Abstract: To mitigate voltage droop while reducing the power and space consumed on the board and reducing switching activity, a clock skipping scheme may be implemented for an FPGA. The clock skipping scheme may be implemented in the FPGA design via an Electronic Design Automation (EDA) tool. The EDA tool may define clock skipping cycles based on customer needs for current ramp up speed (e.g., for an inrush current or an operating current) and clock frequency. The EDA tool may adjust clock skipping based on a power target and/or usage conditions of a user software design. In addition to mitigating voltage droop and reducing space consumed on the board and power consumed by the FPGA, the clock skipping scheme may maintain a base clock frequency, enable timing closure at the base clock frequency, and alleviate the need to reclose timing during clock skipping operations.

Abstract: A circuit system includes an interposer comprising conductors and switch circuits coupled to the conductors, a first integrated circuit die coupled to the interposer, and a second integrated circuit die coupled to the interposer. The first integrated circuit die comprises a primary controller circuit for configuring the switch circuits. The second integrated circuit die comprises a secondary controller circuit. The primary controller circuit configures configurable logic circuits in the second integrated circuit die by providing configuration bits to the secondary controller circuit through the interposer.

Abstract: Systems, methods, and devices are provided for configurable die-to-die communication between dies of an integrated circuit system using a programmable routing bridge. Such an integrated circuit system may include a first die on a substrate, a second die on the substrate, and a programmable routing bridge embedded in the substrate. The programmable routing bridge may be mounted to the first die and the second die and is configurable to transfer data between selectable points of the first die and selectable points of the second die.

Abstract: An integrated circuit may include an embedded test processor that is capable of performing in-field testing and repair of hardware-related defects without having to remove the integrated circuit from the customer's board. The test processor can be used to drive and monitor test vectors to performing defect screening on input-output circuitry, logic circuitry including lookup table (LUT) circuits and digital signal processing (DSP) circuits, transceiver circuitry, and configuration random-access memory circuitry. The test processor can generate a failure mechanism report and selectively fix repairable defects via a hardware redundancy scheme. The failure mechanism report allows the customer to identify the root cause of failure in the overall system.

Abstract: A method for designing a system on a target device is disclosed. The system is synthesized from a register transfer level description. The system is placed on the target device. The system is routed on the target device. A configuration file is generated that reflects the synthesizing, placing, and routing of the system for programming the target device. A modification for the system is identified. The configuration file is modified to effectuate the modification for the system without changing the placing and routing of the system.

Abstract: A vehicle seat carpet backer assembly includes a carpet piece and resin/fiber material joined and molded to form a resin/fiber backer panel of a defined shape. A flexible toe-kick portion is provided a seamless transition between the upper carpet portion of the resin/fiber, upper carpet, panel portion and the lower carpet portion of the flexible toe-kick portion. A method includes providing a carpet piece cut to a size and shape and a sized resin/fiber panel material. The resin/fiber panel material is heated and placed with a top section of the carpet in a molding press to fuse them together. A shaped assembly is then formed with flanges which are inserted in channels of a seat. A polypropylene reinforcement sheet is attached to a lower section of the carpet that was not subjected to the molding press. Elastic bands are sewn to the lower edge of the backer assembly.

Abstract: A vehicle seat carpet backer assembly includes a carpet piece and resin/fiber material joined and molded to form a resin/fiber backer panel of a defined shape. A flexible toe-kick portion is provided a seamless transition between the upper carpet portion of the resin/fiber, upper carpet, panel portion and the lower carpet portion of the flexible toe-kick portion. A method includes providing a carpet piece cut to a size and shape and a sized resin/fiber panel material. The resin/fiber panel material is heated and placed with a top section of the carpet in a molding press to fuse them together. A shaped assembly is then formed with flanges which are inserted in channels of a seat. A polypropylene reinforcement sheet is attached to a lower section of the carpet that was not subjected to the molding press. Elastic bands are sewn to the lower edge of the backer assembly.

Abstract: A method for designing a system on a target device is disclosed. The system is synthesized from a register transfer level description. The system is placed on the target device. The system is routed on the target device. A configuration file is generated that reflects the synthesizing, placing, and routing of the system for programming the target device. A modification for the system is identified. The configuration file is modified to effectuate the modification for the system without changing the placing and routing of the system.

Abstract: An integrated circuit may include an embedded test processor that is capable of performing in-field testing and repair of hardware-related defects without having to remove the integrated circuit from the customer's board. The test processor can be used to drive and monitor test vectors to performing defect screening on input-output circuitry, logic circuitry including lookup table (LUT) circuits and digital signal processing (DSP) circuits, transceiver circuitry, and configuration random-access memory circuitry. The test processor can generate a failure mechanism report and selectively fix repairable defects via a hardware redundancy scheme. The failure mechanism report allows the customer to identify the root cause of failure in the overall system.

Abstract: A seat back assembly for a vehicle including a seat back, a pivot device having a pivot axis, and an armrest. The seat back is connected to the pivot device for rotational movement relative to the seat cushion between an upright position and a folded position. The armrest is connected to the pivot device for rotational movement relative to the seat back between a deployed position and retracted position. Both the seat back and the armrest pivot about a common pivot axis. The seat back assembly (1) impedes the rotational movement of the armrest beyond the retracted position; (2) holds the armrest in the retracted position when the seat back is in the fold position; and (3) urges the arm rest from the deployed position to the retracted position during rotational movement of the seat back from the upright position to the folded position.