Patents by Inventor Gregory S. Meyer
Gregory S. Meyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240122502Abstract: One or more radar sensors can be used to monitor patients in a variety of different environments and embodiments. In one embodiment, radar sensors can be used to monitor a patient's breathing, including monitoring of tidal volume, chest expansion distance, breathing rate, etc. In another embodiment, a patient position can be monitored in a patient bed, which can be used as feedback for control of bladders of a patient bed. Additional embodiments are described herein.Type: ApplicationFiled: December 14, 2023Publication date: April 18, 2024Inventors: Stacey A. Fitzgibbons, David L. Ribble, Eric R. Meyer, Michael S. Hood, Gregory J. Shannon, Yue Wang, Charles A. Lachenbruch (Deceased), Steven D. Baker
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Patent number: 7697305Abstract: An apparatus is provided comprising a chassis of a sheet of an electrically conductive material having a substantially non-conductive coating. An exposed portion of the chassis can be deformed to provide at least one protrusion such that the non-conductive coating on the at least one protrusion is thinner than a portion of the sheet spaced apart from the at least one protrusion to provide a conductivity path through the sheet.Type: GrantFiled: April 27, 2007Date of Patent: April 13, 2010Assignee: Hewlett-Packard Development Company, L.P.Inventors: Gregory S. Meyer, Karl Conrad
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Patent number: 7646595Abstract: A computing device includes a baseboard, a memory coupled to the baseboard, an input/output coupled to the baseboard and a processor system coupled to the baseboard. The processor system includes a circuit board, a central electronic control coupled to the circuit board and a processor component. The device further includes a first structure coupling the processor component to the circuit board and retaining the processor component relative to the circuit board at a selected one of a plurality of positions in both directions along an axis perpendicular to the circuit board. The first structure is movably coupled to one of the processor component and the circuit board for movement in a direction perpendicular to the first axis at least prior to being coupled to the other of the processor component and the circuit board.Type: GrantFiled: February 20, 2008Date of Patent: January 12, 2010Assignee: Hewlett-Packard Development Company, L.P.Inventors: Stephan K. Barsun, Gregory S. Meyer, Bryan D. Bolich, S. Daniel Cromwell
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Publication number: 20080264663Abstract: An apparatus is provided comprising a chassis of a sheet of an electrically conductive material having a substantially non-conductive coating. An exposed portion of the chassis can be deformed to provide at least one protrusion such that the non-conductive coating on the at least one protrusion is thinner than a portion of the sheet spaced apart from the at least one protrusion to provide a conductivity path through the sheet.Type: ApplicationFiled: April 27, 2007Publication date: October 30, 2008Inventors: Gregory S. Meyer, Karl Conrad
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Publication number: 20080204993Abstract: A computing device includes a baseboard, a memory coupled to the baseboard, an input/output coupled to the baseboard and a processor system coupled to the baseboard. The processor system includes a circuit board, a central electronic control coupled to the circuit board and a processor component. The device further includes a first structure coupling the processor component to the circuit board and retaining the processor component relative to the circuit board at a selected one of a plurality of positions in both directions along an axis perpendicular to the circuit board. The first structure is movably coupled to one of the processor component and the circuit board for movement in a direction perpendicular to the first axis at least prior to being coupled to the other of the processor component and the circuit board.Type: ApplicationFiled: February 20, 2008Publication date: August 28, 2008Inventors: Stephan K. Barsun, Gregory S. Meyer, Bryan D. Bolich, S. Daniel Cromwell
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Patent number: 7345891Abstract: A circuit board assembly includes a circuit board, an electronic component and a structure coupling the electronic component to the circuit board. The structure retains the electronic component relative to the circuit board at a selected one of a plurality of positions in both directions along an axis perpendicular to the circuit board. The structure is movably coupled to one of the electronic component and the circuit board in a direction perpendicular to the axis at least prior to being coupled to the other of the electronic component and the circuit board.Type: GrantFiled: October 7, 2003Date of Patent: March 18, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventors: Stephan K. Barsun, Gregory S. Meyer, Bryan D. Bolich, S. Daniel Cromwell
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Patent number: 7112069Abstract: An apparatus for adjoining along a mating axis a first and second circuit board to directly mate a first integrated connector of the first board with a second integrated connector of the second board is disclosed. The apparatus comprises an attachment plate to be supported in a substantially horizontal plane; a plurality of extension arms extending downward from the plate to suspendingly restrain the first board away from the plate; at least one stop configured to be secured to the distal end of one of the plurality of extension arms to support the first board in suspension away from the plate; and a plurality of attachment elements to secure the plate to the second circuit board without applying substantial forces to the first circuit board.Type: GrantFiled: August 18, 2005Date of Patent: September 26, 2006Assignee: Hewlett-Packard Development Company, L.P.Inventors: Alisa Sandoval, Gregory S. Meyer
