Abstract: A method and device for input of alphanumeric data into a machine by a man in a manner of hand writing with no need for softwear-based means for alphabetical characters recognition, which purpose is achieved by defining each alphabetical character as a specific collection of signals, which are produced by actuation of a group of sensors by a hand held stylus, moved by a man along predetermined traceable paths, within which paths said sensors are located in such a manner, that for each alphabetical character location of corresponding sensors form a pattern similar to usual hand written image of that character.

Abstract: The present invention discloses an apparatus and method for transferring heat from a hot electrostatic chuck to an underlying cold plate. Further, the overall structure of the electrostatic chuck in combination with the heat transfer apparatus of the present invention permits the thermal and pressure isolation of the high-temperature, vacuum process chamber containing the work piece processing surface of the electrostatic chuck from the low-temperature, atmospheric pressured heat transfer apparatus of the present invention.

Abstract: A liquid-cooled assembly of heat-generating devices which are mounted on an electrical interconnect structure. A hydraulic interconnect structure transfers coolant between coolant chambers associated with the heat-generating devices. Flexible tubular members form inlets and outlets of the coolant chambers. The flexible tubular mewmbers are radially flexible and axially rigid, and hydraulic interconnect structure is sealed to the tubular members by radially compressed hydraulic seals.

Abstract: A liquid cooled integrated circuit assembly including a plurality of integrated circuit packages for housing and electrically interconnecting integrated circuits, a printed circuit board for mounting the integrated circuit packages, and flexing tubing for supplying coolant to the integrated circuit packages. Each integrated circuit package has a first cavity housing the semiconductor die and a second cavity for receiving the liquid coolant. The integrated circuit is mounted on a portion of the package which forms a wall separating the first and second cavities. Heat is transformed from the integrated circuit to the coolant by the wall separating the cavities. Thus, a minimum number of thermal interference are involved in transferring the heat generated by the integrated circuit and the thermal resistance of the heat transferring structure is approximately one-third of the thermal resistance of conventional packages.