Abstract: The present invention provides a battery balance system which includes a plurality of battery modules and a control module. Each of the battery modules includes a battery, a passive power adjustment unit and an active power adjustment unit. The passive power adjustment units and the active power adjustment units are coupled to the batteries. The control module is coupled to the battery modules, and is configured to monitor charging powers of the batteries. In a charging period, when a charging power of a first battery of a first battery module of the battery modules is higher than a charging power of a second battery of a second battery module of the battery modules, the control module enables the passive power adjustment unit of the first battery module. The control module determines whether or not to enable the active power adjustment unit of the first battery module according to a charging power difference between the first battery and the second battery.

Abstract: The invention provides a punching packaged light-emitting diode apparatus, which comprises: a substrate, including a first molding material, a first nano heat conductive material, and a first fluorescent material; a light-emitting unit, located on a surface of the substrate; two wiring units, individually connected to the light-emitting unit; and a packaging material, including a second molding material, a high refractive material, a second nano heat conductive material, and a second fluorescent material, to cover the wiring units and the light-emitting unit in a solidified structure formed by a punching process; wherein, the light-emitting unit emits light to outside through the substrate and the packaging material.

Abstract: A light-emitting diode lighting apparatus includes a light emitting package structure; a plurality of light-emitting diode (LED) units; a rectifier unit for driving the light-emitting diode (LED) units; a first linear constant current unit electrically coupled with an output end of the light-emitting diode (LED) units; a light-modulating unit electrically coupled with the first linear constant current unit for modulating a current of the first linear constant current unit; a second linear constant current unit electrically coupled with the rectifier unit; and an electrolytic capacitor coupled and cooperated with the second linear constant current unit for providing a buffer for the light-emitting diode (LED) units. The second linear constant current unit and the electrolytic capacitor are both electrically coupled with an input end of the light emitting diode (LED) units.

Abstract: The invention provides an integrally packaged lighting device comprising: a package body, a plurality of light-emitting diode units, a rectifier unit, a linear constant current unit, and a wireless dimming unit. The light-emitting diode units are set in the package body. The rectifier unit is used for providing power to the light-emitting diode units. The linear constant current unit electrically connects with a common node of the light-emitting diode units for controlling each of the light-emitting diode units. The wireless dimming unit is used for wirelessly controlling the linear constant current unit. At least part of the light-emitting device unit, at least part of the rectifier unit, at least part of the linear constant current unit, and at least part of the wireless dimming unit are embedded in the material of the package body.

Abstract: The invention provides an integrated light-emitting diode driving circuit, embedded in an enclosure shell for packing a light-emitting diode. The integrated light-emitting diode driving circuit includes: a rectifier, at least one control module, at least one switch, and at least one light-emitting diode module. When an input DC voltage from the rectifier reaches a driving voltage value, the switch is switched on by the control module to turn on the light-emitting diode module to emit light. When the light-emitting diode module emits the light over a predetermined time, the switch is switched off by the control module to turn off the light-emitting diode module from emitting the light.

Abstract: The invention provides a punching packaged light-emitting diode apparatus, which comprises: a substrate, including a first molding material, a first nano heat conductive material, and a first fluorescent material; a light-emitting unit, located on a surface of the substrate; two wiring units, individually connected to the light-emitting unit; and a packaging material, including a second molding material, a high refractive material, a second nano heat conductive material, and a second fluorescent material, to cover the wiring units and the light-emitting unit in a solidified structure formed by a punching process; wherein, the light-emitting unit emits light to outside through the substrate and the packaging material.

Abstract: The invention provides an integrated light-emitting diode driving circuit, embedded in an enclosure shell for packing a light-emitting diode. The integrated light-emitting diode driving circuit includes: a rectifier, at least one control module, at least one switch, and at least one light-emitting diode module. When an input DC voltage from the rectifier reaches a driving voltage value, the switch is switched on by the control module to turn on the light-emitting diode module to emit light. When the light-emitting diode module emits the light over a predetermined time, the switch is switched off by the control module to turn off the light-emitting diode module from emitting the light.

Abstract: The invention provides a shell integrated light-emitting diode assembly, which includes: a plurality of light-emitting units, each of the light-emitting units including at least one light-emitting chip and an external wiring which is coupled to the light-emitting chip; and a shell structure, formed as a consolidation structure by a molding material for enclosing the light-emitting units to be inside the molding material; wherein the light-emitting units emit light through the molding material into an outside of the shell structure. The present invention also provides a shell integrated light-emitting diode lamp with the shell integrated light-emitting diode assembly, and a manufacturing method for the shell integrated light-emitting diode assembly.

Abstract: The invention provides a shell integrated light-emitting diode assembly, which includes: a plurality of light-emitting units, each of the light-emitting units including at least one light-emitting chip and an external wiring which is coupled to the light-emitting chip; and a shell structure, formed as a consolidation structure by a molding material for enclosing the light-emitting units to be inside the molding material; wherein the light-emitting units emit light through the molding material into an outside of the shell structure. The present invention also provides a shell integrated light-emitting diode lamp with the shell integrated light-emitting diode assembly, and a manufacturing method for the shell integrated light-emitting diode assembly.

Abstract: A white light emitting diode comprising a substrate layer, two conductive frames, a light emitting unit, two conductive wires, and a packaging element is provided. The substrate layer is made from a curing reaction of first mixture, and the first mixture includes a curable resin, a curing agent, a phosphor material, and a modified thermal conductive nano-material, wherein the modified thermal conductive nano-material is made from a thermal conductive nano-material and a silane compound. The packaging element is made from a curing reaction of second mixture, and the second mixture includes a curable resin, a curing agent, a phosphor material, and a modified thermal conductive nano-material, wherein the modified thermal conductive nano-material is made from a thermal conductive nano-material and a silane compound. The chip-type white light emitting diode has a good heat-dissipating effect and a good luminous efficiency without additional heat dissipation fins.

Abstract: A white light emitting diode comprising a substrate layer, two conductive frames, a light emitting unit, two conductive wires, and a packaging element is provided. The substrate layer is made from a curing reaction of first mixture, and the first mixture includes a curable resin, a curing agent, a phosphor material, and a modified thermal conductive nano-material, wherein the modified thermal conductive nano-material is made from a thermal conductive nano-material and a silane compound. The packaging element is made from a curing reaction of second mixture, and the second mixture includes a curable resin, a curing agent, a phosphor material, and a modified thermal conductive nano-material, wherein the modified thermal conductive nano-material is made from a thermal conductive nano-material and a silane compound. The chip-type white light emitting diode has a good heat-dissipating effect and a good luminous efficiency without additional heat dissipation fins.