Abstract: An electrical backplane makes high density electrical connections with logic boards in a computer system. The electrical backplane is comprised of an assembly pressure connector and a connector interconnect board that connects the logic boards to external wiring. The assembly pressure connector has electrical contact bumps on its surfaces for making electrical connections with contact points on the surface of the logic boards. The assembly pressure connector prevents the permanent deformation of its electrical contact bumps by using resilient bumps. The resilient bumps are formed from the end portions of interconnecting wires extending through the assembly pressure connector. The interconnecting wires are bent in the shape of a leaf spring. Thus, the wires are compressed within the elastic range of their composing material and are not permanently deformed by the force applied to the assembly pressure connector.