Patents by Inventor Guan-Fu Lu

Guan-Fu Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10466429
    Abstract: An optical fiber module contains: a circuit board, a photoelectric assembly, a control assembly, a body, and a light transmission set. The body includes a first accommodation groove, a second accommodation groove accommodating the optoelectronic assembly, a first reflection portion facing the circuit board, a lens set accommodated in the second accommodation groove and aligning with the first reflection portion, a guide orifice, a converging lens extending from the guide orifice, and a second reflection portion adjacent to the converging lens, wherein the second reflection portion has a second reflecting face corresponding to the converging lens. The light transmission set includes multiple passing faces formed on a first surface thereof so as to face and correspond to the first reflection portion of the body, and the light transmission set includes multiple complete reflecting faces formed on a second surface thereof away from the multiple passing faces individually.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: November 5, 2019
    Assignee: ORANGETEK CORPORATION
    Inventors: Guan-Fu Lu, Chun-Yi Yeh, Chun-Chieh Chen, Chao-Hui Kuo
  • Patent number: 10409013
    Abstract: An optical fiber module includes a main body and at least one optical conducting set. One surface of the main body is formed with a recess set and an accommodation groove, the main body is formed with a reflection slot and a lens slot, disposed with a lens set on a surface of the lens slot, and disposed with a third lens close to the accommodation groove; the optical conducting set is disposed in the accommodation groove and includes a base material and at least one optical conducting member, one surface of the base material is formed with an optical pervious plane close to the third lens which is substantially corresponding to the optical pervious plane, the optical conducting member are formed on two surfaces of the base materials, and can allow a light source with different wavelengths to pass and allow light sources with other wavelengths to be reflected.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: September 10, 2019
    Assignee: ORANGETEK CORPORATION
    Inventors: Guan-Fu Lu, Chun-Yi Yeh, Chun-Chieh Chen, Chao-Hui Kuo
  • Patent number: 10268001
    Abstract: An optical communication module contains: a lens element, a fixer, and at least one optical fiber. The lens element includes a groove, a body, a top face, a light input face, at least one collimator lens, and a reflective bevel face. The at least one collimator lens is located within an orthographic projection range of a vertical viewing angle of the reflective bevel face, and the body has a light output face. The fixer is mounted beside the body and includes an accommodation recess and at least one focus face, wherein the at least one focus face corresponds to an orthographic projection range of a horizontal viewing angle of the light output face. The at least one optical fiber is inserted into the accommodation recess, and a glue is filled into the accommodation recess so that the at least one optical fiber is adhered in the lens element.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: April 23, 2019
    Assignee: Orangetek Corporation
    Inventors: Chun-Chieh Chen, Chao-Hui Kuo, Chun-Yi Yeh, Guan-Fu Lu
  • Publication number: 20190086619
    Abstract: An optical communication module contains: a lens element, a fixer, and at least one optical fiber. The lens element includes a groove, a body, a top face, a light input face, at least one collimator lens, and a reflective bevel face. The at least one collimator lens is located within an orthographic projection range of a vertical viewing angle of the reflective bevel face, and the body has a light output face. The fixer is mounted beside the body and includes an accommodation recess and at least one focus face, wherein the at least one focus face corresponds to an orthographic projection range of a horizontal viewing angle of the light output face. The at least one optical fiber is inserted into the accommodation recess, and a glue is filled into the accommodation recess so that the at least one optical fiber is adhered in the lens element.
    Type: Application
    Filed: September 18, 2017
    Publication date: March 21, 2019
    Inventors: Chun-Chieh CHEN, Chao-Hui KUO, Chun-Yi YEH, Guan-Fu LU
  • Patent number: 9923103
    Abstract: A detachable package structure that includes an assembly substrate, a first semiconductor substrate, a second semiconductor substrate, and a combination element is provided. The first semiconductor substrate is disposed on the assembly substrate and has a first alignment portion. The second semiconductor substrate has a second alignment portion. The combination element allows the first semiconductor substrate and the second semiconductor substrate to be detachably combined together, such that the first alignment portion and the second alignment portion are aligned and combined.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: March 20, 2018
    Assignee: Centera Photonics Inc.
