Abstract: Methods and systems for monitoring wafer processing results continuously and in real-time. In some embodiments, a system may comprise at least one non-active chamber with at least one feedthrough access port which is configured to interact with a metrology apparatus. The feedthrough access port has a surface exposed to an inner volume of the non-active chamber and has a fluorine-based coating covering the surface. The non-active chamber has a wafer access port to one or more other chambers. The metrology apparatus is positioned external to the non-active chamber and is oriented to detect metrology data through one of the feedthrough access ports. A data collection apparatus is connected to the metrology apparatus and configured to continuously receive data from the metrology apparatus.

Abstract: Methods, systems, and apparatus for measuring a gap between a support surface for a substrate and an opposing upper surface of a processing chamber. The methods comprise: disposing a sensor substrate at a location spaced between the support surface and the upper surface, the sensor substrate comprising a body having a first side and a second side opposite the first side, the first side facing the support surface and the second side facing the upper surface, the first side having a first sensor and the second side having a second sensor; measuring, using the first sensor, a first distance between the first side and the support surface; measuring, using the second sensor, a second distance between the second side and the upper surface; and determining a gap between the support surface and the upper surface using the first distance and the second distance.

Abstract: Methods, systems, and apparatus for measuring a gap between a support surface for a substrate and an opposing upper surface of a processing chamber. The methods comprise: disposing a sensor substrate at a location spaced between the support surface and the upper surface, the sensor substrate comprising a body having a first side and a second side opposite the first side, the first side facing the support surface and the second side facing the upper surface, the first side having a first sensor and the second side having a second sensor; measuring, using the first sensor, a first distance between the first side and the support surface; measuring, using the second sensor, a second distance between the second side and the upper surface; and determining a gap between the support surface and the upper surface using the first distance and the second distance.

Abstract: Methods and systems for monitoring wafer processing results continuously and in real-time. In some embodiments, a system may comprise at least one non-active chamber with at least one feedthrough access port which is configured to interact with a metrology apparatus. The feedthrough access port has a surface exposed to an inner volume of the non-active chamber and has a fluorine-based coating covering the surface. The non-active chamber has a wafer access port to one or more other chambers. The metrology apparatus is positioned external to the non-active chamber and is oriented to detect metrology data through one of the feedthrough access ports. A data collection apparatus is connected to the metrology apparatus and configured to continuously receive data from the metrology apparatus.