Patents by Inventor Grzegorz Grzela

Grzegorz Grzela has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200249576
    Abstract: A method includes obtaining, for each particular feature of a plurality of features of a device pattern of a substrate being created using a patterning process, a modelled or simulated relation of a parameter of the patterning process between a measurement target for the substrate and the particular feature; and based on the relation and measured values of the parameter from the metrology target, generating a distribution of the parameter across at least part of the substrate for each of the features, the distribution for use in design, control or modification of the patterning process.
    Type: Application
    Filed: July 11, 2018
    Publication date: August 6, 2020
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Patrick WARNAAR, Patricius Aloysius Jacobus TINNEMANS, Grzegorz GRZELA, Everhardus Cornelis MOS, Wim Tjibbo TEL, Marinus JOCHEMSEN, Bart Peter Bert SEGERS, Frank STAALS
  • Publication number: 20200050114
    Abstract: An overlay metrology target (600, 900, 1000) contains a plurality of overlay gratings (932-935) formed by lithography. First diffraction signals (740(1)) are obtained from the target, and first asymmetry values (As) for the target structures are derived. Second diffraction signals (740(2)) are obtained from the target, and second asymmetry values (As?) are derived. The first and second diffraction signals are obtained using different capture conditions and/or different designs of target structures and/or bias values. The first asymmetry signals and the second asymmetry signals are used to solve equations and obtain a measurement of overlay error. The calculation of overlay error makes no assumption whether asymmetry in a given target structure results from overlay in the first direction, in a second direction or in both directions. With a suitable bias scheme the method allows overlay and other asymmetry-related properties to be measured accurately, even in the presence of two-dimensional overlay structure.
    Type: Application
    Filed: October 17, 2019
    Publication date: February 13, 2020
    Applicant: ASML Netherlands B.V.
    Inventors: Murat Bozkurt, Maurits Van Der Schaar, Patrick Warnaar, Martin Jacobus Johan Jak, Mohammadreza Hajiahmadi, Grzegorz Grzela, Lukasz Jerzy Macht
  • Patent number: 10551750
    Abstract: Disclosed is a process monitoring method, and an associated metrology apparatus.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: February 4, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Adam Jan Urbanczyk, Hans Van Der Laan, Grzegorz Grzela, Alberto Da Costa Assafrao, Chien-Hung Tseng, Jay Jianhui Chen
  • Publication number: 20190378012
    Abstract: Disclosed is a method of determining a characteristic of interest relating to a structure on a substrate formed by a lithographic process, the method comprising: obtaining an input image of the structure; and using a trained neural network to determine the characteristic of interest from said input image. Also disclosed is a reticle comprising a target forming feature comprising more than two sub-features each having different sensitivities to a characteristic of interest when imaged onto a substrate to form a corresponding target structure on said substrate. Related methods and apparatuses are also described.
    Type: Application
    Filed: May 29, 2019
    Publication date: December 12, 2019
    Applicant: ASML Netherlands B.V.
    Inventors: Lorenzo Tripodi, Patrick Warnaar, Grzegorz Grzela, Mohammadreza Hajiahmadi, Farzad Farhadzadeh, Patricius Aloysius Jacobus Tinnemans, Scott Anderson Middlebrooks, Adrianus Cornelis Matheus Koopman, Frank Staals, Brennan Peterson, Anton Bernhard Van Oosten
  • Patent number: 10481506
    Abstract: An overlay metrology target (600, 900, 1000) contains a plurality of overlay gratings (932-935) formed by lithography. First diffraction signals (740(1)) are obtained from the target, and first asymmetry values (As) for the target structures are derived. Second diffraction signals (740(2)) are obtained from the target, and second asymmetry values (As?) are derived. The first and second diffraction signals are obtained using different capture conditions and/or different designs of target structures and/or bias values. The first asymmetry signals and the second asymmetry signals are used to solve equations and obtain a measurement of overlay error. The calculation of overlay error makes no assumption whether asymmetry in a given target structure results from overlay in the first direction, in a second direction or in both directions. With a suitable bias scheme the method allows overlay and other asymmetry-related properties to be measured accurately, even in the presence of two-dimensional overlay structure.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: November 19, 2019
    Assignee: ASML Netherlands B.V.
    Inventors: Murat Bozkurt, Maurits Van Der Schaar, Patrick Warnaar, Martin Jacobus Johan Jak, Mohammadreza Hajiahmadi, Grzegorz Grzela, Lukasz Jerzy Macht
  • Patent number: 10474043
    Abstract: A method of measuring a property of a substrate, the substrate having a plurality of targets formed thereon, the method comprising: measuring N targets of the plurality of targets using an optical measurement system, where N is an integer greater than 2 and each of said N targets is measured Wt times, where Wt is an integer greater than 2 so as to obtain N*Wt measurement values; and determining R property values using Q equations and the N*Wt measurement values, where R<Q?N*Wt; wherein the optical measurement system has at least one changeable setting and, for each of the N targets, measurement values are obtained using different setting values of at least one changeable setting.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: November 12, 2019
    Assignee: ASML Netherlands B.V.