    Inventors: Hsu-Liang Hsiao, Guan-Fu Lu, Tzu-Ching Yeh, Chun-Chiang Yen
  • Patent number: 9488791
    Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: November 8, 2016
    Assignee: Centera Photonics Inc.
    Inventors: Chia-Chi Chang, Guan-Fu Lu, Chun-Chiang Yen
  • Publication number: 20150316734
    Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.
    Type: Application
    Filed: April 28, 2015
    Publication date: November 5, 2015
    Inventors: Chia-Chi Chang, Guan-Fu Lu, Chun-Chiang Yen
  • Publication number: 20150255635
    Abstract: A detachable package structure that includes an assembly substrate, a first semiconductor substrate, a second semiconductor substrate, and a combination element is provided. The first semiconductor substrate is disposed on the assembly substrate and has a first alignment portion. The second semiconductor substrate has a second alignment portion. The combination element allows the first semiconductor substrate and the second semiconductor substrate to be detachably combined together, such that the first alignment portion and the second alignment portion are aligned and combined.
    Type: Application
    Filed: May 20, 2015
    Publication date: September 10, 2015
    Inventors: Hsu-Liang Hsiao, Guan-Fu Lu, Tzu-Ching Yeh, Chun-Chiang Yen
  • Patent number: 9064988
    Abstract: A photoelectric device package and a detachable package structure are provided. The photoelectric device package includes a bottom-plate, a top-plate, at least one photoelectric device, and at least one light-guiding element. The bottom-plate has a first carrying part and a first substrate part on the first carrying part. The first carrying part has first alignment portions. The first substrate part has second alignment portions. The top-plate has a second carrying part and a second substrate part on the second carrying part. The second carrying part has third alignment portions. The second substrate part has fourth alignment portions. The top-plate and the bottom-plate are assembled by the first and third alignment portions. The first and second substrate parts are positioned by the second and fourth alignment portions. Each photoelectric device is disposed on the first substrate part. Each light-guiding element is disposed between the first and second substrate parts.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: June 23, 2015
    Assignee: Centera Photonics Inc.
    Inventors: Hsu-Liang Hsiao, Guan-Fu Lu, Tzu-Ching Yeh, Chun-Chiang Yen
  • Patent number: 9057850
    Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: June 16, 2015
    Assignee: Centera Photonics Inc.
    Inventors: Chia-Chi Chang, Guan-Fu Lu, Chun-Chiang Yen
  • Patent number: 8666204
    Abstract: An optical transmission module includes a semiconductor substrate, a first film layer, an electronic component layer and a waveguide structure. The electronic component layer is used for converting a first electrical signal into an optical signal. The waveguide structure is formed on the first film layer, and includes a first reflective surface, a waveguide body and a second reflective surface. After the optical signal is transmitted through the semiconductor substrate and the first film layer and enters the waveguide structure, the optical signal is reflected by the first reflective surface, transmitted within the waveguide body and reflected by the second reflective surface. After the optical signal reflected by the second reflective surface is transmitted through the first film layer and the semiconductor substrate and received by the electronic component layer, the optical signal is converted into a second electrical signal by the electronic component layer.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: March 4, 2014
    Assignee: National Central University
    Inventors: Mao-Jen Wu, Hsiao-Chin Lan, Yun-Chih Lee, Chia-Chi Chang, Hsu-Liang Hsiao, Chin-Ta Chen, Bo-Kuan Shen, Guan-Fu Lu, Yan-Chong Chang, Jen-Yu Chang
  • Patent number: 8644654
    Abstract: The optical coupler module for converting and transmitting electrical/optical signals includes a semiconductor substrate, a first film, a second film, an electrical transmission unit, at least one signal conversion unit and an optical waveguide structure. The first film and the second film are formed on opposite surfaces of the semiconductor substrate. The signal conversion unit and the optical waveguide structure are disposed on opposite sides of the semiconductor substrate. The optical waveguide structure has a reflector and a waveguide body. The optical signal generated from the signal conversion unit sequentially passes the first film, the semiconductor substrate and the second film and enters the optical waveguide structure. Then, the optical signal is reflected by the reflector and transmitted in the waveguide body to be outputted. Alternatively, the optical signal is transmitted in a reverse direction from the optical waveguide structure to the signal conversion unit.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: February 4, 2014
    Assignee: National Central University
    Inventors: Mao-Jen Wu, Hsiao-Chin Lan, Yun-Chih Lee, Chia-Chi Chang, Hsu-Liang Hsiao, Chin-Ta Chen, Bo-Kuan Shen, Guan-Fu Lu, Yan-Chong Chang, Jen-Yu Chang
  • Publication number: 20130309801
    Abstract: A wafer-level process for fabricating a plurality of photoelectric modules is provided. The wafer-level process includes at least following procedures. Firstly, a wafer including a plurality of chips arranged in an array is provided. Next, a plurality of photoelectric devices are mounted on the chips. Next, a cover plate including a plurality of covering units arranged in an array is provided. Next, a plurality of light guiding mediums are formed over the cover plate. Next, the cover plate is bonded with the wafer by an adhesive, wherein each of the covering units covers and bonds with one of the chips, and the light guiding mediums are sandwiched between the cover plate and the wafer. Then, the wafer and the cover plate are diced to obtain the plurality of photoelectric modules.
