Patents by Inventor Gregory P. Valenti

Gregory P. Valenti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low thermal resistance spring biased RF semiconductor package mounting structure
    Patent number: 5825089
    Abstract: A ceramic package and mounting structure which requires less surface area on a heat sink and improves heat transfer to the heat sink. Each ceramic package has a top side and a bottom side with the bottom side being flat and smooth. The bottom side can be a polished ceramic, or metal layer which is plated or brazed to the bottom side. The mounting structure includes a clamp and a spring in pressure engagement with the top side of the package for maintaining the package in pressure engagement with the heat sink.
    Type: Grant
    Filed: September 30, 1996
    Date of Patent: October 20, 1998
    Assignee: Spectrian, Inc.
    Inventors: Gregory P. Valenti, Howard D. Bartlow, David S. Piazza