Abstract: A heat sink assembly includes a heat exchanging section formed by a thermally conductive sheet folded into alternating ridges and troughs defining generally parallel spaced fins having opposite end edges. The folded sheet is formed into a generally cylindrical configuration whereby the troughs form an inner segmented cylinder and the ridges form an outer segmented cylinder generally concentric with the inner cylinder. The heat sink assembly may include a heat conductive rod dimensioned to engage the troughs of the thermally conductive sheet. The ridges of the thermally conductive sheet may also contain apertures to allow air to fully circulate through the fins. The heat sink assembly may also include a fan and a thermally conductive base plate.

Abstract: A heat sink assembly includes a heat exchanging section formed by a thermally conductive sheet folded into alternating ridges and troughs defining generally parallel spaced fins having opposite end edges. The folded sheet is formed into a generally cylindrical configuration whereby the troughs form an inner-segmented cylinder and the ridges form an outer-segmented cylinder generally concentric with the inner cylinder. The heat sink assembly may include a heat conductive rod dimensioned to engage the troughs of the thermally conductive sheet. The ridges of the thermally conductive sheet may also contain apertures to allow air to fully circulate through the fins. The heat sink assembly may also include a fan and a thermally conductive base plate.

Abstract: A folded fin heat sink to be clamped onto circuit components in need of cooling, in particular CPU's. Ridges are designed to optimize air flow. Suitable for use with a fan to force air movement.

Abstract: An integrated heat sink/retention mechanism and a method for mounting a processor assembly on a circuit board using such an integrated heat sink/retention mechanism. The method involves attaching an integrated heat sink/retention mechanism onto the circuit board. A grounding connection may be formed between the circuit board and the integrated heat sink/retention mechanism. The integrated heat sink/retention mechanism is designed so that the heat sink is attachable to a processor assembly and mountable on a circuit board.

Abstract: A computer including an acoustically shielded hard disk drive. Exhaust vents are provided in the computer housing above a convectively cooled power supply. The power supply and, if necessary, a plurality of fans mounted inboard from the intake vents, move the air throughout the computer. The resulting computer produces no more than 25 decibels of noise when in operation. A sound absorption layer surrounds the disk drive assembly. A heat sink mounted exterior to the sound absorption layer is connected by a heat conductive path to the disk drive assembly so as to conduct heat from the disk drive out to the exteriorly mounted heat sink. The disk drive may be immediately surrounded by a fluid containing pouch and a metal bracket.

Abstract: A computer including an acoustically shielded hard disk drive. Exhaust vents are provided in the computer housing above a convectively cooled power supply. The power supply and, if necessary, a plurality of fans mounted inboard from the intake vents, move the air throughout the computer. The resulting computer produces no more than 25 decibels of noise when in operation. A sound absorption layer surrounds the disk drive assembly. A heat sink mounted exterior to the sound absorption layer is connected by a heat conductive path to the disk drive assembly so as to conduct heat from the disk drive out to the exteriorly mounted heat sink. The disk drive may be immediately surrounded by a fluid containing pouch and a metal bracket.