Patents by Inventor Gregory R. Dietz

Gregory R. Dietz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adaptable MMIC array
    Patent number: 6180437
    Abstract: A footprint for adaptable MMIC arrays is disclosed in which the size, number and location of the array components is optimized for the fabrication by depositing a personalizing metal interconnecting layer on the array, of essentially any MMIC circuit from a single footprint layout.
    Type: Grant
    Filed: January 27, 1998
    Date of Patent: January 30, 2001
    Assignee: Northrop Grumman Corporation
    Inventors: Sanjay B. Moghe, Gregory R. Dietz, Howard N. Fudem
  • Adaptable MMIC array
    Patent number: 5757041
    Abstract: A footprint for adaptable MMIC arrays is disclosed in which the size, number and location of the array components is optimized for the fabrication by depositing a personalizing metal interconnecting layer on the array, of essentially any MMIC circuit from a single footprint layout.
    Type: Grant
    Filed: September 11, 1996
    Date of Patent: May 26, 1998
    Assignee: Northrop Grumman Corporation
    Inventors: Sanjay B. Moghe, Gregory R. Dietz, Howard N. Fudem
  • Self stabilizing heater controlled oscillating transistor
    Patent number: 5517053
    Abstract: A frequency stable oscillating device includes an oscillating transistor. A heating element is disposed in close proximity to the oscillating transistor. A temperature sensor is mounted in close proximity to the oscillating transistor. A temperature control device supplies a variable signal which is dependant upon a local temperature of the oscillating transistor, wherein the variable signal controls the operation of the heating element. The heating element may alternately consist of one or more resistive patches, or one or more heating transistors which are biased to provide sufficient heating. The oscillating device may be formed from either IC or MMIC technologies, and may be formed from either silicon or GaAs.
    Type: Grant
    Filed: January 9, 1995
    Date of Patent: May 14, 1996
    Assignee: Northrop Grumman Corporation
    Inventors: Gregory R. Dietz, Sanjay Moghe, Richard R. Becker