    Type: Application
    Filed: May 15, 2012
    Publication date: November 21, 2013
    Applicant: CENTERA PHOTONICS INC.
    Inventors: Hsu-Liang Hsiao, Chun-Chiang Yen, Guan-Fu Lu
  • Patent number: 8588559
    Abstract: An optical coupler module includes a semiconductor substrate disposed on the print circuit board; a reflecting trench structure formed on the semiconductor substrate; a reflector formed on a slant surface of the reflecting trench structure; a strip trench structure formed on the semiconductor substrate and connecting with the reflecting trench structure; a thin film disposed on the above-mentioned structure. The optical coupler module further includes a signal conversion unit disposed on the semiconductor substrate and the position of the signal conversion unit corresponds to the reflector; and an optical waveguide structure formed in the trench structures. The optical signal from the signal conversion unit is reflected by the reflector and then transmitted in the optical waveguide structure, or in a reverse direction to reach the signal conversion unit.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: November 19, 2013
    Assignee: National Central University
    Inventors: Mao-Jen Wu, Hsiao-Chin Lan, Yun-Chih Lee, Chia-Chi Chang, Hsu-Liang Hsiao, Chin-Ta Chen, Bo-Kuan Shen, Guan-Fu Lu, Yan-Chong Chang, Jen-Yu Chang
  • Patent number: 8580589
    Abstract: A wafer-level process for fabricating a plurality of photoelectric modules is provided. The wafer-level process includes at least following procedures. Firstly, a wafer including a plurality of chips arranged in an array is provided. Next, a plurality of photoelectric devices are mounted on the chips. Next, a cover plate including a plurality of covering units arranged in an array is provided. Next, a plurality of light guiding mediums are formed over the cover plate. Next, the cover plate is bonded with the wafer by an adhesive, wherein each of the covering units covers and bonds with one of the chips, and the light guiding mediums are sandwiched between the cover plate and the wafer. Then, the wafer and the cover plate are diced to obtain the plurality of photoelectric modules.
    Type: Grant
    Filed: May 15, 2012
    Date of Patent: November 12, 2013
    Assignee: Centera Photonics Inc.
    Inventors: Hsu-Liang Hsiao, Chun-Chiang Yen, Guan-Fu Lu
  • Publication number: 20130270427
    Abstract: A photoelectric device package and a detachable package structure are provided. The photoelectric device package includes a bottom-plate, a top-plate, at least one photoelectric device, and at least one light-guiding element. The bottom-plate has a first carrying part and a first substrate part on the first carrying part. The first carrying part has first alignment portions. The first substrate part has second alignment portions. The top-plate has a second carrying part and a second substrate part on the second carrying part. The second carrying part has third alignment portions. The second substrate part has fourth alignment portions. The top-plate and the bottom-plate are assembled by the first and third alignment portions. The first and second substrate parts are positioned by the second and fourth alignment portions. Each photoelectric device is disposed on the first substrate part. Each light-guiding element is disposed between the first and second substrate parts.
