Patents by Inventor Gu Yu

Gu Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9385009
    Abstract: A semiconductor device has a semiconductor die mounted to a carrier. An encapsulant is deposited over the semiconductor die and carrier. The carrier is removed. A first insulating layer is formed over the encapsulant and semiconductor die. First vias are formed through the first insulating layer to expose contact pads of the semiconductor die. A first conductive layer is formed over the first insulating layer and into the first vias to electrically connect to the contact pads of the semiconductor die. A second insulating layer is formed over the first insulating layer and first conductive layer. Second vias are formed through the second insulating layer by laser direct ablation and aligned or offset with the first vias to expose the first conductive layer. A second conductive layer is formed over the second insulating layer and into the second vias. Conductive vias can be formed through the encapsulant.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: July 5, 2016
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Yaojian Lin, Rui Huang, Kang Cheng, Gu Yu
  • Publication number: 20130075924
    Abstract: A semiconductor device has a semiconductor die mounted to a carrier. An encapsulant is deposited over the semiconductor die and carrier. The carrier is removed. A first insulating layer is formed over the encapsulant and semiconductor die. First vias are formed through the first insulating layer to expose contact pads of the semiconductor die. A first conductive layer is formed over the first insulating layer and into the first vias to electrically connect to the contact pads of the semiconductor die. A second insulating layer is formed over the first insulating layer and first conductive layer. Second vias are formed through the second insulating layer by laser direct ablation and aligned or offset with the first vias to expose the first conductive layer. A second conductive layer is formed over the second insulating layer and into the second vias. Conductive vias can be formed through the encapsulant.
    Type: Application
    Filed: September 23, 2011
    Publication date: March 28, 2013
    Applicant: STATS CHIPPAC, LTD.
    Inventors: Yaojian Lin, Rui Huang, Kang Chen, Gu Yu
  • Patent number: 7748096
    Abstract: A recycling facilitating system including an item identification data input unit for inputting item identification data, an item disassembly data memory for storing item disassembly data in correspondence with the item identification data, an item disassembly data retrieval unit for retrieving the item disassembly data, a disassembly diagram constructing unit for constructing the disassembly diagram based on the item disassembly data, and a disassembly diagram output unit for outputting the disassembly diagram; the disassembly diagram constructing unit determines the progress status of an operation step of disassembling the item to be recycled by identifying a component that was removed during the operation step, and, in accordance with the progress status, constructs one of a plurality of disassembly diagrams, which can be constructed from the item disassembly data that was retrieved by the item disassembly data retrieval unit.
    Type: Grant
    Filed: January 26, 2006
    Date of Patent: July 6, 2010
    Assignee: Seiko Epson Corporation
    Inventors: Hitoshi Yamakado, Gu Yu, Toru Miyamoto
  • Patent number: 7080435
    Abstract: A recycling facilitating system including an item identification data input unit for inputting item identification data, an item disassembly data memory for storing item disassembly data in correspondence with the item identification data, an item disassembly data retrieval unit for retrieving the item disassembly data, a disassembly diagram constructing unit for constructing the disassembly diagram based on the item disassembly data, and a disassembly diagram output unit for outputting the disassembly diagram; the disassembly diagram constructing unit determines the progress status of an operation step of disassembling the item to be recycled by identifying a component that was removed during the operation step, and, in accordance with the progress status, constructs one of a plurality of disassembly diagrams, which can be constructed from the item disassembly data that was retrieved by the item disassembly data retrieval unit.
    Type: Grant
    Filed: January 14, 2004
    Date of Patent: July 25, 2006
    Assignee: Seiko Epson Corporation
    Inventors: Hitoshi Yamakado, Gu Yu, Toru Miyamoto
  • Publication number: 20060137163
    Abstract: A recycling facilitating system including an item identification data input unit for inputting item identification data, an item disassembly data memory for storing item disassembly data in correspondence with the item identification data, an item disassembly data retrieval unit for retrieving the item disassembly data, a disassembly diagram constructing unit for constructing the disassembly diagram based on the item disassembly data, and a disassembly diagram output unit for outputting the disassembly diagram; the disassembly diagram constructing unit determines the progress status of an operation step of disassembling the item to be recycled by identifying a component that was removed during the operation step, and, in accordance with the progress status, constructs one of a plurality of disassembly diagrams, which can be constructed from the item disassembly data that was retrieved by the item disassembly data retrieval unit.
    Type: Application
    Filed: January 26, 2006
    Publication date: June 29, 2006
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Hitoshi Yamakado, Gu Yu, Toru Miyamoto
  • Patent number: 7006884
    Abstract: A recycling analyzing system comprising: a standard operation time memory which stores standard time for disassembling operation of each component beforehand; an operation time memory which stores time for disassembling operation of each component to be disassembled; an operation time counting unit which counts the time for disassembling operation time of each component constituting the item to be recycled, and stores them in the operation time memory; and a difficult operation extracting unit which refers to the standard time stored in the standard operation time memory, and the time for disassembling operation of each component stored in the operation time memory, and extracts disassembling operations which is difficult.
    Type: Grant
    Filed: January 12, 2004
    Date of Patent: February 28, 2006
    Assignee: Seiko Epson Corporation
    Inventors: Hitoshi Yamakado, Gu Yu, Toru Miyamoto
  • Publication number: 20040215360
    Abstract: A recycling analyzing system comprising: a standard operation time memory which stores standard time for disassembling operation of each component beforehand; an operation time memory which stores time for disassembling operation of each component to be disassembled; an operation time counting unit which counts the time for disassembling operation time of each component constituting the item to be recycled, and stores them in the operation time memory; and a difficult operation extracting unit which refers to the standard time stored in the standard operation time memory, and the time for disassembling operation of each component stored in the operation time memory, and extracts disassembling operations which is difficult.
    Type: Application
    Filed: January 12, 2004
    Publication date: October 28, 2004
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Hitoshi Yamakado, Gu Yu, Toru Miyamoto
  • Publication number: 20040194273
    Abstract: A recycling facilitating system including an item identification data input unit for inputting item identification data, an item disassembly data memory for storing item disassembly data in correspondence with the item identification data, an item disassembly data retrieval unit for retrieving the item disassembly data, a disassembly diagram constructing unit for constructing the disassembly diagram based on the item disassembly data, and a disassembly diagram output unit for outputting the disassembly diagram; the disassembly diagram constructing unit determines the progress status of an operation step of disassembling the item to be recycled by identifying a component that was removed during the operation step, and, in accordance with the progress status, constructs one of a plurality of disassembly diagrams, which can be constructed from the item disassembly data that was retrieved by the item disassembly data retrieval unit.
    Type: Application
    Filed: January 14, 2004
    Publication date: October 7, 2004
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Hitoshi Yamakado, Gu Yu, Toru Miyamoto