Patents by Inventor Gu Yu
Gu Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240096431Abstract: A memory circuit includes a non-volatile memory cell, a comparator and a detection circuit. The comparator is coupled to the non-volatile memory cell, and configured to generate a first output signal. The comparator including a first input terminal and a first output terminal. The first input terminal is coupled to the non-volatile memory cell by a first node, and configured to receive a first voltage. The first output terminal is configured to output the first output signal. The detection circuit is coupled to the comparator and the non-volatile memory cell. The detection circuit is configured to latch the first output signal and disrupt a current path between at least the non-volatile memory cell and the comparator. The detection circuit includes a first inverter coupled to the first output terminal of the comparator and configured to generate an inverted first output signal.Type: ApplicationFiled: November 29, 2023Publication date: March 21, 2024Inventors: Chun-Hao CHANG, Gu-Huan LI, Shao-Yu CHOU
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Publication number: 20220004981Abstract: An operating method of an electronic apparatus for detecting misdelivery may comprise: monitoring a location of a courier terminal using at least one of first location information, second location information, and third location information; obtaining delivery completion information from the courier terminal; and detecting misdelivery of an item by a courier based on a delivery address and the location of the courier terminal. Accordingly, the electronic apparatus may induce correct delivery to the courier by determining misdelivery of the item based on the location of the courier and the delivery address.Type: ApplicationFiled: September 15, 2021Publication date: January 6, 2022Inventors: Ho Youn Son, Sung Gu Yu, Sung Han Kim, Ji Ho Chang, Sang Beom Kim, Han Sham Jeon
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Patent number: 11126952Abstract: An operating method of an electronic apparatus for detecting misdelivery may comprise: monitoring a location of a courier terminal using at least one of first location information, second location information, and third location information; obtaining delivery completion information from the courier terminal; and detecting misdelivery of an item by a courier based on a delivery address and the location of the courier terminal. Accordingly, the electronic apparatus may induce correct delivery to the courier by determining misdelivery of the item based on the location of the courier and the delivery address.Type: GrantFiled: September 16, 2020Date of Patent: September 21, 2021Assignee: Coupang Corp.Inventors: Ho Youn Son, Sung Gu Yu, Sung Han Kim, Ji Ho Chang, Sang Beom Kim, Han Sham Jeon
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Patent number: 9385009Abstract: A semiconductor device has a semiconductor die mounted to a carrier. An encapsulant is deposited over the semiconductor die and carrier. The carrier is removed. A first insulating layer is formed over the encapsulant and semiconductor die. First vias are formed through the first insulating layer to expose contact pads of the semiconductor die. A first conductive layer is formed over the first insulating layer and into the first vias to electrically connect to the contact pads of the semiconductor die. A second insulating layer is formed over the first insulating layer and first conductive layer. Second vias are formed through the second insulating layer by laser direct ablation and aligned or offset with the first vias to expose the first conductive layer. A second conductive layer is formed over the second insulating layer and into the second vias. Conductive vias can be formed through the encapsulant.Type: GrantFiled: September 23, 2011Date of Patent: July 5, 2016Assignee: STATS ChipPAC Pte. Ltd.Inventors: Yaojian Lin, Rui Huang, Kang Cheng, Gu Yu
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Publication number: 20150028015Abstract: A heating system for a steering wheel includes a rim is covered with different materials having a leather part and a wood grain part. The heating system includes a first heating body provided in the leather part and a second heating body is provided in the wood grain part. A power supply is connected with the first and second heating bodies so as to supply electric power thereto. A controller has a target temperature set for the first and second heating bodies and serves to, if the steering wheel needs to be heated, control the power supply to sequentially apply maximum electric power to the first and second heating bodies so as to regulate the heating operation of the first and second heating bodies.Type: ApplicationFiled: November 13, 2013Publication date: January 29, 2015Applicants: Youngmin Hi-Tech Co., Ltd., Hyundai Motor CompanyInventors: Sang Don PARK, Han Bae, Heui Geon Lee, Doo-Kwon Go, Pil Gu Yu
