Abstract: There is provided an x-ray detector having a number of x-ray detector sub-modules. Each detector sub-module is an edge-on detector sub-module having an array of detector elements extending in at least two directions, wherein one of the directions has a component in the direction of incoming x-rays. The detector sub-modules are stacked one after the other and/or arranged side-by-side. For at least part of the detector sub-modules, the detector sub-modules are arranged for providing a gap between adjacent detector sub-modules, where at least part of the gap is not directed linearly towards the x-ray focal point of an x-ray source.

Abstract: There is provided an x-ray detector having a number of x-ray detector sub-modules. Each detector sub-module is an edge-on detector sub-module having an array of detector elements extending in at least two directions, wherein one of the directions has a component in the direction of incoming x-rays. The detector sub-modules are stacked one after the other and/or arranged side-by-side. For at least part of the detector sub-modules, the detector sub-modules are arranged for providing a gap between adjacent detector sub-modules, where at least part of the gap is not directed linearly towards the x-ray focal point of an x-ray source.

Abstract: In one embodiment, a radiation detector is provided. The radiation detector includes a scintillator layer that converts incident radiation into lower energy optical photons. The scintillator layer includes a plurality of pixels formed by one or more dividers, and the one or more dividers form one or more radiation pathways through the scintillator layer. The radiation detector also includes a photodetector layer that detects the lower energy photons generated by the plurality of pixels within the scintillator layer and signal electronics that receive signals generated by the photodetector layer. The radiation detector also includes one or more barrier layers disposed between the photodetector layer and the signal electronics. Each barrier layer of the one or more barrier layers includes electrically conductive vias containing a high Z material that blocks radiation from the one or more radiation pathways from reaching the signal electronics.

Abstract: The present disclosure relates to radiation detectors having a layer of a high Z material, such as tungsten or lead, disposed on a face of a photodetector layer or other underlying layer. In one embodiment, the layer of the high Z material substantially prevents radiation from reaching on or more electronics components or circuits, such as an analog-to-digital conversion ASIC or other circuit.

Abstract: A photodiode assembly includes a semiconductor substrate, a photodiode cell, a ground diffusion region, and a guard band. The photodiode cell includes a first volume of the substrate doped with a first type of dopant. The diffusion region includes a second volume of the substrate that is doped with a second, opposite type of dopant. The guard band is disposed in the substrate and at least partially extends around an outer periphery of the photodiode cell. The guard band includes a third volume of the substrate that is doped with the first type of dopant. At least one of the ground diffusion region or the guard band is conductively coupled with a ground reference to conduct one or more of electrons or holes that drift from the photodiode cell through the substrate. The guard band is disposed closer to the photodiode cell than the ground diffusion region.

Abstract: A photodiode assembly includes a semiconductor substrate, a photodiode cell, a ground diffusion region, and a guard band. The photodiode cell includes a first volume of the substrate doped with a first type of dopant. The diffusion region includes a second volume of the substrate that is doped with a second, opposite type of dopant. The guard band is disposed in the substrate and at least partially extends around an outer periphery of the photodiode cell. The guard band includes a third volume of the substrate that is doped with the first type of dopant. At least one of the ground diffusion region or the guard band is conductively coupled with a ground reference to conduct one or more of electrons or holes that drift from the photodiode cell through the substrate. The guard band is disposed closer to the photodiode cell than the ground diffusion region.

Abstract: The present disclosure relates to radiation detectors having a layer of a high Z material, such as tungsten or lead, disposed on a face of a photodetector layer or other underlying layer. In one embodiment, the layer of the high Z material substantially prevents radiation from reaching on or more electronics components or circuits, such as an analog-to-digital conversion ASIC or other circuit.

Abstract: A method of fabricating a detector includes providing a photodiode part, providing a scintillator part, at least one of the photodiode part and the scintillator part including a non-active portion and an active portion, placing a first adhesive such that the first adhesive contacts the active portion when the detector is assembled, placing a second adhesive such that the second adhesive contacts the non-active portion when the detector is assembled, the second adhesive having a faster cure time than the first adhesive, and biasing the photodiode part and the scintillator part toward each other until the second adhesive has cured.

Abstract: A computerized tomography imaging scanner module includes a plurality of scintillators, a plurality of back-illuminated photodiodes optically coupled with the scintillators, a multi-layer substrate having a plurality of substrate electrical conductors to which the photodiodes are electrically coupled, wherein each of the plurality of substrate conductors is connected to a different one of the back-illuminated photodiodes, and a flexible cable having a plurality of flex electrical conductors to which the substrate is electrically coupled, wherein each of the plurality of flex electrical conductors is connected to a different output of the multi-layer substrate.

Abstract: A method of fabricating a detector includes providing a photodiode part, providing a scintillator part, at least one of the photodiode part and the scintillator part including a non-active portion and an active portion, placing a first adhesive such that the first adhesive contacts the active portion when the detector is assembled, placing a second adhesive such that the second adhesive contacts the non-active portion when the detector is assembled, the second adhesive having a faster cure time than the first adhesive, and biasing the photodiode part and the scintillator part toward each other until the second adhesive has cured.

Abstract: A method for obtaining data includes scanning an object with radiation to collect projection data using an imaging system having a detector array with detector cells and a post-patient collimator, wherein the post-patient collimator has plates having non-uniform thicknesses. The method further includes applying a correction to the projection data to shift an effective center of at least some of the detector cells to compensate for the non-uniform thicknesses of the collimator plates.

Abstract: A light detector includes a plurality of light receiving sections which are formed in a substrate and generate signal charges corresponding to the amount of incident light, and a plurality of wirings which are formed on the substrate and fetch the signal charges from the light receiving sections, wherein at least some of the plurality of wirings are disposed so as to overlap with other light receiving sections different from the light receiving sections connected to fetch the signal charges.