Patents by Inventor Guan SUN

Guan SUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984302
    Abstract: A plasma chamber includes a chamber body having a processing region therewithin, a liner disposed on the chamber body, the liner surrounding the processing region, a substrate support disposed within the liner, a magnet assembly comprising a plurality of magnets disposed around the liner, and a magnetic-material shield disposed around the liner, the magnetic-material shield encapsulating the processing region near the substrate support.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: May 14, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Job George Konnoth Joseph, Sathya Swaroop Ganta, Kallol Bera, Andrew Nguyen, Jay D. Pinson, II, Akshay Dhanakshirur, Kaushik Comandoor Alayavalli, Canfeng Lai, Ren-Guan Duan, Jennifer Y. Sun, Anil Kumar Kalal, Abhishek Pandey
  • Publication number: 20240036255
    Abstract: A system may perform an uptapering process to cause a signal fiber to have a fiber core with a first uptapered thickness profile and a fiber cladding with a second uptapered thickness profile. The system may perform, after performing the uptapering process, an uptapering removal process to cause the fiber cladding of the signal fiber to not have the second uptapered thickness profile. The system may perform, after performing the uptapering removal process, a bundling process to bundle the signal fiber and a set of one or more pump fibers in a bundle configuration. The system may perform, after performing the bundling process, a bundle unification process to cause the bundle configuration to form a unified bundle configuration. The system may perform, after performing the bundle unification process, an attachment process to cause an end of the unified bundle configuration to attach to an end of an output fiber.
    Type: Application
    Filed: September 28, 2022
    Publication date: February 1, 2024
    Inventors: Ning LIU, Jeff GREGG, Gongwen ZHU, Xiang PENG, Guan SUN, Matthew KUTSURIS
  • Patent number: 11862923
    Abstract: As described herein, a mode field adapter (MFA) comprises a first fiber including a core associated with a fundamental mode field diameter and a cladding with a diameter that decreases toward a waist. The MFA comprises a second fiber including a core associated with a fundamental mode field diameter that matches the fundamental mode field of the first fiber at the waist and a cladding with a diameter that matches the diameter of the cladding of the first fiber at the waist and increases from the waist of the second fiber. The cladding of the first fiber may be adiabatically etched such that a core-to-cladding ratio of the first fiber changes over a length of the first fiber, and the core and the cladding of the second fiber may be adiabatically tapered such that a core-to-cladding ratio of the second fiber is constant over a length of the second fiber.
    Type: Grant
    Filed: February 1, 2022
    Date of Patent: January 2, 2024
    Assignee: Lumentum Operations LLC
    Inventors: Gongwen Zhu, Guan Sun
  • Publication number: 20230358963
    Abstract: A fiber combiner includes a capillary and a plurality of input fibers disposed within the capillary. A first portion of the capillary has a first non-zero slope profile along a first portion of an output end of the fiber combiner. A second portion of the capillary has a second non-zero slope profile along a second portion of the output end of the fiber combiner. The second non-zero slope profile is different than the first non-zero slope profile.
    Type: Application
    Filed: August 5, 2022
    Publication date: November 9, 2023
    Inventors: Gongwen ZHU, Guan SUN, Xiang PENG
  • Publication number: 20230161099
    Abstract: As described herein, a mode field adapter (MFA) comprises a first fiber including a core associated with a fundamental mode field diameter and a cladding with a diameter that decreases toward a waist. The MFA comprises a second fiber including a core associated with a fundamental mode field diameter that matches the fundamental mode field of the first fiber at the waist and a cladding with a diameter that matches the diameter of the cladding of the first fiber at the waist and increases from the waist of the second fiber. The cladding of the first fiber may be adiabatically etched such that a core-to-cladding ratio of the first fiber changes over a length of the first fiber, and the core and the cladding of the second fiber may be adiabatically tapered such that a core-to-cladding ratio of the second fiber is constant over a length of the second fiber.
    Type: Application
    Filed: February 1, 2022
    Publication date: May 25, 2023
    Inventors: Gongwen ZHU, Guan SUN