Patents by Inventor Gregory W. Pautsch
Gregory W. Pautsch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10034416Abstract: A system and method for cooling a plurality of electronics cabinets having horizontally positioned electronics assemblies. The system includes at least one blower configured to direct air horizontally across the electronics assemblies, and at least one intercooler configured to extract heat from the air flow such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. A plurality of chassis backplanes and power supplies may also include an intercooler, wherein the intercoolers are electronically controlled such that the system is room neutral.Type: GrantFiled: October 19, 2015Date of Patent: July 24, 2018Assignee: Cray Inc.Inventors: Gregory W. Pautsch, Eric D. Lakin
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Publication number: 20160044828Abstract: A system and method for cooling a plurality of electronics cabinets having horizontally positioned electronics assemblies. The system includes at least one blower configured to direct air horizontally across the electronics assemblies, and at least one intercooler configured to extract heat from the air flow such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. A plurality of chassis backplanes and power supplies may also include an intercooler, wherein the intercoolers are electronically controlled such that the system is room neutral.Type: ApplicationFiled: October 19, 2015Publication date: February 11, 2016Inventors: Gregory W. Pautsch, Eric D. Lakin
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Patent number: 9185828Abstract: A system and method for cooling a plurality of connectors interfacing electrical and optical signals to circuit boards in an electronics cabinet, such as backplane connectors routing signals to circuit boards housed in card cage assemblies. Heat pipes coupled to the connectors efficiently remove heat from the connectors and sink the connector heat to a cold junction of a liquid cooling system, which cooling system may also extract heat from air flow cooling the circuit boards such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. The heat connector cooling system is effective where connectors are outside of an air flow cooling envelope that may cool the circuit boards.Type: GrantFiled: March 15, 2013Date of Patent: November 10, 2015Assignee: Cray Inc.Inventors: Corey Knudsen, Kent T. McDaniel, Bradley J. Smith, Gregory W. Pautsch, Eric D. Lakin
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Patent number: 9167726Abstract: A system and method for cooling a plurality of electronics cabinets having horizontally positioned electronics assemblies. The system includes at least one blower configured to direct air horizontally across the electronics assemblies, and at least one intercooler configured to extract heat from the air flow such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. A plurality of chassis backplanes and power supplies may also include an intercooler, wherein the intercoolers are electronically controlled such that the system is room neutral.Type: GrantFiled: November 19, 2012Date of Patent: October 20, 2015Assignee: Cray Inc.Inventors: Gregory W. Pautsch, Eric D. Lakin
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Publication number: 20130301219Abstract: A system and method for cooling a plurality of connectors interfacing electrical and optical signals to circuit boards in an electronics cabinet, such as backplane connectors routing signals to circuit boards housed in card cage assemblies. Heat pipes coupled to the connectors efficiently remove heat from the connectors and sink the connector heat to a cold junction of a liquid cooling system, which cooling system may also extract heat from air flow cooling the circuit boards such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. The heat connector cooling system is effective where connectors are outside of an air flow cooling envelope that may cool the circuit boards.Type: ApplicationFiled: March 15, 2013Publication date: November 14, 2013Inventors: Corey Knudsen, Kent T. McDaniel, Bradley J. Smith, Gregory W. Pautsch, Eric D. Lakin
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Patent number: 7757497Abstract: A spray cooling system includes a spray delivery device and a cooling liquid delivered to the spray delivery device. The spray delivery device includes one or more inlet apertures and one or more corresponding outlet apertures, at least one pair of inlet aperture and corresponding outlet aperture being positioned relative to each so as to form an asymmetric non-uniform density full-cone spray pattern.Type: GrantFiled: January 19, 2009Date of Patent: July 20, 2010Assignee: Cray Inc.Inventors: Gregory W. Pautsch, Adam Pautsch
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Patent number: 7478769Abstract: A spray cooling system includes a spray delivery device and a cooling liquid delivered to the spray delivery device. The spray delivery device includes one or more inlet apertures and one or more corresponding outlet apertures, at least one pair of inlet aperture and corresponding outlet aperture being positioned relative to each so as to form an asymmetric non-uniform density full-cone spray pattern.Type: GrantFiled: March 9, 2005Date of Patent: January 20, 2009Assignee: Cray Inc.Inventors: Gregory W. Pautsch, Adam Pautsch
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Patent number: 6646879Abstract: A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid.Type: GrantFiled: May 16, 2001Date of Patent: November 11, 2003Assignee: Cray Inc.Inventor: Gregory W. Pautsch
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Patent number: 6580609Abstract: A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid.Type: GrantFiled: April 8, 2002Date of Patent: June 17, 2003Assignee: Cray Inc.Inventor: Gregory W. Pautsch