    Type: Application
    Filed: December 20, 2012
    Publication date: October 17, 2013
    Applicant: CENTERA PHOTONICS INC.
    Inventors: Hsu-Liang Hsiao, Guan-Fu Lu, Tzu-Ching Yeh, Chun-Chiang Yen
  • Patent number: 8503835
    Abstract: The optical coupler module for converting and transmitting electrical/optical signals includes a semiconductor substrate, a first film, a second film, an electrical transmission unit, at least one signal conversion unit and an optical waveguide structure. The first film and the second film are formed on opposite surfaces of the semiconductor substrate. The signal conversion unit and the optical waveguide structure are disposed on opposite sides of the semiconductor substrate. The optical waveguide structure has a reflector and a waveguide body. The optical signal generated from the signal conversion unit sequentially passes the first film, the semiconductor substrate and the second film and enters the optical waveguide structure. Then, the optical signal is reflected by the reflector and transmitted in the waveguide body to be outputted. Alternatively, the optical signal is transmitted in a reverse direction from the optical waveguide structure to the signal conversion unit.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: August 6, 2013
    Assignee: National Central University
    Inventors: Mao-Jen Wu, Hsiao-Chin Lan, Yun-Chih Lee, Chia-Chi Chang, Hsu-Liang Hsiao, Chin-Ta Chen, Bo-Kuan Shen, Guan-Fu Lu, Yan-Chong Chang, Jen-Yu Chang
  • Publication number: 20120241795
    Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.
    Type: Application
    Filed: March 22, 2012
    Publication date: September 27, 2012
    Applicant: Centera Photonics Inc.
    Inventors: Chia-Chi CHANG, Guan-Fu Lu, Chun-Chiang Yen
  • Publication number: 20120057822
    Abstract: An optical coupler module includes a semiconductor substrate disposed on the print circuit board; a reflecting trench structure formed on the semiconductor substrate; a reflector formed on a slant surface of the reflecting trench structure; a strip trench structure formed on the semiconductor substrate and connecting with the reflecting trench structure; a thin film disposed on the above-mentioned structure. The optical coupler module further includes a signal conversion unit disposed on the semiconductor substrate and the position of the signal conversion unit corresponds to the reflector; and an optical waveguide structure formed in the trench structures. The optical signal from the signal conversion unit is reflected by the reflector and then transmitted in the optical waveguide structure, or in a reverse direction to reach the signal conversion unit.
    Type: Application
    Filed: September 6, 2011
    Publication date: March 8, 2012
    Applicant: National Central University
    Inventors: Mao-Jen WU, Hsiao-Chin Lan, Yun-Chih Lee, Chia-Chi Chang, Hsu-Liang Hsiao, Chin-Ta Chen, Bo-Kuan Shen, Guan-Fu Lu, Yan-Chong Chang, Jen-Yu Chang
  • Publication number: 20110286695
    Abstract: The optical coupler module for converting and transmitting electrical/optical signals includes a semiconductor substrate, a first film, a second film, an electrical transmission unit, at least one signal conversion unit and an optical waveguide structure. The first film and the second film are formed on opposite surfaces of the semiconductor substrate. The signal conversion unit and the optical waveguide structure are disposed on opposite sides of the semiconductor substrate. The optical waveguide structure has a reflector and a waveguide body. The optical signal generated from the signal conversion unit sequentially passes the first film, the semiconductor substrate and the second film and enters the optical waveguide structure. Then, the optical signal is reflected by the reflector and transmitted in the waveguide body to be outputted. Alternatively, the optical signal is transmitted in a reverse direction from the optical waveguide structure to the signal conversion unit.
    Type: Application
    Filed: May 24, 2011
    Publication date: November 24, 2011
    Applicant: National Central University
    Inventors: Mao-Jen WU, Hsiao-Chin Lan, Yun-Chih Lee, Chia-Chi Chang, Hsu-Liang Hsiao, Chin-Ta Chen, Bo-Kuan Shen, Guan-Fu Lu, Yan-Chong Chang, Jen-Yu Chang