Patents by Inventor Guan-Min ZENG

Guan-Min ZENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro-resistance structure with high bending strength, manufacturing method and semi-finished structure thereof
    Patent number: 9728306
    Abstract: A micro-resistance structure with high bending strength is disclosed. The micro-resistance structure with high bending strength comprises a multi-layer metallic substrate; a patterned electrode layer disposed on a lower surface of the multi-layer metallic substrate; an encapsulant layer covering a portion of the multi-layer metallic substrate, wherein the encapsulant layer is substantially made of a flexible resin ink; and two external electrodes, which are electrically insulated from each other, covering the exposed portion of the multi-layer metallic substrate. The abovementioned structure is characterized in high bendability and applicable to wearable devices. A manufacturing method and a semi-finished structure of the micro-resistance structure with high bending strength are also disclosed herein.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: August 8, 2017
    Assignee: VIKING TECH CORPORATION
    Inventors: Chi-Yu Lu, Chien-Ming Shao, Chien-Chung Yu, Guan-Min Zeng
  • Micro-Resistance Structure with High Bending Strength, Manufacturing Method and Semi-Finished Structure Thereof
    Publication number: 20160064122
    Abstract: A micro-resistance structure with high bending strength is disclosed. The micro-resistance structure with high bending strength comprises a multi-layer metallic substrate; a patterned electrode layer disposed on a lower surface of the multi-layer metallic substrate; an encapsulant layer covering a portion of the multi-layer metallic substrate, wherein the encapsulant layer is substantially made of a flexible resin ink; and two external electrodes, which are electrically insulated from each other, covering the exposed portion of the multi-layer metallic substrate. The abovementioned structure is characterized in high bendability and applicable to wearable devices. A manufacturing method and a semi-finished structure of the micro-resistance structure with high bending strength are also disclosed herein.
    Type: Application
    Filed: August 5, 2015
    Publication date: March 3, 2016
    Inventors: Chi-Yu LU, Chien-Ming SHAO, Chien-Chung YU, Guan-Min ZENG