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Publication number: 20020172007Abstract: A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid.Type: ApplicationFiled: May 16, 2001Publication date: November 21, 2002Inventor: Gregory W. Pautsch
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Publication number: 20020135981Abstract: A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid.Type: ApplicationFiled: April 8, 2002Publication date: September 26, 2002Applicant: Cray Inc.Inventor: Gregory W. Pautsch
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Patent number: 6366461Abstract: A system and method for cooling individual electronic components utilizes individual manifolds to create individual flows of a negatively pressurized cooling fluid. This permits components with significantly different cooling loads to be located immediately adjacent each other on a circuit board, but without loss of space and computation time efficiencies, because cooling the components individually avoids heat generated by each component from adversely affecting the performance of the cooling system for adjacent components. A heat sink can be coupled to the components for increased heat transfer, and a preferred design of heat sink both dissipates heat and directs the flow of the fluid in an optimum manner.Type: GrantFiled: September 29, 1999Date of Patent: April 2, 2002Assignee: Silicon Graphics, Inc.Inventors: Gregory W. Pautsch, Kent T. McDaniel, Eric Dwayne Lakin, James Joseph Jirak
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Patent number: 6345515Abstract: A conditioning and filling system includes a first processing section for degassing and dehydrating a working fluid, a second processing section for filtering the working fluid, and a monitoring section for sensing a condition of the working fluid, the monitoring section controlling a flow of the working fluid depending on the condition of the working fluid.Type: GrantFiled: August 21, 2000Date of Patent: February 12, 2002Assignee: Silicon Graphics, Inc.Inventors: Gregory W. Pautsch, William J. Matthews, Rich Rineck
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Patent number: 5211567Abstract: A completely shielded metallized connector block for use in multiple circuit modules of an electronic device. Electrical communication between the circuit boards is effected by an array of metallic pins which run through the blocks. The metallization on the nonconductive blocks can be held at ground or at a constant potential to increase the shielding between pins as well as maintaining voltage and ground planes at constant levels throughout the modules. The metallization is insulated from the pins and circuit boards by nonconductive bushings inserted in holes in the blocks. In one embodiment, the metallization consists of copper and solder plating and the blocks are constructed of liquid crystal polymer.Type: GrantFiled: July 2, 1991Date of Patent: May 18, 1993Assignee: Cray Research, Inc.Inventors: Eugene F. Neumann, Melvin C. August, Stephen A. Bowen, Gregory W. Pautsch
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Patent number: 5144691Abstract: An optical backplane interconnects logic assemblies in a computer system using optical fibers. The logic assembly is connected to a laser or LED for converting electrical signals from the logic assembly into the equivalent optical signals. The optical signals are transmitted along the optical fibers to another logic assembly. The optical backplane comprises a mainframe rail for mounting to one end of the logic assembly, a connector attached to the mainframe rail, and an optical coupler mated with the connector. The optical coupler and connector having matching vee grooves for supporting and aligning the optical fibers.Type: GrantFiled: July 20, 1990Date of Patent: September 1, 1992Assignee: Cray Research, Inc.Inventors: Melvin C. August, Daniel Massopust, Mary Nebel, Eugene F. Neumann, Gregory W. Pautsch
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Patent number: 5041903Abstract: An integrated circuit package includes a plurality of TAB assemblies, each including a portion for inner lead bonding an integrated circuit. A portion of the tape is formed to allow the tape to be outer lead bonded to the substrate so that the integrated circuit is mounted at any desired non zero angle with respect to a horizontal substrate. A plurality of formed tape units are outer lead bonded to a horizontal substrate. In one embodiment, the die is inner lead bonded to the tape in an area which is not devoid of tape, allowing electrical traces on the tape which are routed above and not in contact with the surface of the die, thereby providing excellent routing density. The dielectric tape may include a single electrical interconnect layer, or a plurality of electrical interconnect layers which may themselves be electrically interconnected via suitable vias formed within the tape structure.Type: GrantFiled: June 11, 1990Date of Patent: August 20, 1991Assignee: National Semiconductor Corp.Inventors: Michael A. Millerick, Gregory W. Pautsch
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Patent number: D481035Type: GrantFiled: May 1, 2002Date of Patent: October 21, 2003Assignee: Cray Inc.Inventors: Gregory W. Pautsch, Dennis F. Girling
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Patent number: D481040Type: GrantFiled: May 1, 2002Date of Patent: October 21, 2003Assignee: Cray Inc.Inventors: Gregory W. Pautsch, Jill Antolak
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Patent number: D331392Type: GrantFiled: July 20, 1990Date of Patent: December 1, 1992Inventors: Melvin C. August, Gregory W. Pautsch, Larry W. Gullickson, Steven S. Chen