    Inventors: Patrick Warnaar, Maurits Van Der Schaar, Grzegorz Grzela, Erik Johan Koop, Victor Emanuel Calado, Si-Han Zeng
  • Publication number: 20190265028
    Abstract: Disclosed is a method and associated apparatus for measuring a characteristic of interest relating to a structure on a substrate. The method comprises calculating a value for the characteristic of interest directly from the effect of the characteristic of interest on at least the phase of illuminating radiation when scattered by the structure, subsequent to illuminating said structure with said illuminating radiation.
    Type: Application
    Filed: February 15, 2019
    Publication date: August 29, 2019
    Applicants: Stichting VU, Stichting Nederlandse Wetenschappelijk Onderzoek Instituten, Universiteit van Amsterdam, ASML Netherlands B.V.
    Inventors: Patricius Aloysius Jacobus TINNEMANS, Vasco Tomas Tenner, Arie Jeffrey Den Boef, Hugo Augustinus Joseph Cramer, Patrick Warnaar, Grzegorz Grzela, Martin Jacobus Johan Jak
  • Publication number: 20190250520
    Abstract: Disclosed is a process monitoring method, and an associated metrology apparatus.
    Type: Application
    Filed: April 24, 2019
    Publication date: August 15, 2019
    Applicant: ASML Netherlands B.V.
    Inventors: Adam Jan URBANCZYK, Hans VAN DER LAAN, Grzegorz GRZELA, Alberto DA COSTA ASSAFRAO, Chien-Hung TSENG, Jay Jianhui CHEN
  • Patent number: 10310388
    Abstract: Disclosed is a process monitoring method, and an associated metrology apparatus. The method comprises: comparing measured target response spectral sequence data relating to the measurement response of actual targets to equivalent reference target response sequence data relating to a measurement response of the targets as designed; and performing a process monitoring action based on the comparison of said measured target response sequence data and reference target response sequence data. The method may also comprise determining stack parameters from the measured target response spectral sequence data and reference target response spectral sequence data.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: June 4, 2019
    Assignee: ASML Netherlands B.V.
    Inventors: Adam Urbanczyk, Hans Van Der Laan, Grzegorz Grzela, Alberto Da Costa Assafrao, Chien-Hung Tseng, Jay Jianhui Chen
  • Publication number: 20180321599
    Abstract: An overlay metrology target (600, 900, 1000) contains a plurality of overlay gratings (932-935) formed by lithography. First diffraction signals (740(1)) are obtained from the target, and first asymmetry values (As) for the target structures are derived. Second diffraction signals (740(2)) are obtained from the target, and second asymmetry values (As?) are derived. The first and second diffraction signals are obtained using different capture conditions and/or different designs of target structures and/or bias values. The first asymmetry signals and the second asymmetry signals are used to solve equations and obtain a measurement of overlay error. The calculation of overlay error makes no assumption whether asymmetry in a given target structure results from overlay in the first direction, in a second direction or in both directions. With a suitable bias scheme the method allows overlay and other asymmetry-related properties to be measured accurately, even in the presence of two-dimensional overlay structure.
    Type: Application
    Filed: May 1, 2018
    Publication date: November 8, 2018
    Applicant: ASML Netherlands B.V.
    Inventors: Murat BOZKURT, Maurits Van Der Schaar, Patrick Warnaar, Martin Jacobus Johan Jak, Mohammadreza Hajiahmadi, Grzegorz Grzela, Lukasz Jerzy Macht
  • Publication number: 20180217508
    Abstract: Disclosed is a process monitoring method, and an associated metrology apparatus. The method comprises: comparing measured target response spectral sequence data relating to the measurement response of actual targets to equivalent reference target response sequence data relating to a measurement response of the targets as designed; and performing a process monitoring action based on the comparison of said measured target response sequence data and reference target response sequence data. The method may also comprise determining stack parameters from the measured target response spectral sequence data and reference target response spectral sequence data.
    Type: Application
    Filed: January 19, 2018
    Publication date: August 2, 2018
    Applicant: ASML Netherlands B.V.
    Inventors: Adam URBANCZYK, Hans Van Der Laan, Grzegorz Grzela, Alberto Da Costa Assafrao, Chien-Hung Tseng, Jay Jianhui Chen
  • Publication number: 20180173105
    Abstract: A method of measuring a property of a substrate, the substrate having a plurality of targets formed thereon, the method comprising: measuring N targets of the plurality of targets using an optical measurement system, where N is an integer greater than 2 and each of said N targets is measured Wt times, where Wt is an integer greater than 2 so as to obtain N*Wt measurement values; and determining R property values using Q equations and the N*Wt measurement values, where R<Q?N*Wt; wherein the optical measurement system has at least one changeable setting and, for each of the N targets, measurement values are obtained using different setting values of at least one changeable setting.
    Type: Application
    Filed: December 14, 2017
    Publication date: June 21, 2018
    Applicant: ASML Netherlands B.V.
    Inventors: Patrick Warnaar, Maurits Van Der Schaar, Grzegorz Grzela, Erik Johan Koop, Victor Emanuel Calado, Si-Han Zeng