Abstract: A tiled display having pixels arranged in rows and columns, and including first and second tiles. The tiles comprise a substrate carrying a matrix of pixels arranged at a pixel pitch. The substrates comprise an edge extending between opposing faces in a depth direction. The substrate edges have a complementary shape, and face one another to establish a seam. The pixel pitch is maintained across the seam. Pixels of the second tile are not interposed between pixels of the first tile. The complementary shape includes a segment of the seam being oblique to the pixel rows, or the substrate edge of the first tile profiled in the depth direction whereby at least a section of the edge is non-perpendicular to the faces. The tiled display can maintain the pixel pitch at the seams at high resolutions (e.g., pixel pitch less than 0.5 mm).

Abstract: Carriers for microelectronics fabrication may include a strengthened substrate formed from glass or glass-ceramic having an average thickness greater than 1.0 mm and less than or equal to 2.0 mm. The strengthened glass substrate may have a single-side surface area greater than or equal to 70,000 mm2. The substrate may also have a compressive stress greater than or equal to 200 MPa and a depth of layer from about 50 ?m to about 150 ?m. The substrate may further include a tensile stress region having a stored elastic energy of less than 40 kJ/m2 providing for a flat fragmentation factor of less than or equal to 5.

Abstract: A tiled display having pixels arranged in rows and columns, and including first and second tiles. The tiles comprise a substrate carrying a matrix of pixels arranged at a pixel pitch. The substrates comprise an edge extending between opposing faces in a depth direction. The substrate edges have a complementary shape, and face one another to establish a seam. The pixel pitch is maintained across the seam. Pixels of the second tile are not interposed between pixels of the first tile. The complementary shape includes a segment of the seam being oblique to the pixel rows, or the substrate edge of the first tile profiled in the depth direction whereby at least a section of the edge is non-perpendicular to the faces. The tiled display can maintain the pixel pitch at the seams at high resolutions (e.g., pixel pitch less than 0.5 mm).

Abstract: A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 ?m and has at least one of: a) a brittleness ratio less than about 9.5 (?m)?1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 ?m and having at least one of: a) a brittleness ratio of less than about 9.5 (?m)?1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2; and then forming a substrate from the selected inorganic material.

Abstract: Carriers for microelectronics fabrication may include a strengthened substrate formed from glass or glass-ceramic having an average thickness greater than 1.0 mm and less than or equal to 2.0 mm. The strengthened glass substrate may have a single-side surface area greater than or equal to 70,000 mm2. The substrate may also have a compressive stress greater than or equal to 200 MPa and a depth of layer from about 50 ?m to about 150 ?m. The substrate may further include a tensile stress region having a stored elastic energy of less than 40 kJ/m2 providing for a flat fragmentation factor of less than or equal to 5.

Abstract: A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 ?m and has at least one of: a) a brittleness ratio less than about 9.5 (?m)?1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 ?m and having at least one of: a) a brittleness ratio of less than about 9.5 (?m)?1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2; and then forming a substrate from the selected inorganic material.

Abstract: A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 ?m and has at least one of: a) a brittleness ratio less than about 9.5 (?m)?1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 ?m and having at least one of: a) a brittleness ratio of less than about 9.5 (?m)?1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2; and then forming a substrate from the selected inorganic material.

Abstract: A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 ?m and has at least one of: a) a brittleness ratio less than about 9.5 (?m)?1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 ?m and having at least one of: a) a brittleness ratio of less than about 9.5 (?m)?1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2; and then forming a substrate from the selected inorganic material.

Abstract: A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 ?m and has at least one of: a) a brittleness ratio less than about 9.5 (?m)?1/2, or b) a fracture toughness of at least about 0.75 MPa.(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 ?m and having at least one of: a) a brittleness ratio of less than about 9.5 (?m)?1/2, or b) a fracture toughness of at least about 0.75 MPa.(m)1/2; and then forming a substrate from the selected inorganic material.

Abstract: A method of making a strengthened glass article includes providing a flat glass article having a select contour and a glass surface covered by a protective coating layer. The protective coating layer is removed from the glass surface without touching the glass surface with any solid object. Immediately after the protective coating layer is removed from the glass surface, the flat glass article is subjected to an ion-exchange process to strengthen the flat glass article and improve the resistance of the flat glass article to subsequent damage.

