Patents by Inventor Guan Liao

Guan Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240039205
    Abstract: An electrical receptacle connector includes an insulated housing, a plurality of receptacle terminals, and a metallic shell. A hollow portion is between a base portion and a tongue portion of the insulated housing, and body portions of the receptacle terminals penetrate through the base portion and the tongue portion and are partially exposed from the hollow portion. The metallic shell covers the insulated housing and covers the hollow portion to form a potting space at the hollow portion. The metallic shell has a potting opening corresponding to the potting space. When a sealing body is poured into the potting opening, the sealing body is provided between the insulated housing and the receptacle terminals. Hence, the waterproof function of the electrical receptacle connector can be achieved.
    Type: Application
    Filed: July 31, 2023
    Publication date: February 1, 2024
    Inventors: Yu-Bin Li, Guan Liao, Shu-Fen Wang
  • Publication number: 20230327370
    Abstract: An electrical connector including an insulating body, multiple terminals, a first housing, and a sealing ring is provided. The terminals are disposed in the insulating body. The first housing is assembled to the insulating body and surrounds the insulating body and the terminals. An exterior wall of the first housing is divided into a first area and a second area which are different from each other. A coating layer is disposed onto a surface of the second area. A surface of the first area is a raw material surface of the first housing. The sealing ring is disposed in the first area.
    Type: Application
    Filed: April 5, 2023
    Publication date: October 12, 2023
    Applicant: Advanced Connectek Inc.
    Inventors: Yubin Li, Guan Liao, Shu-Fen Wang
  • Publication number: 20230170646
    Abstract: An electrical connector including a plurality of terminals, a first insulating body, a second insulating body, a shell, and a waterproof member is provided. The terminals are respectively retained in the first insulating body and the second insulating body. The shell is sheathed to the first insulating body and the second insulating body. The shell has a front edge and a rear edge opposite to each other along an insertion direction. The front edge is used for mating another electrical connector. At least one opening is formed by the rear edge and the second insulating body. The first insulating body and the second insulating body are separated from each other. A space is formed by the first insulating body, the second insulating body, and the shell. The space is communicated with an external environment via the at least one opening. The waterproof member is filled into the space.
    Type: Application
    Filed: November 24, 2022
    Publication date: June 1, 2023
    Applicant: Advanced Connectek Inc.
    Inventors: Yubin Li, Yao Mei Wang, Guan Liao, Pin-Yuan Hou, Shu-Fen Wang
  • Patent number: 10616149
    Abstract: In certain embodiments, evaluations of effectiveness are optimized for multiple electronic message versions. For example, a server receives, subsequent to first electronic messages being transmitted over a first time period, responsive electronic data automatically generated by interactions with these messages. The server controls, based on the responsive electronic data, transmission of second electronic messages to recipients. For instance, the server provides an interface for configuring a test transmission of different test message versions to segments of recipients, where each version includes a different combination of message attributes. The server receives a selection of options via the interface for the test transmission, identifies an adverse impact on the test transmission associated with the selection, and indicates the adverse impact via the interface. The server subsequently receives, via the interface, a modification to the test transmission options.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: April 7, 2020
    Assignee: THE ROCKET SCIENCE GROUP LLC
    Inventors: Mardav Wala, Guan Liao, Michaela Moore, John Foreman
  • Publication number: 20180219808
    Abstract: In certain embodiments, evaluations of effectiveness are optimized for multiple electronic message versions. For example, a server receives, subsequent to first electronic messages being transmitted over a first time period, responsive electronic data automatically generated by interactions with these messages. The server controls, based on the responsive electronic data, transmission of second electronic messages to recipients. For instance, the server provides an interface for configuring a test transmission of different test message versions to segments of recipients, where each version includes a different combination of message attributes. The server receives a selection of options via the interface for the test transmission, identifies an adverse impact on the test transmission associated with the selection, and indicates the adverse impact via the interface. The server subsequently receives, via the interface, a modification to the test transmission options.
    Type: Application
    Filed: August 10, 2016
    Publication date: August 2, 2018
    Applicant: THE ROCKET SCIENCE GROUP LLC
    Inventors: Mardav Wala, Guan Liao, Michaela Moore, John Foreman
  • Publication number: 20140080313
    Abstract: An etching composition for a semiconductor wafer is provided, including 0.5-50 wt % base, 10-80 wt % alcohol, 0.01-15 wt % additive and water. A method for etching a semiconductor wafer is also provided. When the etching composition is applied to the entire surface or a partial surface of the semiconductor wafer at 60-200° C., the etching composition reacts on the semiconductor wafer to form a foam that etches the semiconductor wafer and includes a solid, a liquid and a gas. At the same time, the additive forms an oxide mask on the surface of the semiconductor wafer. Therefore, an excellent texture structure is formed on the surface of the semiconductor wafer, and a single surface of the semiconductor wafer is etched.
    Type: Application
    Filed: December 21, 2012
    Publication date: March 20, 2014
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Sheng-Min YU, Wen-Ching SUN, Tai-Jui WANG, Yi-Fan CHEN, Chia-Liang SUN, Hao-Hsiang CHIANG, Pin-Guan LIAO, Chi-Fan CHIANG, Tzer-Shen LIN