Abstract: A method for strengthening glass and a glass using the same are provided. The method for strengthening glass includes the following steps. Firstly, a glass substrate, which has a first surface and a second surface opposite to the first surface, is provided. Next, a barrier film is formed on at least one of the first surface and the second surface. Then, the glass substrate with the barrier film is immersed in a strengthening solution. The strengthening solution includes first ions, and the barrier film can limit the first ions in the quantity entering the glass substrate.

Abstract: A method for strengthening glass and a glass using the same are provided. The method for strengthening glass includes the following steps. Firstly, a glass substrate, which has a first surface and a second surface opposite to the first surface, is provided. Next, a barrier film is formed on at least one of the first surface and the second surface. Then, the glass substrate with the barrier film is immersed in a strengthening solution. The strengthening solution includes first ions, and the barrier film can limit the first ions in the quantity entering the glass substrate.

Abstract: A method for strengthening glass and a glass using the same are provided. The method for strengthening glass includes the following steps. Firstly, a glass substrate, which has a first surface and a second surface opposite to the first surface, is provided. Next, a barrier film is formed on at least one of the first surface and the second surface. Then, the glass substrate with the barrier film is immersed in a strengthening solution. The strengthening solution includes first ions, and the barrier film can limit the first ions in the quantity entering the glass substrate.

Abstract: A magnetron sputtering cathode mechanism includes a backing plate, a target, at least one magnetic component and at least one magnet. The backing plate has a first surface and a second surface opposite to the first surface. The first surface has at least one positioning recess, and the target has a bombarded surface and a non-bombarded surface opposite to the bombarded surface. The non-bombarded surface contacts with the first surface and has at least one combining recess. The magnetic component is disposed between the backing plate and the target and has a combining portion and a positioning portion. The combining portion is positioned in the combining recess, and the positioning portion is received in the positioning recess. The magnet is disposed at the second surface. The magnetic component is attracted to the corresponding magnet so as to fix the target at the backing plate.

Abstract: A magnetron sputtering cathode, comprising: a metal tube being hollow; and a plurality of magnet units, disposed inside the metal tube forming a plurality of sputtering zones on the surface of the metal tube, each of the sputtering zones corresponding to a substrate; wherein, each sputtering zone is provided with a magnetic tunnel and the magnetic tunnels are configured to communicate with each other to form a closed loop for guiding electrons to circulate therein. Thus, by the use of only one aforesaid magnetron sputtering cathode, multiple substrates can be coated at the same time, the waste related to plasma usage can be prevented to reduce power and target loss, and the same time that the probability of depositing the sputtered target on the portion of the sputtering chamber at the back of the magnetron sputtering cathode is reduced and thus the efficiency of the target is increased.

Abstract: A magnetron sputtering cathode mechanism includes a backing plate, a target, at least one magnetic component and at least one magnet. The backing plate has a first surface and a second surface opposite to the first surface. The first surface has at least one positioning recess, and the target has a bombarded surface and a non-bombarded surface opposite to the bombarded surface. The non-bombarded surface contacts with the first surface and has at least one combining recess. The magnetic component is disposed between the backing plate and the target and has a combining portion and a positioning portion. The combining portion is positioned in the combining recess, and the positioning portion is received in the positioning recess. The magnet is disposed at the second surface. The magnetic component is attracted to the corresponding magnet so as to fix the target at the backing plate.

Abstract: A sputtering target having at least one flat first sputtering surface and at least one second sputtering surfaces respectively and laterally abutted against the flat first sputtering surface and slanting in one direction relative to the first sputtering surface. By means of adjusting the position of the second sputtering surface related to the first sputtering surface and utilizing the differently slanted second sputtering surface of the sputtering target, the distribution of the thin film deposited on the surfaced of a substrate is relatively controlled and a uniform thickness of the thin film is obtained.