Abstract: A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 ?m and has at least one of: a) a brittleness ratio less than about 9.5 (?m)?1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 ?m and having at least one of: a) a brittleness ratio of less than about 9.5 (?m)?1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2; and then forming a substrate from the selected inorganic material.

Abstract: Methods of strengthening the edge surfaces of a glass substrate, and particularly glass substrates contained within a display panel, are disclosed. The methods include exposing edges of the display panel to an acid solution for a time and at a temperature effective to remove no more than about 20 micrometers of glass from edge surfaces, rinsing the acid solution from the edge and applying a polymer protective coating the rinsed edge to maintain the post-etching strength of the edge surfaces. Electronics on the display panel that may be exposed to the acid solution are masked with a terminal mask prior to the etching. The edge etching may be combined with etching of a surface of the display panel/cover glass substrate.

Abstract: A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 ?m and has at least one of: a) a brittleness ratio less than about 9.5 (?m)?1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 ?m and having at least one of: a) a brittleness ratio of less than about 9.5 (?m)?1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2; and then forming a substrate from the selected inorganic material.

Abstract: A substrate (100) comprising a sheet of either a glass, a glass ceramic, or a ceramic and having increased edge strength. A polymeric edge coating (120) prevents creation of strength limiting defects along the edges of the substrate and protects the bend strength of the edges. The substrate may also have at least two parallel high strength edges (110, 112) and an edge coating (120) of a polymeric material covering at least a portion of each of the high strength edges to preserve the high strength edges from the introduction of defects and damage to the edges. Each of the two parallel high strength edges has a bend strength that is capable of less than about 2% failure probability at a stress level of 200 MPa over a test length of 50 mm. A method of making the substrate is also provided.

Abstract: Disclosed are controlled chemical etching processes used to modify the geometry of surface flaws in thin glass substrates and glass substrate assemblies formed therefrom, and in particular glass substrates suitable for the manufacture of active matrix displays that are essentially free of alkali metal oxides such as Na2O, K2O and Li2O.

Abstract: Disclosed are controlled chemical etching processes used to modify the geometry of surface flaws in thin glass substrates and glass substrate assemblies formed therefrom, and in particular glass substrates suitable for the manufacture of active matrix displays that are essentially free of alkali metal oxides such as Na2O, K2O and Li2O.

Abstract: Methods of strengthening the edge surfaces of a glass substrate, and particularly glass substrates contained within a display panel, are disclosed. The methods include exposing edges of the display panel to an acid solution for a time and at a temperature effective to remove no more than about 20 micrometers of glass from edge surfaces, rinsing the acid solution from the edge and applying a polymer protective coating the rinsed edge to maintain the post-etching strength of the edge surfaces. Electronics on the display panel that may be exposed to the acid solution are masked with a terminal mask prior to the etching. The edge etching may be combined with etching of a surface of the display panel/cover glass substrate.

Abstract: A method of making a strengthened glass article includes providing a flat glass article having a select contour and a glass surface covered by a protective coating layer. The protective coating layer is removed from the glass surface without touching the glass surface with any solid object. Immediately after the protective coating layer is removed from the glass surface, the flat glass article is subjected to an ion-exchange process to strengthen the flat glass article and improve the resistance of the flat glass article to subsequent damage.

Abstract: Disclosed is an electronic device comprising a glass, glass ceramic, or ceramic sheet having a thickness less than about 0.4 mm and wherein a minimum strength of the inorganic substrate is greater than about 500 MPa. Also disclosed is a method of making an electronic device including drawing a viscous inorganic material to form an inorganic ribbon having opposing as-formed edges along a length of the ribbon, separating the ribbon to form a substrate sheet of inorganic material comprising two as-formed edges and forming a device element on the inorganic substrate.

Abstract: The present disclosure relates to glass articles for use as a touchscreen substrate for use in a portable electronic device, particularly comprising an alkali-free aluminosilicate glass exhibiting a high damage threshold of at least 1000 gf, as measured by the lack of the presence of median/radial cracks when a load is applied to the glass using a Vickers indenter, a scratch resistance of at least 900 gf, as measured by the lack of the presence of lateral cracks when a load is applied by a moving Knoop indenter and a linear coefficient of thermal expansion (CTE) over the temperature range 0-300° C. which satisfies the relationship: 25×10-7/° C.?CTE?40×10-7/° C.