Abstract: An electronic assembly including a thermal capacitor. An electronic substrate of the electronic assembly includes one or more insulating layers and one or more conductor layers provided along the one or more insulating layers. The one or more conductor layers including a conductive material. A shape memory thermal capacitor is received in the electronic substrate. The shape memory thermal capacitor includes a shape memory core including a shape memory material.

Abstract: An electronic assembly including a thermal capacitor. An electronic substrate of the electronic assembly includes one or more insulating layers and one or more conductor layers provided along the one or more insulating layers. The one or more conductor layers including a conductive material. A shape memory thermal capacitor is received in the electronic substrate. The shape memory thermal capacitor includes a shape memory core including a shape memory material.

Abstract: A manifold structure and method of forming a structure having at least one enclosed cavity includes using an ultrasonic additive manufacturing (UAM) process to build up a solid component, forming a cavity in the solid component, filling the cavity with a sacrificial material, using a UAM process to build up a finstock layer over the cavity filled with the powder material to enclose the cavity and form the enclosed cavity, and removing the sacrificial material from the enclosed cavity after the finstock layer is ultrasonically welded to the solid component. The sacrificial material has an adequate density to support the UAM process of forming the finstock layer over the cavity and the material may be removed from the enclosed cavity, resulting in an enclosed cavity having smooth surfaces with an optimal fluid flow area therethrough.

Abstract: A manifold structure and method of forming a structure having at least one enclosed cavity includes using an ultrasonic additive manufacturing (UAM) process to build up a solid component, forming a cavity in the solid component, filling the cavity with a sacrificial material, using a UAM process to build up a finstock layer over the cavity filled with the powder material to enclose the cavity and form the enclosed cavity, and removing the sacrificial material from the enclosed cavity after the finstock layer is ultrasonically welded to the solid component. The sacrificial material has an adequate density to support the UAM process of forming the finstock layer over the cavity and the material may be removed from the enclosed cavity, resulting in an enclosed cavity having smooth surfaces with an optimal fluid flow area therethrough.

Abstract: A cooling system for cooling a heat source includes a monolithic structure having a plurality of embedded cooling channels arranged in a multi-planar arrangement, the embedded cooling channels configured to carry a cooling fluid to a plurality of locations throughout the monolithic structure, the cooling fluid configured to absorb heat transferred from a heat source associated with the monolithic structure. The monolithic structure is formed integrally with the embedded cooling channels using an additive manufacturing process.

Abstract: A cooling system for cooling a heat source includes a monolithic structure having a plurality of embedded cooling channels arranged in a multi-planar arrangement, the embedded cooling channels configured to carry a cooling fluid to a plurality of locations throughout the monolithic structure, the cooling fluid configured to absorb heat transferred from a heat source associated with the monolithic structure. The monolithic structure is formed integrally with the embedded cooling channels using an additive manufacturing process.