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Publication number: 20130252601Abstract: Provided is a remote control method of a snow removal system using a smart phone, which remotely controls the system installed at a site while checking conditions of a road and the system in real time when improvement of a road surface is needed because a condition of the road surface deteriorates due to dusts, yellow sand, frozen snow on the road surface, etc. The remote control method includes: accessing a remote terminal device in real time; allowing the access of the authorized manager using the smart phone; transmitting data; driving a CPU of the remote terminal device with SMS data to output a data value; stopping operation of the pump; comparing data input or output values stored and set in the CPU and a memory; determining whether to continuously perform a current operation; obtaining collected information; and feeding back all of the processed results to the smart phone.Type: ApplicationFiled: November 29, 2011Publication date: September 26, 2013Applicant: JOYFUL FUTURE CO., LTD.Inventors: Seung-Gu Yu, Seung-Hoon Lee
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Publication number: 20130075924Abstract: A semiconductor device has a semiconductor die mounted to a carrier. An encapsulant is deposited over the semiconductor die and carrier. The carrier is removed. A first insulating layer is formed over the encapsulant and semiconductor die. First vias are formed through the first insulating layer to expose contact pads of the semiconductor die. A first conductive layer is formed over the first insulating layer and into the first vias to electrically connect to the contact pads of the semiconductor die. A second insulating layer is formed over the first insulating layer and first conductive layer. Second vias are formed through the second insulating layer by laser direct ablation and aligned or offset with the first vias to expose the first conductive layer. A second conductive layer is formed over the second insulating layer and into the second vias. Conductive vias can be formed through the encapsulant.Type: ApplicationFiled: September 23, 2011Publication date: March 28, 2013Applicant: STATS CHIPPAC, LTD.Inventors: Yaojian Lin, Rui Huang, Kang Chen, Gu Yu
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Patent number: 7748096Abstract: A recycling facilitating system including an item identification data input unit for inputting item identification data, an item disassembly data memory for storing item disassembly data in correspondence with the item identification data, an item disassembly data retrieval unit for retrieving the item disassembly data, a disassembly diagram constructing unit for constructing the disassembly diagram based on the item disassembly data, and a disassembly diagram output unit for outputting the disassembly diagram; the disassembly diagram constructing unit determines the progress status of an operation step of disassembling the item to be recycled by identifying a component that was removed during the operation step, and, in accordance with the progress status, constructs one of a plurality of disassembly diagrams, which can be constructed from the item disassembly data that was retrieved by the item disassembly data retrieval unit.Type: GrantFiled: January 26, 2006Date of Patent: July 6, 2010Assignee: Seiko Epson CorporationInventors: Hitoshi Yamakado, Gu Yu, Toru Miyamoto
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Publication number: 20080232630Abstract: A condenser microphone package includes: a condenser microphone unit including a diaphragm and a back plate; a printed circuit board; a conductive connector sandwiched between and cooperating with the condenser microphone unit and the printed circuit board to form a stack; and a metal can encasing the stack and having a first end wall that is formed with a plurality of sound holes, and that abuts against the condenser microphone unit, and a second end wall that is disposed opposite to the first end wall, that abuts against the printed circuit board, and that cooperates with the first end wall to press the printed circuit board toward the condenser microphone unit.Type: ApplicationFiled: March 19, 2007Publication date: September 25, 2008Applicant: National Chung-Hsing UniversityInventors: Ray-Hua Horng, Chao-Chih Chang, Jean-Yih Tsai, Gu-Yu Hu, Yu-Ning Jing
