Abstract: An apparatus for dissipating heat generated by components housed within modules on a circuit pack includes a first cover member having a deflectable cantilevered region that is defined by a U-shaped slot. A conductive post is mounted or otherwise formed on the underside of the cantilevered region so that the post extends downwardly into the module when the first cover member is secured to the module housing. The conductive post cooperates with a top surface of a component in the module so that heat generated from the component is transferred from the component through the conductive post and distributed along the first cover member. To further reduce interference caused by electromagnetic radiation passing through the U-shaped slot, a second cover member, which includes an opening that is sized for receiving and passing through the conductive post, is disposed between the module housing and the first cover member.