Abstract: An extended area “cavity type” blackbody for use as a radiometric reference for imaging systems may have a well in the form of a cube having four sidewalls and a back wall, and open at the front. The temperature of the back wall may be controlled independently of the temperature(s) of the sidewalls. This system may produce infrared radiance closer to an ideal radiator than typical extended area sources. A “simple” blackbody is disclosed, having a source plate with a front emitting surface; a ledge element disposed in front of and below the source plate for heating air in front of the source plate; and (optionally) another ledge element disposed in front of and above the source plate for cooling air in front of the source plate. A housing may support the source plate and ledge element, and a vent may be provided in front of and above the source plate. A resistive heater may be associated with the ledge element; and (optionally) TECs may be associated with the other (cooling) ledge element.

Abstract: In an infrared (IR) scene projector device or thermal emission array comprising a plurality of vertically aligned carbon nanotubes disposed proximate to a thermally conductive substrate, the plurality of carbon nanotubes (CNTs) may be (i) arranged as in FIGS. 2 and 4B as a sparsely populated forest, with large gaps between the CNTs; or (ii) arranged as in FIGS. 3 and 4C as patches (clusters) of CNTs separated by gaps; or (iii) arranged as a combination of clusters separated by gaps wherein each cluster comprises a sparsely populated forest of CNTs.

Abstract: An extended area “cavity type” blackbody for use as a radiometric reference for imaging systems may have a well in the form of a cube having four sidewalls and a back wall, and open at the front. The temperature of the back wall may be controlled independently of the temperature(s) of the sidewalls. This system may produce infrared radiance closer to an ideal radiator than typical extended area sources. A “simple” blackbody is disclosed, having a source plate with a front emitting surface; a ledge element disposed in front of and below the source plate for heating air in front of the source plate; and (optionally) another ledge element disposed in front of and above the source plate for cooling air in front of the source plate. A housing may support the source plate and ledge element, and a vent may be provided in front of and above the source plate. A resistive heater may be associated with the ledge element; and (optionally) TECs may be associated with the other (cooling) ledge element.

Abstract: A method for making thermally conductive high aspect ratio large area contact between devices while reducing the heating of the devices. The method of the invention includes the use of reactive foils to solder two devices together at room temperature while imparting significantly less temperature rise and resultant residual stress in the bulk devices when compared with conventional reflow solder techniques.

Abstract: A method for making thermally conductive high aspect ratio large area contact between devices with different coefficients of thermal expansion. The method of the invention includes the creation or placement of sparse structures on at least one of two surfaces or between the surfaces to maintain enough thickness that an interposed bonding material remains sufficiently compliant that relative thermal motion of the two devices can occur without damage to the devices or the bond during changes in temperature.