Abstract: Embodiments include a microphone assembly comprising an array microphone and a housing configured to support the array microphone and sized and shaped to be mountable in a drop ceiling in place of at least one of a plurality of ceiling tiles included in the drop ceiling. A front face of the housing includes a sound-permeable screen having a size and shape that is substantially similar to the at least one of the plurality of ceiling tiles. Embodiments also include an array microphone system comprising a plurality of microphones arranged, on a substrate, in a number of concentric, nested rings of varying sizes around a central point of the substrate. Each ring comprises a subset of the plurality of microphones positioned at predetermined intervals along a circumference of the ring.

Abstract: A communications device is described that may include a system housing, a microphone array, a loudspeaker, and a loudspeaker housing. The loudspeaker housing is configured to minimize acoustic coupling between the loudspeaker and the microphone array, and at least a portion of the loudspeaker housing is positioned outside of the system housing. The loudspeaker housing may include a plurality of loudspeaker housing mounts. The loudspeaker housing may include first and second halves which may have a gasket between them. The gasket between the first half and the second half of the loudspeaker housing may be configured to dampen vibrations.

Abstract: Embodiments include a microphone assembly comprising an array microphone and a housing configured to support the array microphone and sized and shaped to be mountable in a drop ceiling in place of at least one of a plurality of ceiling tiles included in the drop ceiling. A front face of the housing includes a sound-permeable screen having a size and shape that is substantially similar to the at least one of the plurality of ceiling tiles. Embodiments also include an array microphone system comprising a plurality of microphones arranged, on a substrate, in a number of concentric, nested rings of varying sizes around a central point of the substrate. Each ring comprises a subset of the plurality of microphones positioned at predetermined intervals along a circumference of the ring.

Abstract: An audio device includes a circular cover comprising a top and a bottom, a circular screen rotationally engaged with the bottom of the cover, and a circular shroud removably engaged with top of the cover. The top of the cover includes a plurality of mounting holes. The mounting holes may include a plurality of holes in a VESA pole mounting pattern. The mounting holes may also include a plurality of cable mounting holes configured in a square pattern having greater spacing than the VESA mounting pattern. The audio device may include a plurality of microphones and/or one or more loudspeakers.

Abstract: Embodiments include a microphone assembly comprising an array microphone and a housing configured to support the array microphone and sized and shaped to be mountable in a drop ceiling in place of at least one of a plurality of ceiling tiles included in the drop ceiling. A front face of the housing includes a sound-permeable screen having a size and shape that is substantially similar to the at least one of the plurality of ceiling tiles. Embodiments also include an array microphone system comprising a plurality of microphones arranged, on a substrate, in a number of concentric, nested rings of varying sizes around a central point of the substrate. Each ring comprises a subset of the plurality of microphones positioned at predetermined intervals along a circumference of the ring.

Abstract: Housings and associated mechanical and ornamental design features directed to ceiling-mounted electro-acoustical components, such as array microphones, for example, for use in a suspended ceiling, are provided. In an embodiment, a housing for a ceiling array microphone is configured for mounting the microphone within a grid system of a suspended ceiling. The housing comprises a mounting element for mounting the housing within the grid system. The mounting element includes a lipped portion positioned approximate a periphery of the housing and configured to engage the grid when the housing is mounted with the grid system.

Abstract: Embodiments of a modular array microphone system are disclosed, which may include one or more industrial design, mechanical connectivity, and/or acoustic features, components, or aspects.

Abstract: Housings and associated mechanical and ornamental design features directed to ceiling-mounted electro-acoustical components, such as array microphones, for example, for use in a suspended ceiling, are provided. In an embodiment, a housing for a ceiling array microphone is configured for mounting the microphone within a grid system of a suspended ceiling. The housing comprises a mounting element for mounting the housing within the grid system. The mounting element includes a lipped portion positioned approximate a periphery of the housing and configured to engage the grid when the housing is mounted with the grid system.

Abstract: Embodiments include a microphone assembly comprising an array microphone and a housing configured to support the array microphone and sized and shaped to be mountable in a drop ceiling in place of at least one of a plurality of ceiling tiles included in the drop ceiling. A front face of the housing includes a sound-permeable screen having a size and shape that is substantially similar to the at least one of the plurality of ceiling tiles. Embodiments also include an array microphone system comprising a plurality of microphones arranged, on a substrate, in a number of concentric, nested rings of varying sizes around a central point of the substrate. Each ring comprises a subset of the plurality of microphones positioned at predetermined intervals along a circumference of the ring.

Abstract: Embodiments of a modular array microphone system are disclosed, which may include one or more industrial design, mechanical connectivity, and/or acoustic features, components, or aspects.