Abstract: A light-emitting apparatus includes a light emitting device, a set of transmissive optical elements, and a side wall coating layer forming a rigid spacer. The set of optical elements is positioned with its back optics surface facing and spaced apart from the front device surface. Device output light emitted from light-emitting areas of the front device surface propagates to and through the optical elements. The space between the front device surface and the back optics surface, through which the device output light propagates, is either evacuated or filled with ambient air or inert gas. The side wall coating layer, on side surfaces of the light-emitting device or on side surfaces of multiple light-emitting elements thereof, extends beyond the front device surface to form the spacer, which leaves unobstructed at least portions of the one or more light-emitting areas of the front device surface.

Abstract: A LED light source includes a frame with side walls having reflective interior surfaces that define sides of an internal cavity. The frame may be placed above an LED array to contain the light of the array. One or more light transmitting layers may be placed above the frame to further or maintain containment of the light and/or to support an optical element above the frame. The optical element may direct the light of the LED array to provide a narrowed radiation pattern that may be advantageously employed for backlighting LCOS and other displays.

Abstract: A thin film light emitting diode (LED) package for high power applications and method of fabricating the LED package are described. The epitaxial growth substrate is removed and a molding compound is used as underfill to substantially completely fill the space between under bump metallization (UBM) under the remaining semiconductor stack. The molding compound provides mechanical support for the LED package during processing after the epitaxial growth substrate is removed. A temporary adhesive layer and frame is used to support the semiconductor stack and is removed after processing. A reflective material is disposed between LED die after removing the growth substrate. A conversion layer deposited on the semiconductor stack converts light emitted by the semiconductor stack to light of one or more other wavelengths.

Abstract: A microlens array comprises an array of microlenses on a flat base. A spacer located along the periphery of the microlens array protrudes away from the plane of the base. The microlens array may be arranged in combination with one or more LEDs or pcLEDs with the spacer positioned between the microlens array and the LEDs or pcLEDs and thus spacing the microlenses away from the LED or pcLEDs. Arranged in this manner, the surface of the microlens array facing the LEDs or pcLEDs and light emitting surfaces of the LEDs or pcLEDs together define an air filled or evacuated gap between the microlens array and the LEDs or pcLEDs, which improves the performance of the microlens array in collimating or partially collimating light emitted by the LEDs or pcLEDs.

Abstract: An LED light source comprises a hollow pedestal comprising side walls having reflective interior surfaces that define sides of an internal cavity. An LED mounting surface is disposed within the cavity, with one or more LEDs disposed on the LED mounting surface. A light transmitting optical element is disposed opposite from the mounting surface, spaced apart from the one or more LEDs, and supported by the pedestal side walls. The LED light source provides a narrowed radiation pattern that may, for example, be advantageously employed for backlighting LCOS and other displays.

Abstract: A packaging structure for a light emitter pixel array includes a plurality of pixels, with at least some pixels laterally separated from each other with a pixel light confinement structure. An inorganic substrate having a top redistribution layer is attached to the plurality of pixels and at least one through silicon via containing an electrical conductor is defined to pass through the inorganic substrate and support an electrical coupling with the top redistribution layer.

Abstract: Described is a light emitting diode (LED) array comprising: a plurality of phosphor-converted light-emitting diodes (PC-LEDs) arranged in a grid on a solid tile support, a reflective coating surrounding PC-LEDs in place, each of the PC-LEDs comprising: a die including an under bump metallization (UBM) affixing the PC-LED to a surface of the solid tile support; a phosphor layer affixed to a surface of the die opposite the UBM, and a transparent cover layer on the phosphor layer.

Abstract: Described are multicolor monolithic light-emitting diode (LED) arrays comprising: multicolor pixels comprising a plurality of light emitting diode (LED) die including: a first set of LED die each of a first die height and configured to emit a first color light; a second set of LED die each of a second die height and configured to emit a second color light; a third set of LED die each of a third die height and configured to emit a third color light; and the first die height being substantially equal to the second die height and the third die height; and the plurality of LED die having a coplanar configuration and being spaced apart and retained by a reflective coating.

Abstract: A light-emitting apparatus includes: a transparent substrate; electrically conductive traces, bond pads, or land pads on the substrate; LEDs; and transparent molded material. The traces, bond pads, and land pads can be transparent, or can be sufficiently small and sufficiently sparse, to enable visual observation of a scene through the substrate and the traces, bond pads, or land pads. The LEDs are connected to the bond pads, and are sufficiently small and sparse so as to enable visual observation of the scene through them. The molded material can be a thermoplastic material or a thermoset material and is molded directly onto the substrate surface, without any intervening adhesive, and encapsulates the LEDs and the traces, bond pads, or land pads. Molten material or liquid precursors are injected into a mold enclosing the substrate with the LEDs and the traces, bond pads, or land pads.

Abstract: A converter layer bonding device, and methods of making and using the converter layer bonding device are disclosed. A converter layer bonding device as disclosed herein includes a release liner and an adhesive layer coating the release liner, the adhesive layer is solid and non-adhesive at room temperature, and is adhesive at an elevated temperature above room temperature.

