Patents by Inventor Guan-Syun TZENG

Guan-Syun TZENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin Composition, Prepreg, Metal-Clad Laminate, and Printed Circuit Board Using the Same
    Publication number: 20180312627
    Abstract: A resin composition is provided. The resin composition comprises an epoxy resin with at least two epoxy groups in each molecule, and a first hardener of the following formula (I): wherein R11, R12, R13, R14, R15, R16, and n are as defined in the specification.
    Type: Application
    Filed: August 2, 2017
    Publication date: November 1, 2018
    Inventors: Chih-Wei LIAO, Guan-Syun TZENG, Ju-Ming HUANG, Chang-Chien YANG