Abstract: A method of forming a packaged multichip module includes molding a set of chips in a medium, mapping a position and orientation of the chips, forming an interconnect substrate. The forming of the interconnect structure including patterning a first interconnect layer to form a first plurality of patterned vias that each have an opening that is configured to connect with an interconnect formed on the chips based at least in part on the position and orientation information, and bonding the interconnect substrate to the multichip module. The bonding includes positioning and aligning the interconnect substrate to the chips such that the interconnects are aligned with the first plurality of patterned vias and attaching a stacked chip to the multichip module via the interconnect substrate, wherein interconnects of the stacked chip are electrically coupled to conductive layers formed in the first plurality of patterned vias of the first interconnect layer.

Abstract: A method of forming a multichip module includes molding a set of chips in a medium to secure each chip relative to each other chip, mapping a position and orientation of the chips within the molded set of chips based on alignment marks disposed on each chip within the molded set of chips, forming an interconnect substrate including forming a first interconnect layer over a base substrate, patterning the first interconnect layer to include a first plurality of patterned vias that are patterned based at least in part on the mapping, and bonding the interconnect substrate the multichip module, wherein bonding comprises positioning and aligning the interconnect substrate to the molded set of chips such that interconnects of each chip within the molded set of chips are aligned with the first plurality of patterned vias formed in the interconnect substrate.

Abstract: Embodiments of the invention generally provide a substrate processing system and method. The substrate processing system generally includes two primary components. The first component is an interface section having at least one first substrate transfer robot positioned therein, and the second component is at least one processing module in communication with the interface section, the at least one processing module having a pretreatment and post treatment cell, a processing cell, at a second substrate transfer robot positioned therein. The substrate processing method generally includes transporting a dry substrate to a processing module via a dry interface. Once the substrate is positioned in the processing module, a robot transfers the substrate between a treatment cell and a processing cell contained within the processing module to complete a predetermined sequence of processing steps.

Abstract: Embodiments of the invention generally provide a substrate processing system and method. The substrate processing system generally includes two primary components. The first component is an interface section having at least one first substrate transfer robot positioned therein, and the second component is at least one processing module in communication with the interface section, the at least one processing module having a pretreatment and post treatment cell, a processing cell, at a second substrate transfer robot positioned therein. The substrate processing method generally includes transporting a dry substrate to a processing module via a dry interface. Once the substrate is positioned in the processing module, a robot transfers the substrate between a treatment cell and a processing cell contained within the processing module to complete a predetermined sequence of processing steps.