Abstract: A wavelength converting layer may have a glass or a silicon porous support structure. The wavelength converting layer may also have a cured portion of wavelength converting particles and a binder laminated onto the porous glass or silicon support structure.

Abstract: A light source can include a transparent flexible substrate. A sparse array of light-emitting diodes (LEDs) can be disposed on the transparent flexible substrate. A rigid substrate can be adhered to the transparent flexible substrate such that the sparse array of LEDs is located between the rigid substrate and the transparent flexible substrate. The rigid substrate can be adhered to the transparent flexible substrate with an adhesive layer. The sparse array of LEDs can be encapsulated in an adhesive of the adhesive layer. The adhesive can have a refractive index that is between a refractive index of the transparent flexible substrate and a refractive index of the rigid substrate, inclusive. The sparse array of LEDs can have a light-emitting area that is less than or equal to a specified fraction of a surface area of the sparse array, such as 5 percent or 1 percent.

Abstract: Display devices comprise an optionally transparent display area that extends to one or more physical boundaries (edges) of the device. The display area may be located on a front surface of the display device, and the physical boundaries of the device to which the display area extends may be formed by physical sides of the device that intersect with the front surface to define part of a perimeter of the front surface. The display area may comprise a microLED array that extends with the display area to edges of the device. Power and/or control electronics for the display device may be located adjacent the display area but away from the edges of the display device to which the display area extends. Two or more such display devices can be arranged (i.e., tiled) with their display areas adjacent, in contact, and facing the same direction to form an extended continuous microLED display area spanning the display areas of the two or more display devices.

Abstract: A semiconductor device is electrically connected to a power source through an electrical contact and at least one bump disposed on the electrical contact. The semiconductor device may be an LED on a CMOS wafer with the electrical contact spaced apart from it and disposed on the wafer. The semiconductor device and the electrical contact have side coating material disposed to surround them, and the at least one bump may be stacked to reach or nearly reach the top surface of the side coating material. This allows wire bonding of the semiconductor device to an external power source through the easily accessible bump(s), whose top surface is exposed by the side coating material.

Abstract: A wavelength converting layer may have a glass or a silicon porous support structure. The wavelength converting layer may also have a cured portion of wavelength converting particles and a binder laminated onto the porous glass or silicon support structure.

Abstract: Described is a light-emitting device and methods of manufacturing thereof. The light-emitting device comprises unpackaged light-emitting diodes arranged in a grid. The unpackaged light-emitting diodes in the are fixed in place by the reflective coating material. Each of the plurality of unpackaged light-emitting diodes are surrounded by a reflective coating material and may be separated by a layer of light absorbing material.

Abstract: A packaging structure for a light emitter pixel array includes a plurality of pixels, with at least some pixels laterally separated from each other with a pixel light confinement structure. An inorganic substrate having a top redistribution layer is attached to the plurality of pixels and at least one through silicon via containing an electrical conductor is defined to pass through the inorganic substrate and support an electrical coupling with the top redistribution layer.

Abstract: A light-emitting diode (LED) package and method of manufacture are described. An LED package includes an LED die that has a top surface, a bottom surface and side surfaces. The package further includes a wavelength converting element having a top surface, a bottom surface and side surfaces. The bottom surface of the wavelength converting element is adjacent the top surface of the LED die. The package further includes a light reflecting coating surrounding at least the side surfaces of both the LED die and the wavelength converting element. The light reflective coating has at a least a portion that extends above the top surface of the wavelength converting element.

Abstract: A packaging structure for a light emitter pixel array includes a plurality of pixels, with at least some pixels laterally separated from each other with a pixel light confinement structure. An inorganic substrate having a top redistribution layer is attached to the plurality of pixels and at least one through silicon via containing an electrical conductor is defined to pass through the inorganic substrate and support an electrical coupling with the top redistribution layer.

Abstract: A wavelength converting layer may have a glass or a silicon porous support structure. The wavelength converting layer may also have a cured portion of wavelength converting particles and a binder filling the porous glass or silicon support structure.

