Abstract: An optical signal generating apparatus is provided. A plurality of optical waveguides is disposed in different dielectric layers. A first light splitting pattern and a second light splitting pattern are disposed in the optical waveguides. The first light splitting pattern includes a first heterogeneous layer portion intersected with the second light splitting pattern in different dielectric layers to form at least one first intersection, the first heterogeneous layer portion and the second light splitting pattern are disposed in different optical waveguides, and a light beam with a specific wavelength, transmitted by the first light splitting pattern, is subject to a layer-to-layer transition before reaching the first intersection, so as to enter different optical waveguides.

Abstract: An optical signal generating apparatus is provided. A plurality of optical waveguides is disposed in different dielectric layers. A first light splitting pattern and a second light splitting pattern are disposed in the optical waveguides. The first light splitting pattern includes a first heterogeneous layer portion intersected with the second light splitting pattern in different dielectric layers to form at least one first intersection, the first heterogeneous layer portion and the second light splitting pattern are disposed in different optical waveguides, and a light beam with a specific wavelength, transmitted by the first light splitting pattern, is subject to a layer-to-layer transition before reaching the first intersection, so as to enter different optical waveguides.

Abstract: An electro absorption modulating apparatus is provided. A plurality of electro absorption modulators are disposed on a light transmission path. A controller controls a selection driving circuit to select one of the plurality of electro absorption modulators to perform light modulation on a light beam transmitted by the light transmission path, so as to generate a light modulation signal.

Abstract: An optical fiber module contains: a circuit board, a photoelectric assembly, a control assembly, a body, and a light transmission set. The body includes a first accommodation groove, a second accommodation groove accommodating the optoelectronic assembly, a first reflection portion facing the circuit board, a lens set accommodated in the second accommodation groove and aligning with the first reflection portion, a guide orifice, a converging lens extending from the guide orifice, and a second reflection portion adjacent to the converging lens, wherein the second reflection portion has a second reflecting face corresponding to the converging lens. The light transmission set includes multiple passing faces formed on a first surface thereof so as to face and correspond to the first reflection portion of the body, and the light transmission set includes multiple complete reflecting faces formed on a second surface thereof away from the multiple passing faces individually.

Abstract: An optical fiber module includes a main body and at least one optical conducting set. One surface of the main body is formed with a recess set and an accommodation groove, the main body is formed with a reflection slot and a lens slot, disposed with a lens set on a surface of the lens slot, and disposed with a third lens close to the accommodation groove; the optical conducting set is disposed in the accommodation groove and includes a base material and at least one optical conducting member, one surface of the base material is formed with an optical pervious plane close to the third lens which is substantially corresponding to the optical pervious plane, the optical conducting member are formed on two surfaces of the base materials, and can allow a light source with different wavelengths to pass and allow light sources with other wavelengths to be reflected.

Abstract: An optical communication module contains: a lens element, a fixer, and at least one optical fiber. The lens element includes a groove, a body, a top face, a light input face, at least one collimator lens, and a reflective bevel face. The at least one collimator lens is located within an orthographic projection range of a vertical viewing angle of the reflective bevel face, and the body has a light output face. The fixer is mounted beside the body and includes an accommodation recess and at least one focus face, wherein the at least one focus face corresponds to an orthographic projection range of a horizontal viewing angle of the light output face. The at least one optical fiber is inserted into the accommodation recess, and a glue is filled into the accommodation recess so that the at least one optical fiber is adhered in the lens element.

Abstract: An optical communication module contains: a lens element, a fixer, and at least one optical fiber. The lens element includes a groove, a body, a top face, a light input face, at least one collimator lens, and a reflective bevel face. The at least one collimator lens is located within an orthographic projection range of a vertical viewing angle of the reflective bevel face, and the body has a light output face. The fixer is mounted beside the body and includes an accommodation recess and at least one focus face, wherein the at least one focus face corresponds to an orthographic projection range of a horizontal viewing angle of the light output face. The at least one optical fiber is inserted into the accommodation recess, and a glue is filled into the accommodation recess so that the at least one optical fiber is adhered in the lens element.

Abstract: A detachable package structure that includes an assembly substrate, a first semiconductor substrate, a second semiconductor substrate, and a combination element is provided. The first semiconductor substrate is disposed on the assembly substrate and has a first alignment portion. The second semiconductor substrate has a second alignment portion. The combination element allows the first semiconductor substrate and the second semiconductor substrate to be detachably combined together, such that the first alignment portion and the second alignment portion are aligned and combined.

Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.

Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.

Abstract: A detachable package structure that includes an assembly substrate, a first semiconductor substrate, a second semiconductor substrate, and a combination element is provided. The first semiconductor substrate is disposed on the assembly substrate and has a first alignment portion. The second semiconductor substrate has a second alignment portion. The combination element allows the first semiconductor substrate and the second semiconductor substrate to be detachably combined together, such that the first alignment portion and the second alignment portion are aligned and combined.