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Patent number: 7061126Abstract: A circuit board assembly includes a circuit board, an electronic component, a plurality of incremental detents and at least one projection. The plurality of incremental detents are coupled to one of the circuit board and the electronic component and are retained relative to said one of the circuit board and the electronic component against linear movement in both directions along a first axis. The at least one projection is coupled to the other of the circuit board and the electronic component and is retained against linear movement along the first axis. The at least one projection is received within at least one of the plurality of detents to retain the electronic component relative to the circuit board against linear movement in both directions along the axis.Type: GrantFiled: October 7, 2003Date of Patent: June 13, 2006Assignee: Hewlett-Packard Development Company, L.P.Inventors: Gregory S. Meyer, Stephan K. Barsun, Bryan D. Bolich, S. Daniel Cromwell
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Patent number: 7056144Abstract: A computing system includes a circuit board, a first connector portion electrically connected to the circuit board, an electronic component and a plurality of resilient support members. The electronic component includes a first electronic device, a second connector portion electrically coupled to the electronic device and connected to the first connector portion along an axis. The plurality of resilient support members are asymmetrically located about the axis and extend between the device and the circuit board.Type: GrantFiled: February 19, 2004Date of Patent: June 6, 2006Assignee: Hewlett-Packard Development Company, L.P.Inventors: Stephan K. Barsun, Bryan D. Bolich, Alisa C. Sandoval, Gregory S. Meyer, Richard A. Miner
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Patent number: 6951466Abstract: An apparatus for adjoining along a mating axis a first and second circuit board to directly mate a first integrated connector of the first board with a second integrated connector of the second board is disclosed. The apparatus comprises an attachment plate to be supported in a substantially horizontal plane; a plurality of extension arms extending downward from the plate to suspendingly restrain the first board away from the plate except to permit the first board to translate along the mating axis toward the plate; an pressure platform extending downward from the plate to apply to the first board a mating-axis force collocated with the first connector; and a plurality of attachment elements to secure the plate to the second circuit board without applying forces to the first circuit board. Forces applied to the plate are transferred to the first board through only the pressure platform.Type: GrantFiled: September 2, 2003Date of Patent: October 4, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Alisa Sandoval, Gregory S. Meyer
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Patent number: 6930886Abstract: An electronic component support system includes a vertical support unit having an opening, an electronic component having a chassis positioned within the opening and a securement system. The securement system includes a coupler configured to be releasably coupled to and supported by the vertical support unit prior to being coupled to the chassis and without projecting into the opening, wherein the coupler is coupled to the chassis to secure the chassis against movement in at least one direction relative to the vertical support unit.Type: GrantFiled: April 30, 2003Date of Patent: August 16, 2005Assignee: Hewlett-Packard Development, L.P.Inventors: Richard G. Velez, Gregory S. Meyer
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Patent number: 6872087Abstract: A circuit board assembly and a method for protecting and covering an interface opening of a connector. The circuit board assembly includes a bulkhead member having a bulkhead aperture, a circuit board having a connector with an interface opening and passing through the bulkhead aperture, and a cover member disposed over the interface opening. A coupling member is provided for coupling the cover member to the connector. The method comprises passing the connector including the interface opening through the bulkhead aperture, and releasably covering the interface opening with a cover member that is coupled to the connector.Type: GrantFiled: July 26, 2002Date of Patent: March 29, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Alisa C. Sandoval, Gregory S. Meyer
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Publication number: 20040218368Abstract: An electronic component support system includes a vertical support unit having an opening, an electronic component having a chassis positioned within the opening and a securement system. The securement system includes a coupler configured to be releasably coupled to and supported by the vertical support unit prior to being coupled to the chassis and without projecting into the opening, wherein the coupler is coupled to the chassis to secure the chassis against movement in at least one direction relative to the vertical support unit.Type: ApplicationFiled: April 30, 2003Publication date: November 4, 2004Applicant: Hewlett-Packard Development Company, L.P.Inventors: Richard G. Velez, Gregory S. Meyer
