Abstract: A method of producing a cavity package semiconductor device is disclosed. The method includes providing a bar pad having a plurality of bar pad straps, each strap extending outwardly from the outer edge of the bar pad and spaced about the edge of the bar pad; mounting integrated circuits having bond pads on the bar pad; molding a packing material onto a central portion of lead fingers and the bar straps to grip and surround each lead finger with package material, with a portion of each lead finger extending externally from the ring at both the exterior and interior thereof and to secure the bar pad straps therein; electrically coupling the bond pads to the portion of desired ones of the lead fingers extending toward the interior of the ring; and enclosing both ends of the ring to provide a cavity in the ring to suspend a bar pad with the integrated circuit thereon within the cavity with the bar pad straps.

Abstract: An improved cushion of buoyant material for an airplane seat in which the cushion is removably attached to the seat, such as by Velcro strips. The cushion has straps to receive the arms of the passenger sitting on the cushion whereby the passenger can become coupled to the cushion and cause the cushion to be separated from the seat by pulling the cushion away from the seat. The cushion is formed from a number of hinged sections which pivot forwardly and partially around the passenger to stabilize the passenger when the passenger is in the water and coupled to the cushion by the straps. Actuating devices cause the forward pivoting of the hinged sections when the cushion is pulled away from the seat.