Abstract: A photoelectric device package and a detachable package structure are provided. The photoelectric device package includes a bottom-plate, a top-plate, at least one photoelectric device, and at least one light-guiding element. The bottom-plate has a first carrying part and a first substrate part on the first carrying part. The first carrying part has first alignment portions. The first substrate part has second alignment portions. The top-plate has a second carrying part and a second substrate part on the second carrying part. The second carrying part has third alignment portions. The second substrate part has fourth alignment portions. The top-plate and the bottom-plate are assembled by the first and third alignment portions. The first and second substrate parts are positioned by the second and fourth alignment portions. Each photoelectric device is disposed on the first substrate part. Each light-guiding element is disposed between the first and second substrate parts.

Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.

Abstract: An optical transmission module includes a semiconductor substrate, a first film layer, an electronic component layer and a waveguide structure. The electronic component layer is used for converting a first electrical signal into an optical signal. The waveguide structure is formed on the first film layer, and includes a first reflective surface, a waveguide body and a second reflective surface. After the optical signal is transmitted through the semiconductor substrate and the first film layer and enters the waveguide structure, the optical signal is reflected by the first reflective surface, transmitted within the waveguide body and reflected by the second reflective surface. After the optical signal reflected by the second reflective surface is transmitted through the first film layer and the semiconductor substrate and received by the electronic component layer, the optical signal is converted into a second electrical signal by the electronic component layer.

Abstract: The optical coupler module for converting and transmitting electrical/optical signals includes a semiconductor substrate, a first film, a second film, an electrical transmission unit, at least one signal conversion unit and an optical waveguide structure. The first film and the second film are formed on opposite surfaces of the semiconductor substrate. The signal conversion unit and the optical waveguide structure are disposed on opposite sides of the semiconductor substrate. The optical waveguide structure has a reflector and a waveguide body. The optical signal generated from the signal conversion unit sequentially passes the first film, the semiconductor substrate and the second film and enters the optical waveguide structure. Then, the optical signal is reflected by the reflector and transmitted in the waveguide body to be outputted. Alternatively, the optical signal is transmitted in a reverse direction from the optical waveguide structure to the signal conversion unit.

Abstract: A wafer-level process for fabricating a plurality of photoelectric modules is provided. The wafer-level process includes at least following procedures. Firstly, a wafer including a plurality of chips arranged in an array is provided. Next, a plurality of photoelectric devices are mounted on the chips. Next, a cover plate including a plurality of covering units arranged in an array is provided. Next, a plurality of light guiding mediums are formed over the cover plate. Next, the cover plate is bonded with the wafer by an adhesive, wherein each of the covering units covers and bonds with one of the chips, and the light guiding mediums are sandwiched between the cover plate and the wafer. Then, the wafer and the cover plate are diced to obtain the plurality of photoelectric modules.

Abstract: An optical coupler module includes a semiconductor substrate disposed on the print circuit board; a reflecting trench structure formed on the semiconductor substrate; a reflector formed on a slant surface of the reflecting trench structure; a strip trench structure formed on the semiconductor substrate and connecting with the reflecting trench structure; a thin film disposed on the above-mentioned structure. The optical coupler module further includes a signal conversion unit disposed on the semiconductor substrate and the position of the signal conversion unit corresponds to the reflector; and an optical waveguide structure formed in the trench structures. The optical signal from the signal conversion unit is reflected by the reflector and then transmitted in the optical waveguide structure, or in a reverse direction to reach the signal conversion unit.

Abstract: A wafer-level process for fabricating a plurality of photoelectric modules is provided. The wafer-level process includes at least following procedures. Firstly, a wafer including a plurality of chips arranged in an array is provided. Next, a plurality of photoelectric devices are mounted on the chips. Next, a cover plate including a plurality of covering units arranged in an array is provided. Next, a plurality of light guiding mediums are formed over the cover plate. Next, the cover plate is bonded with the wafer by an adhesive, wherein each of the covering units covers and bonds with one of the chips, and the light guiding mediums are sandwiched between the cover plate and the wafer. Then, the wafer and the cover plate are diced to obtain the plurality of photoelectric modules.

Abstract: A photoelectric device package and a detachable package structure are provided. The photoelectric device package includes a bottom-plate, a top-plate, at least one photoelectric device, and at least one light-guiding element. The bottom-plate has a first carrying part and a first substrate part on the first carrying part. The first carrying part has first alignment portions. The first substrate part has second alignment portions. The top-plate has a second carrying part and a second substrate part on the second carrying part. The second carrying part has third alignment portions. The second substrate part has fourth alignment portions. The top-plate and the bottom-plate are assembled by the first and third alignment portions. The first and second substrate parts are positioned by the second and fourth alignment portions. Each photoelectric device is disposed on the first substrate part. Each light-guiding element is disposed between the first and second substrate parts.

Abstract: The optical coupler module for converting and transmitting electrical/optical signals includes a semiconductor substrate, a first film, a second film, an electrical transmission unit, at least one signal conversion unit and an optical waveguide structure. The first film and the second film are formed on opposite surfaces of the semiconductor substrate. The signal conversion unit and the optical waveguide structure are disposed on opposite sides of the semiconductor substrate. The optical waveguide structure has a reflector and a waveguide body. The optical signal generated from the signal conversion unit sequentially passes the first film, the semiconductor substrate and the second film and enters the optical waveguide structure. Then, the optical signal is reflected by the reflector and transmitted in the waveguide body to be outputted. Alternatively, the optical signal is transmitted in a reverse direction from the optical waveguide structure to the signal conversion unit.