Abstract: A system, device, and method for minimizing x-axis and/or y-axis offset shift due to internally produced as well as externally produced on chip temperature imbalances. At least one temperature gradient canceling device is disposed on a substrate including a temperature gradient sensitive device having at least one pair of sensors. Voltage signals generated by the temperature gradient canceling devices can be combined with voltage signals generated by each of the pair of sensors to account for the offset.

Abstract: A system, device, and method for minimizing x-axis and/or y-axis offset shift due to internally produced as well as externally produced on chip temperature imbalances. At least one temperature gradient canceling device is disposed on a substrate including a temperature gradient sensitive device having at least one pair of sensors. Voltage signals generated by the temperature gradient canceling devices can be combined with voltage signals generated by each of the pair of sensors to account for the offset.

Abstract: A thermal accelerometer device that provides a compensation for sensitivity variations over temperature. The thermal accelerometer includes signal conditioning circuitry operative to receive analog signals representing a differential temperature is indicative of a sensed acceleration. The signal conditioning circuitry includes serially connected A-to-D and D-to-A converters, which implement a temperature dependent function and process the received signals to provide a compensation for sensitivity variations over a range of ambient temperature. To provide a ratiometric compensation for variations in power supply voltage, a buffered voltage proportional to the supply voltage is provided as a reference voltage to the D-to-A converter. The thermal accelerometer includes a self-test circuit for verifying the integrity of a heater, temperature sensors, and circuitry included within the device.

Abstract: An integrated convective accelerometer device. The device includes a thermal acceleration sensor having a thermopile and a heater element; control circuitry for providing closed-loop control of the thermopile common-mode voltage; an instrumentation amplifier; clock generation circuitry; voltage reference circuitry; a temperature sensor; and, output amplifiers. The device can be operated in an absolute or ratiometric mode. Further, the device is formed in a silicon substrate using standard semiconductor processes and is packaged in a standard integrated circuit package.

Abstract: A fail safe voice system and method for digital telephone networks. The system provides for operation of voice telephone equipment at a customer location when a fault occurs at the customer location. The system has a central office with an analog line termination/digital transceiver connected to subscriber loop lines. The customer location has a digital transceiver/analog station set interface connected to the subscriber loop lines and to the voice telephone equipment. In response to a fault at the customer location the voice telephone equipment is connected directly to the subscriber loop lines thereby eliminating the digital transceiver/analog station set interface.

Abstract: A telephone conference system includes a conference bridge for coupling multiple conference ports associated with corresponding conference stations. The bridge includes means for summing incoming signals from all the conference ports and supplying the summed signals to all the conference ports. A differential amplifier is connected to each of the conference ports and differentially receives (1) incoming signals at the corresponding conference port and (2) the output of the summing means so as to cancel from the output of the summing means any signal received by the summing means from the corresponding conference port. Thus, the differential amplifier passes only that portion of the output of the summing means that is received from conference ports other than the particular port to which that differential amplifier is connected.