Patents by Inventor Guan Hock Yeow

Guan Hock Yeow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Attachment of wafer level optics
    Patent number: 9118825
    Abstract: A technique for assembling camera modules that includes attaching optical elements, such as an optics stack, directly to the upper surface of an image sensor. A housing may be provided to partially surrounded the optics stack. Alternatively, the housing can be provided by a transfer molding process. This technique can be applied in array processing scenario and solder balls can be attached to the bottom of the image sensor to provide an efficiently-produced and low cost camera module.
    Type: Grant
    Filed: February 10, 2009
    Date of Patent: August 25, 2015
    Assignee: NAN CHANG O-FILM OPTOELECTRONICS TECHNOLOGY LTD.
    Inventors: Harpuneet Singh, Irmina Carpio, Guan Hock Yeow
  • ATTACHMENT OF WAFER LEVEL OPTICS
    Publication number: 20090213262
    Abstract: A technique for assembling camera modules that includes attaching optical elements, such as an optics stack, directly to the upper surface of an image sensor. A housing may be provided to partially surrounded the optics stack. Alternatively, the housing can be provided by a transfer molding process. This technique can be applied in array processing scenario and solder balls can be attached to the bottom of the image sensor to provide an efficiently-produced and low cost camera module.
    Type: Application
    Filed: February 10, 2009
    Publication date: August 27, 2009
    Applicant: FLEXTRONICS AP, LLC
    Inventors: Harpuneet Singh, Irmina Carpio, Guan Hock Yeow