Abstract: A microlens array comprises an array of microlenses on a flat base. A spacer located along the periphery of the microlens array protrudes away from the plane of the base. The microlens array may be arranged in combination with one or more LEDs or pcLEDs with the spacer positioned between the microlens array and the LEDs or pcLEDs and thus spacing the microlenses away from the LED or pcLEDs. Arranged in this manner, the surface of the microlens array facing the LEDs or pcLEDs and light emitting surfaces of the LEDs or pcLEDs together define an air filled or evacuated gap between the microlens array and the LEDs or pcLEDs, which improves the performance of the microlens array in collimating or partially collimating light emitted by the LEDs or pcLEDs.

Abstract: An inventive apparatus includes a substrate and a set of multiple electrically conductive traces. The substrate is transparent or reflective for visible light. The electrically conductive traces are sufficiently transparent, or are less than 200 ?m wide and occupy less than 25% of an areal extent of the set, so as to enable visual observation of a scene through or reflected by the substrate along a sight line that passes through the set of electrically conductive traces.

Abstract: A light emitting device includes an LED having a light emitting top surface and sidewalls. A phosphor structure is attached to the light emitting surface of the LED. The phosphor structure has a light emitting top surface facing away from the LED light emitting surface, and sidewalls. A light reflective material is arranged to cover the sidewalls of the LED and the phosphor structure. A light absorptive region is defined in the light reflective material around a perimeter of the light emitting surface of the phosphor structure. The light absorptive region may be spaced apart from the perimeter of the phosphor structure by a gap. The light absorptive region may be formed by ultraviolet laser illumination of the light reflecting material.

Abstract: A method of forming one or more transparent microLED light sources comprises providing a flexible transparent sheet on which are disposed a plurality of inorganic microLEDs and conductive paths configured to power the plurality of inorganic microLEDs, positioning a solid transparent sheet of adhesive between the flexible transparent sheet and a transparent substrate, and bonding the transparent sheet of adhesive to the flexible transparent sheet and to the transparent substrate to form a laminated structure. The conductive paths and the microLEDs are arranged to form at least one sparse microLED array.

Abstract: A method of forming one or more transparent microLED light sources comprises preparing or obtaining a flexible transparent sheet on which are disposed a plurality of inorganic microLEDs and conductive paths configured to power the plurality of inorganic microLEDs, positioning a solid transparent sheet of adhesive between the flexible transparent sheet and a transparent substrate, and bonding the transparent sheet of adhesive to the flexible transparent sheet and to the transparent substrate to form a laminated structure. The conductive paths and the microLEDs are arranged to form at least one sparse microLED array.

Abstract: Phosphor-converted LED side reflectors disclosed herein comprise pigments that are photochemically stable under illumination by light from the pcLED. The pigments absorb light in at least a portion of the spectrum of light emitted by the first phosphor converted LED. The side reflector may also comprise light scattering particles or air voids. The pigments, light scattering particles, or air voids may be homogeneously distributed in the reflector. Alternatively the side reflector may be layered, with the pigments, light scattering particles, or air voids inhomogeneously distributed in the reflector. The side reflector can include phosphor particles.

Abstract: An inventive light source includes a rigid layer, a polymer layer, and a set of multiple light-emitting elements. The polymer layer is attached to the rigid layer to form a laminated structure that is transparent for visible light. The set of multiple light-emitting elements is positioned between the rigid layer and the polymer layer. Each light-emitting element includes one or more inorganic microLEDs that are arranged to generate and emit output light to propagate out-of-plane relative to a corresponding localized area of the laminated structure surrounding that light-emitting element. Each light-emitting element of the set is sufficiently small in at least one transverse dimension, and the light-emitting elements occupy a sufficiently small fraction of an areal extent of the set, so as to enable visual observation of a scene through the laminated structure along a sight line that passes through the set of light-emitting elements.

Abstract: A wearable optical assembly includes a transparent optical element and a set of multiple light-emitting elements positioned on or within the optical element. The optical assembly positions the optical element in a sight line of a user wearing the optical assembly. Each light-emitting element includes one or more inorganic microLEDs that generate and emit infrared output light to propagate out-of-plane away from the optical element toward an eye or face of the user wearing the optical assembly. Each light-emitting element of the set is sufficiently small in at least one transverse dimension, and the light-emitting elements occupy a sufficiently small fraction of an areal extent of the set, so as to enable visual observation of a scene, by the user wearing the optical assembly, through the optical element along the sight line of the user, the sight line passing through the set of light-emitting elements.

Abstract: An inventive apparatus includes a substrate and a set of multiple electrically conductive traces. The substrate is transparent or reflective for visible light. The electrically conductive traces are sufficiently transparent, or are less than 200 ?m wide and occupy less than 25% of an areal extent of the set, so as to enable visual observation of a scene through or reflected by the substrate along a sight line that passes through the set of electrically conductive traces.