Patents by Inventor Gregory Scott Becker

Gregory Scott Becker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radiation sensitive silicone resin composition
    Patent number: 8377634
    Abstract: This invention relates to acrylic functional resin compositions. More particularly, this invention relates to Poly [organ-co-(meth)acryloxyorgano]silsequioxane resins that are curable upon exposure to ultraviolet radiation with photo initiator or upon heating with or without a free radical generator. The resin compositions have high storage stability at room temperature and produces films that are useful as planarization layer, interlayer dielectric, passivation layer, gas permeable layer, negative photoresist, antireflective coating, conformal coating and IC packaging.
    Type: Grant
    Filed: June 3, 2005
    Date of Patent: February 19, 2013
    Assignee: Dow Corning Corporation
    Inventors: John Dean Albaugh, Gregory Scott Becker, Sina Maghsoodi, Eric Scott Moyer, Sheng Wang, Craig Rollin Yeakle
  • Radiation Sensitive Silicone Resin Composition
    Publication number: 20090004606
    Abstract: This invention relates to acrylic functional resin compositions. More particularly, this invention relates to Poly [organ-co-(meth)acryloxyorgano]silsequioxane resins that are curable upon exposure to ultraviolet radiation with photo initiator or upon heating with or without a free radical generator. The resin compositions have high storage stability at room temperature and produces films that are useful as planarization layer, interlayer dielectric, passivation layer, gas permeable layer, negative photoresist, antireflective coating, conformal coating and IC packaging.
    Type: Application
    Filed: June 3, 2005
    Publication date: January 1, 2009
    Applicant: DOW CORNING CORPORATION
    Inventors: John Dean Albaugh, Gregory Scott Becker, Sina Magshoodi, Eric Scott Moyer, Sheng Wang, Craig Rollin Yeakle
  • Semiconductor package and method of preparing same
    Patent number: 6617674
    Abstract: A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepare by the method of the invention.
    Type: Grant
    Filed: February 20, 2001
    Date of Patent: September 9, 2003
    Assignee: Dow Corning Corporation
    Inventors: Gregory Scott Becker, Geoffrey Bruce Gardner, Brian Robert Harkness, Louise Ann Malenfant, Satyendra Kumar Sarmah
  • Semiconductor package and method of preparing same
    Publication number: 20020158317
    Abstract: A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepare by the method of the invention.
    Type: Application
    Filed: February 20, 2001
    Publication date: October 31, 2002
    Inventors: Gregory Scott Becker, Geoffrey Bruce Gardner, Brian Robert Harkness, Louise Ann Malenfant, Satyendra Kumar Sarmah
  • Process for synthesis of silicone resin
    Patent number: 6395825
    Abstract: A method for hydrolyzing chlorosilanes having at least three chlorine atoms bonded to each silicon atom to form silicone resins. The method comprises adding at least one of hydridotrichlorosilane, tetrachlorosilane, or organotrichlorosilane to a two-phase mixture comprising a non-polar organic solvent, an aqueous phase comprising 0 to about 43 weight percent hydrochloric acid, and a surface active compound selected from the group consisting of organosulfates described by formula R2SO4H and alkali metal salts thereof, where R2 is selected from the group consisting of alkyl groups comprising about 4 to 16 carbon atoms and alkylphenyl groups comprising 7 to about 22 carbon atoms.
    Type: Grant
    Filed: April 28, 2000
    Date of Patent: May 28, 2002
    Assignees: Dow Corning Corporation, Dow Corning Asia, Ltd.
    Inventors: Gregory Scott Becker, Leslie Earl Carpenter, II, Russell Keith King, Tetsuyuki Michino, Eric Scott Moyer, Craig Rollin Yeakle
  • Silicone resins and process for synthesis
    Patent number: 6281285
    Abstract: A method for hydrolyzing chlorosilanes having at least three chlorine atoms bonded to each silicon atom to form silicone resins. The method comprises adding at least one of hydridotrichlorosilane, tetrachlorosilane, or organotrichlorosilane to a two-phase mixture comprising a non-polar organic solvent, an aqueous phase comprising 0 to about 43 weight percent hydrochloric acid, and a surface active compound selected from the group consisting of alkylsulphonic acid hydrate, alkali metal salt of alkylsulphonic acid, arysulphonic acid hydrate, and alkali metal salt of arylsulphonic acid.
    Type: Grant
    Filed: June 9, 1999
    Date of Patent: August 28, 2001
    Assignees: Dow Corning Corporation, Dow Corning Asia, Ltd.
    Inventors: Gregory Scott Becker, Leslie Earl Carpenter, II, Russell Keith King, Tetsuyuki Michino, Eric Scott Moyer