Patents by Inventor Gregory Nolan Nielson

Gregory Nolan Nielson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220349084
    Abstract: Various technologies are described herein pertaining to electrochemical etching of a semiconductor controlled by way of a laser that emits light with an energy below a bandgap energy of the semiconductor.
    Type: Application
    Filed: July 10, 2022
    Publication date: November 3, 2022
    Inventor: Gregory Nolan Nielson
  • Patent number: 11421338
    Abstract: Various technologies are described herein pertaining to electrochemical etching of a semiconductor controlled by way of a laser that emits light with an energy below a bandgap energy of the semiconductor.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: August 23, 2022
    Assignee: NIELSON SCIENTIFIC, LLC
    Inventor: Gregory Nolan Nielson
  • Publication number: 20210104410
    Abstract: Various technologies are described herein pertaining to electrochemical etching of a semiconductor controlled by way of a laser that emits light with an energy below a bandgap energy of the semiconductor.
    Type: Application
    Filed: March 30, 2018
    Publication date: April 8, 2021
    Inventor: Gregory Nolan Nielson
  • Publication number: 20210020576
    Abstract: Various three-dimensional devices that can be formed within the bulk of a semiconductor by photo-controlled selective etching are described herein. With more particularity, semiconductor devices that incorporate three-dimensional electrical vias, waveguides, or fluidic channels that are disposed within a semiconductor are described herein. In an exemplary embodiment, a three-dimensional interposer chip includes an electrical via, a waveguide, and a fluidic channel, wherein the via, the waveguide, and the fluidic channel are disposed within the body of a semiconductor element rather than being deposited on a surface. The three-dimensional interposer is usable to make electrical, optical, or fluidic connections between two or more devices.
    Type: Application
    Filed: March 27, 2019
    Publication date: January 21, 2021
    Inventor: Gregory Nolan Nielson
  • Publication number: 20200190452
    Abstract: Three-dimensional scaffolds to facilitate engineered tissue growth are described herein. An exemplary scaffold comprises a first capillary element, a second capillary element, and a connective element that spans a distance between the first capillary element and the second capillary element, connecting the capillary elements. Tissues can be grown within the scaffold such that the tissues have highly vascularized structures with many capillaries running throughout. The scaffolds can be fabricated by selective electrochemical etching of a semiconductor element. The electrochemical etching can be controlled by way of a laser configured to stimulate multiphoton absorption in the semiconductor.
    Type: Application
    Filed: September 5, 2018
    Publication date: June 18, 2020
    Inventor: Gregory Nolan Nielson