Abstract: An apparatus and a method for applying a solder material to a square leadless chip carrier using a solder wave technique. The carrier is placed on a pallet so that one side of the carrier forms an angle of 45.degree. to the direction of travel of the solder wave. The carrier has attachment pads spaced equidistantly around a peripheral surface thereof, and the carrier is retained on the holder so that the attachment pads are positioned adjacent the solder material. A solderable pin is positioned on the holder behind the carrier, when considered in the direction of movement of the pallet. One pin is necessary for each of the last pads to be soldered. The pin extends from the surface of the carrier a distance substantially equal to the distance the carrier extends from the pallet surface, and the area of the pin corresponds substantially to the area of a pad.