Abstract: A conductive seal comprises a central opening that can be disposed proximate to a lower surface of a diaphragm in a pressure sense die. A set of electrically conductive elements can be disposed directly over electrically conductive bonding pads on the pressure sense die in such a manner that a number of electrically molded leads can be in electrical contact with the pressure sense die. A set of electrically insulating elements can be placed adjacent to the conductive elements. The conductive elements can be located away from edges of the conductive seal, towards the central opening of the conductive seal without minimizing the insulation between the central opening and the conductive elements of the seal. Therefore, the conductive seal can prevent the pressure sense die and other electrical circuitry from die-edge shorting in order to achieve long-term sensor reliability and performance.

Abstract: A pressure transducer is provided which incorporates numerous stress reducing characteristics. A pressure sensor is mounted to a ceramic plate with a buffer plate there between to isolate the pressure sensor from stresses that could be transmitted through the ceramic plate. The ceramic plate is necessary for the purpose of supporting a plurality of electronic components which comprise an amplification and compensation circuit. The ceramic plate is separated from all parts of its housing except a minimal central surface on a support boss which provides the support for the pressure sensitive device. Electrical communication between conductive paths on the ceramic plate and terminals extending through the housing is provided by flexible electrical conductors. A cover is attached to the housing with snap acting contact which further isolate the housing from the cap.