously. Conventional V-twin components are used for many components of the V-quad engine. Master-slave rocker shaft assemblies are provided with angularly adjustable links to drive the left bank rocker shafts in unison with the right bank rocker shafts.

Abstract: A method of manufacturing a photo-radiation source comprising the steps of providing a first planar conductor; disposing a formation of light emitting chips on the first planar conductor, each chip having a cathode and an anode, one of the cathode and anode of each chip being in contact with the first planar conductor. The method of manufacturing a photo-radiation source also includes the steps of disposing a second planar conductor on top of a formation of light emitting chips so that the second planar conductor is in contact with the other of the cathode and anode of each chip; and binding the first planar conductor to the second planar conductor to permanently maintain the formation of light emitting chips without the use of solder or wiring bonding for making an electrical and mechanical contact between the chips and either of the first planar conductor and the second planar conductor.

Abstract: A tool and method for automatically producing near-optimal code sequences are particularly useful for generating near-optimal code sequences in inner loops, crucial subroutines, and device drivers. As a novel functional and architectural strategy, the invention contemplates applying technologies that would be normally in automatic theorem proving to the problem of automatic code generation. The aspect of the automatic theorem proving is realized by matching followed by planning with satisfiability search. Notably also, the present invention targets a goal-oriented, cycle budget limited code sequence in producing the near-optimal code sequence.

Abstract: Locking structure for thermoformed plastic containers for food and other articles wherein the lid and the base of the containers are provided with locking means, specifically a detent and a tab. The detent, which depends from the front of the lid, has rounded ends and an inwardly extending lip disposed on its outer side. The tab, which depends from the front of the base, has an upper surface, a lower surface, and two end surfaces. The upper surface is angled toward the lower surface and the end surfaces are substantially flat. The upper surface and the inwardly extending lip are constructed and arranged with respect to each other so that when the detent is pressed into the tab the inwardly extending lip will snap into position beneath the upper surface and interlock with it to lock the lid and base.

Abstract: The present invention relates to vacuum packaging and vacuum packaging techniques. Embodiments of the present invention include bales and packages comprising a sealed chamber having an internal volume at a pressure less than ambient atmospheric pressure. In various embodiments of the present invention, the internal volume of the package comprises a bulk material, a bulk fiber material, fibers or fibrous materials. Also disclosed are methods for packaging, packaging systems and apparatus for packaging.

Abstract: System and method for validating a payment. The method can include obtaining a first account identifier, accessing a database containing a plurality of risk scores, each one of the plurality of risk scores being associated with one of a plurality of account identifiers, obtaining a first risk score from the plurality of risk scores, the first risk score being associated with the first account identifier, and determining an acceptance decision by comparing the first risk score against a risk threshold value.

Abstract: The present invention provides isolated nucleic acid and amino acid sequences of sweet taste receptors comprising two heterologous G-protein coupled receptor polypeptides from the T1R family of sensory G-protein coupled receptors, antibodies to such receptors, methods of detecting such nucleic acids and receptors, and methods of screening for modulators of sweet taste receptors.

Abstract: A method for making a sheet of light active material. A first substrate is provided having a transparent first conductive layer. A pattern of light active semiconductor elements are formed. The pattern of light active semiconductor elements may be formed using an electrostatic attraction and transferring process. The light active semiconductor elements have an n-side and a p-side. Each light active semiconductor element has either of the n-side or the p-side in electrical communication with the transparent conductive layer. A second substrate having a second conductive layer is provided. The second substrate is secured to the first substrate so that the other of said n-side or said p-side of each said light active semiconductor element in electrical communication with the second conductive layer. Thus, a solid-state sheet of light active material is formed.

Abstract: A method of making a light active sheet. A bottom substrate having an electrically conductive surface is provided. A hotmelt adhesive sheet is provided. Light active semiconductor elements, such as LED die, are embedded in the hotmelt adhesive sheet. The LED die each have a top electrode and a bottom electrode. A top transparent substrate is provided having a transparent conductive layer. The hotmelt adhesive sheet with the embedded LED die is inserted between the electrically conductive surface and the transparent conductive layer to form a lamination. The lamination is run through a heated pressure roller system to melt the hotmelt adhesive sheet and electrically insulate and bind the top substrate to the bottom substrate.

Abstract: Device structures for sheets of light active material. A first substrate has a transparent first conductive layer. A pattern of light active semiconductor elements are fixed to the first substrate. The light active semiconductor elements have an n-side and a p-side. Each light active semiconductor element has either of the n-side or the p-side in electrical communication with the transparent conductive layer. A second substrate has a second conductive layer. An adhesive secures the second substrate to the first substrate so that the other of said n-side or said p-side of each said light active semiconductor element is in electrical communication with the second conductive layer. Thus forming a solid-state light active device.

Abstract: A photo-radiation source for the selective polymerization of photo-radiation-curable organic material. In a first embodiment, a first electrode is provided with a second electrode disposed adjacent to the first electrode, and defining a gap therebetween. A photo-radiation emission layer is disposed in the gap. The photo-radiation emission layer includes a charge-transport matrix material and an emissive particulate dispersed within the charge-transport matrix material. The emissive particulate receives electrical energy through the charge-transport matrix material applied as a voltage to the first electrode and the second electrode photo-radiation. The emissive particulate generates photo-radiation in response to the applied voltage. This photo-radiation is effective for the selective polymerization of photo-radiation curable organic material.