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Patent number: 6793507Abstract: A cable connector riser is provided configured to be positioned between a circuit board side of a receiving connector and a circuit board. The cable connector riser has a base portion having a thickness sufficient to provide clearance for a housing of a mating connector on a cable, the housing including a portion projecting downward towards the circuit board from a bottom surface of the mating connector.Type: GrantFiled: December 13, 2002Date of Patent: September 21, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Alisa C. Sandoval, Chris Womack, Gregory S. Meyer
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Publication number: 20040116000Abstract: A cable connector riser is provided configured to be positioned between a circuit board side of a receiving connector and a circuit board. The cable connector riser has a base portion having a thickness sufficient to provide clearance for a housing of a mating connector on a cable, the housing including a portion projecting downward towards the circuit board from a bottom surface of the mating connector.Type: ApplicationFiled: December 13, 2002Publication date: June 17, 2004Inventors: Alisa C. Sandoval, Chris Womack, Gregory S. Meyer
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Publication number: 20040017665Abstract: A circuit board assembly and a method for protecting and covering an interface opening of a connector. The circuit board assembly includes a bulkhead member having a bulkhead aperture, a circuit board having a connector with an interface opening and passing through the bulkhead aperture, and a cover member disposed over the interface opening. A coupling member is provided for coupling the cover member to the connector. The method comprises passing the connector including the interface opening through the bulkhead aperture, and releasably covering the interface opening with a cover member that is coupled to the connector.Type: ApplicationFiled: July 26, 2002Publication date: January 29, 2004Applicant: HEWLETT-PACKARD COMPANYInventors: Alisa C. Sandoval, Gregory S. Meyer
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Patent number: 6430050Abstract: A method and substrate using a wave spring to clamp a component to the substrate. One embodiment of the invention involves a method to use a wave spring to clamp a component to a substrate. The method includes placing the component on the substrate, placing a structure having holes on the component, placing a number of wave springs on a corresponding number of bolts, inserting the bolts into the holes in the structure, and attaching the bolts to the substrate. A second embodiment of the invention involves a substrate with an electrical contact area, an interposer placed on the electrical contact area, a component placed on the interposer, a block having holes placed on the component, bolts and wave springs inserted in the holes, wherein the bolts and wave springs clamp the component, the interposer and the substrate together on the electrical contact area of the substrate.Type: GrantFiled: May 31, 2001Date of Patent: August 6, 2002Assignee: Hewlett-Packard Co.Inventors: James David Hensley, Stephen Daniel Cromwell, Gregory S. Meyer
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Publication number: 20010046813Abstract: A protective cover for attachment to an electrical connector having a pair of spaced, parallel upstanding walls with a plurality of exposed electrical contacts disposed between inner surfaces of the upstanding walls. The protective cover includes a planar top wall, a pair of spaced, parallel planar side walls and a pair of spaced, parallel planar end walls. The planar side and end walls engage the outer surfaces of the upstanding walls of the electrical connector to removably secure the protective cover to the electrical connector such that the protective cover enshrouds the electrical contacts to protect the electrical contacts from damage and prevent accumulation of dust particles on the electrical contacts. Each of the planar side and end walls has a lower free edge that is radiused to form a lead-in feature that aids in aligning and sliding the protective cover onto the upstanding walls of the electrical connector.Type: ApplicationFiled: March 30, 2000Publication date: November 29, 2001Inventors: Michael J. Greenside, Gregory S. Meyer, Donald G. Pauser
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Patent number: 6315584Abstract: A protective cover for attachment to an electrical connector having a pair of spaced, parallel upstanding walls with a plurality of exposed electrical contacts disposed between inner surfaces of the upstanding walls. The protective cover includes a planar top wall, a pair of spaced, parallel planar side walls and a pair of spaced, parallel planar end walls. The planar side and end walls engage the outer surfaces of the upstanding walls of the electrical connector to removably secure the protective cover to the electrical connector such that the protective cover enshrouds the electrical contacts to protect the electrical contacts from damage and prevent accumulation of dust particles on the electrical contacts. Each of the planar side and end walls has a lower free edge that is radiused to form a lead-in feature that aids in aligning and sliding the protective cover onto the upstanding walls of the electrical connector.Type: GrantFiled: March 30, 2000Date of Patent: November 13, 2001Assignee: Hewlett-Packard CompanyInventors: Michael J. Greenside, Gregory S. Meyer, Donald G. Pauser