Abstract: A test probe for a high-frequency device having an electronic circuit with two or more contact regions. The test probe comprises two or more signal probe tips. Each signal probe tip has a contact surface area for contacting one of the contact regions of the device. A ground probe has a ground contact surface with a surface area substantially greater than the contact surface area of the one signal probe tip for contacting another one of the contact regions of the electronic circuit. The ground probe is positioned between at least two of the signal probes.

Abstract: Wireless communications devices, such as mobile telephones and pagers, has have recently been allowed to operate at higher frequencies in the 27-32 Giga-Hertz range. These higher-frequency devices typically include a multi-tiered electronic assembly, which includes an integrated-circuit chip, a chip carrier, and a main circuit board, with the chip carrier sandwiched between the chip and the main circuit board. Testing these multi-tiered assemblies conventionally entails manually coupling test probes to specific contact regions of the circuit board, applying test signals to the board, and ultimately keeping or discarding the entire board based on the testing. This method is not only slow and wasteful, but sometimes requires the circuit board to include extra ground contacts that can disrupt normal circuit operation. Accordingly, the present inventors have devised unique test probes and related systems and methods for testing these and other high-frequency electronic assemblies.