Abstract: Label apparatus having identification tags and tamper evident pattern release layers and methods of producing such labels are disclosed. An example apparatus includes a first substrate, a first pattern of adhesive, a tamper-evident release layer, a second pattern of adhesive, a tag, a third pattern of adhesive, and a second substrate. The first pattern of adhesive includes a first adhesive. The first pattern of adhesive and the tamper-evident release layer are disposed on the first substrate. The second and third patterns of adhesive include a second adhesive. The second pattern of adhesive is disposed on the first substrate and surrounded by the first pattern of adhesive. The tag includes a remaining portion coupled to the first pattern of adhesive and a removable portion coupled to the second pattern of adhesive. The third pattern of adhesive is coupled to the tag, the first pattern of adhesive, and the second substrate.

Abstract: Label apparatus having identification tags and tamper evident pattern release layers and methods of producing such labels are disclosed. An example apparatus includes a first substrate, a first pattern of adhesive, a tamper-evident release layer, a second pattern of adhesive, a tag, a third pattern of adhesive, and a second substrate. The first pattern of adhesive includes a first adhesive. The first pattern of adhesive and the tamper-evident release layer are disposed on the first substrate. The second and third patterns of adhesive include a second adhesive. The second pattern of adhesive is disposed on the first substrate and surrounded by the first pattern of adhesive. The tag includes a remaining portion coupled to the first pattern of adhesive and a removable portion coupled to the second pattern of adhesive. The third pattern of adhesive is coupled to the tag, the first pattern of adhesive, and the second substrate.

Abstract: Labels having identification tags and tamper evident pattern release layers and methods of producing such labels are disclosed. An example method includes moving a first substrate in a direction. The first substrate has a first side opposite a second side. The first side has a first adhesive and a pattern release layer. The method also includes coupling a third side of a tag to the first side of the first substrate. The tag includes the third side and a fourth side opposite the third side. The method also includes mating transfer tape of a second substrate over the first side and the fourth side. The second substrate includes a liner layer and the transfer tape. The transfer tape is to be positioned immediately adjacent the tag.

Abstract: Labels having identification tags and tamper evident pattern release layers and methods of producing such labels are disclosed. An example method includes moving a first substrate in a direction. The first substrate has a first side opposite a second side. The first side has a first adhesive and a pattern release layer. The method also includes coupling a third side of a tag to the first side of the first substrate. The tag includes the third side and a fourth side opposite the third side. The method also includes mating transfer tape of a second substrate over the first side and the fourth side. The second substrate includes a liner layer and the transfer tape. The transfer tape is to be positioned immediately adjacent the tag.