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Patent number: 7080435Abstract: A recycling facilitating system including an item identification data input unit for inputting item identification data, an item disassembly data memory for storing item disassembly data in correspondence with the item identification data, an item disassembly data retrieval unit for retrieving the item disassembly data, a disassembly diagram constructing unit for constructing the disassembly diagram based on the item disassembly data, and a disassembly diagram output unit for outputting the disassembly diagram; the disassembly diagram constructing unit determines the progress status of an operation step of disassembling the item to be recycled by identifying a component that was removed during the operation step, and, in accordance with the progress status, constructs one of a plurality of disassembly diagrams, which can be constructed from the item disassembly data that was retrieved by the item disassembly data retrieval unit.Type: GrantFiled: January 14, 2004Date of Patent: July 25, 2006Assignee: Seiko Epson CorporationInventors: Hitoshi Yamakado, Gu Yu, Toru Miyamoto
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Publication number: 20060137163Abstract: A recycling facilitating system including an item identification data input unit for inputting item identification data, an item disassembly data memory for storing item disassembly data in correspondence with the item identification data, an item disassembly data retrieval unit for retrieving the item disassembly data, a disassembly diagram constructing unit for constructing the disassembly diagram based on the item disassembly data, and a disassembly diagram output unit for outputting the disassembly diagram; the disassembly diagram constructing unit determines the progress status of an operation step of disassembling the item to be recycled by identifying a component that was removed during the operation step, and, in accordance with the progress status, constructs one of a plurality of disassembly diagrams, which can be constructed from the item disassembly data that was retrieved by the item disassembly data retrieval unit.Type: ApplicationFiled: January 26, 2006Publication date: June 29, 2006Applicant: SEIKO EPSON CORPORATIONInventors: Hitoshi Yamakado, Gu Yu, Toru Miyamoto
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Patent number: 7006884Abstract: A recycling analyzing system comprising: a standard operation time memory which stores standard time for disassembling operation of each component beforehand; an operation time memory which stores time for disassembling operation of each component to be disassembled; an operation time counting unit which counts the time for disassembling operation time of each component constituting the item to be recycled, and stores them in the operation time memory; and a difficult operation extracting unit which refers to the standard time stored in the standard operation time memory, and the time for disassembling operation of each component stored in the operation time memory, and extracts disassembling operations which is difficult.Type: GrantFiled: January 12, 2004Date of Patent: February 28, 2006Assignee: Seiko Epson CorporationInventors: Hitoshi Yamakado, Gu Yu, Toru Miyamoto
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Publication number: 20040215360Abstract: A recycling analyzing system comprising: a standard operation time memory which stores standard time for disassembling operation of each component beforehand; an operation time memory which stores time for disassembling operation of each component to be disassembled; an operation time counting unit which counts the time for disassembling operation time of each component constituting the item to be recycled, and stores them in the operation time memory; and a difficult operation extracting unit which refers to the standard time stored in the standard operation time memory, and the time for disassembling operation of each component stored in the operation time memory, and extracts disassembling operations which is difficult.Type: ApplicationFiled: January 12, 2004Publication date: October 28, 2004Applicant: SEIKO EPSON CORPORATIONInventors: Hitoshi Yamakado, Gu Yu, Toru Miyamoto
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Publication number: 20040194273Abstract: A recycling facilitating system including an item identification data input unit for inputting item identification data, an item disassembly data memory for storing item disassembly data in correspondence with the item identification data, an item disassembly data retrieval unit for retrieving the item disassembly data, a disassembly diagram constructing unit for constructing the disassembly diagram based on the item disassembly data, and a disassembly diagram output unit for outputting the disassembly diagram; the disassembly diagram constructing unit determines the progress status of an operation step of disassembling the item to be recycled by identifying a component that was removed during the operation step, and, in accordance with the progress status, constructs one of a plurality of disassembly diagrams, which can be constructed from the item disassembly data that was retrieved by the item disassembly data retrieval unit.Type: ApplicationFiled: January 14, 2004Publication date: October 7, 2004Applicant: SEIKO EPSON CORPORATIONInventors: Hitoshi Yamakado, Gu Yu, Toru Miyamoto