Abstract: Phosphor-converted LED side reflectors disclosed herein comprise pigments that are photochemically stable under illumination by light from the pcLED. The pigments absorb light in at least a portion of the spectrum of light emitted by the first phosphor converted LED. The side reflector may also comprise light scattering particles or air voids. The pigments, light scattering particles, or air voids may be homogeneously distributed in the reflector. Alternatively the side reflector may be layered, with the pigments, light scattering particles, or air voids inhomogeneously distributed in the reflector. The side reflector can include phosphor particles.

Abstract: Phosphor-converted LED side reflectors disclosed herein comprise pigments that are photochemically stable under illumination by light from the pcLED. The pigments absorb light in at least a portion of the spectrum of light emitted by the first phosphor converted LED. The side reflector may also comprise light scattering particles or air voids. The pigments, light scattering particles, or air voids may be homogeneously distributed in the reflector. Alternatively the side reflector may be layered, with the pigments, light scattering particles, or air voids inhomogeneously distributed in the reflector. The side reflector can include phosphor particles.

Abstract: A converter layer bonding device, and methods of making and using the converter layer bonding device are disclosed. A converter layer bonding device as disclosed herein includes a release liner and an adhesive layer coating the release liner, the adhesive layer is solid and non-adhesive at room temperature, and is adhesive at an elevated temperature above room temperature.

Abstract: Various embodiments include methods for forming domed light-emitting diode (LED)-modules and devices constructed by those methods. In one example, the domed LED-module includes a package substrate, an LED die formed on the package substrate, one or more silicone pads formed on the package substrate and at least partially surrounding the LED die, and a high refractive-index material formed over the one or more silicone pads. Other devices and methods are described.

Abstract: A converter layer bonding device, and methods of making and using the converter layer bonding device are disclosed. A converter layer bonding device as disclosed herein includes a release liner and an adhesive layer coating the release liner, the adhesive layer is solid and non-adhesive at room temperature, and is adhesive at an elevated temperature above room temperature.

Abstract: Phosphor-converted LED side reflectors disclosed herein comprise pigments that are photochemically stable under illumination by light from the pcLED. The pigments absorb light in at least a portion of the spectrum of light emitted by the first phosphor converted LED. The side reflector may also comprise light scattering particles and/or air voids. The pigments, light scattering particles and/or air voids may be homogeneously distributed in the reflector. Alternatively the side reflector may be layered, with the pigments, light scattering particles and/or air voids inhomogeneously distributed in the reflector. The side reflector may comprise phosphor particles.

Abstract: Light emitting devices (LEDs) and methods of manufacturing LEDs are described. A method includes providing a layer of a wavelength converting material on a temporary tape. The wavelength converting material includes at least a binder or matrix material, particles of a non-luminescent material, and phosphor particles and has a concentration of 60%-90% by volume particles of the non-luminescent material and phosphor particles. The layer of the wavelength converting material is separated on the temporary tape to form multiple wavelength converting structures, which are provided on an array type frame. Heat and pressure are applied to the wavelength converting structures on the array type frame.

Abstract: Light emitting devices (LEDs) and methods of manufacturing LEDs are described. A method includes providing a layer of a wavelength converting material on a temporary tape. The wavelength converting material includes at least a binder or matrix material, particles of a non-luminescent material, and phosphor particles and has a concentration of 60%-90% by volume particles of the non-luminescent material and phosphor particles. The layer of the wavelength converting material is separated on the temporary tape to form multiple wavelength converting structures, which are provided on an array type frame. Heat and pressure are applied to the wavelength converting structures on the array type frame.

Abstract: A converter layer bonding device, and methods of making and using the converter layer bonding device are disclosed. A converter layer bonding device as disclosed herein includes a release liner and an adhesive layer coating the release liner, the adhesive layer is solid and non-adhesive at room temperature, and is adhesive at an elevated temperature above room temperature.

Abstract: A lighting structure according to embodiments of the invention includes a semiconductor light emitting device and a flat wavelength converting element attached to the semiconductor light emitting device. The flat wavelength converting element includes a wavelength converting layer for absorbing light emitted by the semiconductor light emitting device and emitting light of a different wavelength. The flat wavelength converting element further includes a transparent layer. The wavelength converting layer is formed on the transparent layer.